AVAGO HSMX-C265 3296 - 3/8 square trimpot trimming potentiometer Datasheet

HSMx-C120, HSMx-C177, HSMx-C197
and HSMx-C265
High Performance Chip LEDs
Data Sheet
Description
Features
These chip type LEDs utilize Aluminium Indium Galium
Phosphide (AlInGaP) material technology. The AlInGaP
material has a very high luminous efficiency, capable of
producing high light output over a wide range of drive
currents. The available colors in this surface mount series
are 592 nm Amber, 605 nm Orange, 626 nm Red and 639
nm Deep Red.
All packages are binned by both color and intensity, except for red and deep red color.
These ChipLEDs come either in low profile top emitting packages (HSMx-C177/C197), in a side emitting
package (HSMx-C120) or in a reverse mount package
(HSMx-C265). The right angle ChipLED is suitable for applications such as LCD back lighting. The top emitting
ChipLEDs with wide viewing angle are suitable for light
piping and direct backlighting of keypads and panels.
The reverse mount ChipLED is suitable for space saving.
In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per
reel for HSMx-C120/C177/C197 and 3000 units per reel
for HSMx-C265.
These packages are compatible with IR soldering process.
x High brightness AlInGaP material
x 0805 or 0603 industry standard footprint with 0.4
mm height for top emitting packages
x Also available in right angle emitting and reverse
mounting packages
x Diffused optics
x Operating temperature range of –40°C to +85°C
x Compatible with IR soldering
x Available in 4 colors
x Available in 8 mm tape on 7" diameter reel
x Reel sealed in zip locked moisture barrier bags
Applications
x
x
x
x
x
x
x
x
Membrane switch indicator
LCD backlighting
Push button backlighting
Front panel indicator
Symbol backlighting
Keypad backlighting
Microdisplays
Small message panel signage
Device Selection Guide
Dimensions (mm) [1,2]
Amber
Red
Orange
Deep Red
Package Description
1.6 x 1.0 x 0.6
HSMA-C120
HSMC-C120
HSML-C120
–
Untinted, Non-diffused
2.0 x 1.25 x 0.4
HSMA-C177
HSMC-C177
HSML-C177
HSMT-C177
Untinted, Diffused
1.6 x 0.8 x 0.4
HSMA-C197
HSMC-C197
HSML-C197
HSMT-C197
Untinted, Diffused
3.4 x 1.25 x 1.1
HSMA-C265
HSMC-C265
HSML-C265
HSMT-C265
Untinted, Non-diffused
CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMT-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01.
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
CATHODE MARK
CATHODE MARK
1.25
(0.049)
2.00 (0.079)
0.80
(0.031)
POLARITY
DIFFUSED EPOXY
1.60
(0.063)
0.40 (0.016)
POLARITY
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
PC BOARD
0.16 (0.006)
CATHODE LINE
CATHODE LINE
0.40 ± 0.15
(0.016 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
0.30 ± 0.15
(0.012 ± 0.006)
1.10 (0.043) MIN.
0.70 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C177
HSMx-C197
3.4 (0.134)
CATHODE
MARK (ETCHED)
LED DIE
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
LED DIE
1.25 (0.049)
0.3 (0.012)
1.6 (0.063)
GREEN SOLDER MASK
0.6 (0.024)
POLARITY
UNDIFFUSED
EPOXY
POLARITY
1.2
(0.047)
1.1 (0.043)
1.2 (0.047)
CLEAR EPOXY
1.1 (0.043)
PC BOARD
1.0 (0.039)
PC BOARD
0.3 (0.012)
0.5 (0.020)
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
SOLDERING
TERMINAL
HSMx-C265
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
CATHODE LINE
SOLDERING
TERMINAL
HSMx-C120
3 – 0.3 (0.012)
Absolute Maximum Ratings at TA = 25˚C
Parameter
HSMx-Cxxx
Units
DC Forward Current [1]
25
mA
Power Dissipation
60
mW
Reverse Voltage (IR = 100 μA)
5
V
LED Junction Temperature
95
˚C
Operating Temperature Range
–40 to +85
˚C
Storage Temperature Range
–40 to +85
˚C
Soldering Temperature
See reflow soldering profile (Figures 8 & 9)
Notes:
1. Derate linearly as shown in Figure 4.
Electrical Characteristics at TA = 25˚C
Forward Voltage
VF (Volts)
@ IF = 20 mA
Part Number
Typ.
