HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-93140021 90V/1.0Ω, Hermetically Sealed, Power MOSFET Optocoupler Data Sheet Description Features The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and SMD 5962-9314001, 5962-9314002 are single-channel power MOSFET optocouplers, constructed in eight-pin, hermetic, dual-in-line, ceramic packages. The devices operate exactly like a solid-state relay. The products are capable of operation and storage over the full military temperature range and can be purchased as a commercial product (HSSR-7110), with full MIL-PRF-38534 Class H testing (HSSR-7111 and HSSR- 7112), with MIL-PRF-38534 Class E testing (Class K with exceptions) (HSSR-711E) or from the DLA Standard Microcircuit Drawing (SMD) 5962-93140. Details of the Class E program exceptions are listed here: 1. 2. 3. 4. 5. Nondestructive Bond Pull, Test method 2023 of MIL-STD-883 in device screening is not required. Particle Impact Noise Detection (PIND), Test method 2020 of MIL-STD-883 in device screening and group C testing is not required. Dual marked with device part number and DLA Standard Microcircuit Drawing (SMD) ac/dc signal and power switching Compact solid-state bidirectional switch Manufactured and tested on a MIL-PRF-38534 certified line QML-38534, Class H and Class E Hermetically sealed 8-pin, dual-in-line package Small size and weight Performance guaranteed over –55°C to +125°C Connection A 0.8A, 1.0Ω Connection B 1.6A, 0.25Ω 1500 Vdc withstand test voltage High transient immunity 5 Amp output surge current Applications Die Shear Strength, Test method 2019 of MIL-STD-883 in group B testing is not required. Internal Water Vapor Content, Test method 1018 of MIL-STD-883 in group C testing is not required. Scanning Electron Microscope (SEM) inspections, Test method 2018 of MIL-STD-883 in element evaluation is not required. Military and space High reliability systems Standard 28 Vdc and 48 Vdc load driver Standard 24 Vac load driver Aircraft controls ac/dc electromechanical and solid-state relay replacement I/O modules Harsh industrial environments CAUTION 1. See Selection Guide – Lead Configuration Options for available extensions. Broadcom -1- It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation that may be induced by ESD. HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Functional Diagrams Functional Diagrams CONNECTION A AC/DC CONNECTION CONNECTION B DC CONNECTION IO IO 1 NC 8 IF + 2 4 NC + 6 5 VO - 8 1 NC IF 7 VF - 3 The devices feature logic level input control and very low output on-resistance, making them suitable for both ac and dc loads. Connection A, as shown in the Functional Diagrams, allows the device to switch either ac or dc loads. Connection B, with the polarity and pin configuration as shown, allows the device to switch dc loads only. The advantage of Connection B is that the on-resistance is significantly reduced, and the output current capability increases by a factor of two. + 2 7 - 3 6 + VO - VF 4 NC The devices are convenient replacements for mechanical and solid-state relays where high component reliability with standard footprint lead configuration is desirable. Devices may be purchased with a variety of lead bend and plating options. See Selection Guide – Lead Configuration Options table for details. Standard microcircuit drawing (SMD) parts are available for each package and lead style. 5 TRUTH TABLE INPUT OUTPUT H CLOSED L OPEN All devices are manufactured and tested on a MIL-PRF-38534 certified line, and Class H and Class E devices are included in the DLA Qualified Manufacturers List, QML-38534 for Hybrid Microcircuits. Each device contains an AlGaAs light-emitting diode optically coupled to a photovoltaic diode stack, which drives two discrete power MOSFETs. The device operates as a solid-state replacement for single-pole, normally open (1 Form A) relay used for general-purpose switching of signals and loads in high reliability applications. The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, and SMD 5962-9