Max.
Reverse Breakdown
VR (Volts)
@ IR = 100 μA
Capacitance C
(pF), VF = 0,
f = 1 MHz
Thermal
Resistance
RTJ–PIN (˚C/W)
Min.
Typ.
Typ.
HSMA-C120
1.9
2.4
5
11
400
HSMA-C177/197
1.9
2.4
5
11
300
HSMA-C265
1.9
2.4
5
11
550
HSMC-C120
1.9
2.4
5
15
400
HSMC-C177/197
1.9
2.4
5
15
300
HSMC-C265
1.9
2.4
5
15
550
HSML-C120
1.9
2.4
5
20
400
HSML-C177/197
1.9
2.4
5
20
300
HSML-C265
1.9
2.4
5
20
550
HSMT-C177/197
1.9
2.4
5
15
300
HSMT-C265
1.9
2.4
5
15
550
VF Tolerance: ± 0.1 V
3
Optical Characteristics at TA = 25˚C
Luminous
Intensity
IV (mcd)
@ 20 mA[1]
Part Number
Color
Min.
Typ.
Color,
Peak
Wavelength
Opeak (nm)
Dominant
Wavelength
Od[2] (nm)
Viewing
Angle
2 T1/2
Degrees[3]
Luminous
Efficacy
KV
(lm/w)
Typ.
Typ.
Typ.
Typ.
HSMA-C120
Amber
28.5
90
595
592
155
480
HSMA-C177/197
Amber
28.5
90
595
592
130
480
HSMA-C265
Amber
28.5
75
595
592
150
480
HSMC-C120
Red
28.5
90
637
626
155
155
HSMC-C177/197
Red
28.5
90
637
626
130
155
HSMC-C265
Red
28.5
75
637
626
150
155
HSML-C120
Orange
28.5
90
609
605
155
370
HSML-C177/197
Orange
28.5
90
609
605
130
370
HSML-C265
Orange
28.5
75
609
605
150
370
HSMT-C177/197
Deep Red
11.2
30
660
639
130
70
HSMT-C265
Deep Red
11.2
25
660
639
150
70
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
Color Bin Limits
Bin ID
Orange Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
Bin ID
Intensity (mcd)
Min.
Max.
A
597.0
600.0
A
0.11
0.18
B
600.0
603.0
B
0.18
0.29
C
603.0
606.0
C
0.29
0.45
D
606.0
609.0
D
0.45
0.72
E
609.0
612.0
E
0.72
1.10
F
612.0
615.0
F
1.10
1.80
Light Intensity (Iv) Bin Limits[1]
Tolerance: ± 1 nm
Bin ID
Amber Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
A
582.0
584.5
B
584.5
587.0
C
587.0
589.5
D
589.5
592.0
E
592.0
594.5
F
594.5
597.0
Tolerance: ± 1 nm
Red Color Bins [1]
1.80
2.80
H
2.80
4.50
J
4.50
7.20
K
7.20
11.20
L
11.20
18.00
M
18.00
28.50
N
28.50
45.00
P
45.00
71.50
Q
71.50
112.50
R
112.50
180.00
S
180.00
285.00
T
285.00
450.00
U
450.00
715.00
V
715.00
1125.00
W
1125.00
1800.00
X
1800.00
2850.00
Y
2850.00
4500.00
Tolerance: ± 15%
Dom. Wavelength (nm)
Bin ID
Min.
Max.
-
620.0
635.0
Tolerance: ±1 nm
Note:
1. Bin categories are established for classification of products. Products may not be available
in all categories. Please contact your Avago representative for information on currently
available bins.
5
G
Notes:
1. Bin categories are established for
classification of products. Products may
not be available in all categories. Please
contact your Avago representative for
information on currently available bins.
2. The Iv binning specification set-up is for
lowest allowable Iv binning only. There
are no upper Iv bin limits.
AS
DEEP
RED
70
AS
ORANGE
60
50
40
30
20
0
500
550
600
650
10
AS AlInGaP
1
1.0
0.8
AS AMBER
0.6
AS ORANGE, RED
and DEEP RED
0.4
0.2
0
5
10
15
Figure 2. Forward current vs. forward voltage.
20
HSMx-C120/177/197
15
HSMx-C265
10
RELATIVE INTENSITY
90
25
5
80
70
60
50
40
30
20
10
0
0
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
TA – AMBIENT TEMPERATURE – °C
10 20 30 40 50 60 70 80 90
ANGLE
Figure 4. Maximum forward current vs.
ambient temperature.
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C120.
6
25
30
Figure 3. Luminous intensity vs. forward current.
100
30
20
IF – FORWARD CURRENT – mA
VF – FORWARD VOLTAGE – V
WAVELENGTH – nm
1.2
0
0
1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3
700
Figure 1. Relative intensity vs. wavelength.
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
80
10
IF MAX – MAXIMUM FORWARD CURRENT – mA
1.4
100
AS
RED
AS
AMBER
90
IF – FORWARD CURRENT – mA
RELATIVE INTENSITY – %
100
RELATIVE INTENSITY – %
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C177/197.
RELATIVE INTENSITY – %
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative intensity vs. angle for HSMx-C265.
10 SEC. MAX.
TEMPERATURE
230°C MAX.
4°C/SEC. MAX.
140-160°C
4°C/SEC.
MAX.
TEMPERATURE
10 SEC. MAX.
217 C
200 C
255 - 260 C
3 C/SEC. MAX.
6 C/SEC. MAX.
150 C
3 C/SEC. MAX.
3°C/SEC. MAX.
60 SEC. MAX.
60 - 120 SEC.
OVER 2 MIN.
TIME
TIME
Figure 8. Recommended reflow soldering profile.
CENTERING
BOARD
Figure 9. Recommended Pb-free reflow soldering profile.
CENTERING
BOARD
0.8 (0.031
1.2 (0.047
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 10. Recommended soldering
pattern for HSMx-C177.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
7
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 11. Recommended soldering
pattern for HSMx-C197.
2.2 (0.087) DIA. PCB HO
0.4 (0.016)
0.4 (0.016)
0.7 (0.028)
1.25 (0.049
0.15 (0.006)
CENTERING
BOARD
0.8
(0.031)
1.2
(0.047)
1.4
(0.055)
0.8
(0.031)
Figure 12. Recommended soldering pattern for HSMx-C120.
2.3
(0.091)
1.4
(0.055)
Figure 13. Recommended soldering pattern for HSMx-C265.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 14. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.0
10.50 ± 1.0 (0.413 ± 0
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)6
PS
Figure 15. Reel dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
8
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.00
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
COVER TAPE
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
HSMx-C120
POSITION IN
CARRIER TAPE
PART NUMBER
HSMx-C120 SERIES
HSMx-C177 SERIES
HSMx-C197 SERIES
DIM. A
DIM. B
DIM. C
± 0.10 (0.004)
± 0.10 (0.004)
± 0.10 (0.004)
1.90 (0.075)1.15 (0.045)0.75 (0.030)
2.30 (0.091)1.40 (0.055)0.60 (0.024)
1.75 (0.069)0.95 (0.037)0.60 (0.024)
DIM. A
(SEE TABLE 1)
DIM. B
(SEE TABLE 1)
HSMx-C120
R 0.5 ± 0.05
(0.020 ± 0.002)
4.00 (0.157)
CATHODE
1.50 (0.059)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
HSMx-C265 SERIES
Figure 16. Tape dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
9
COVER TAPE
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
3.70 (0.146)
1.45 (0.057)
1.30 (0.051)
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 17. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
Storage Condition: 5 to 30°C @ 60% RH max.
Baking is required under the condition:
a) Humidity Indicator Card is >10% when read at 23 ± 5°C
b) Device exposed to factory conditions <30°C/60% RH more than 672 hours.
Baking recommended condition: 60 ± 5°C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0520EN
AV02-0975EN - May 5, 2010
Similar pages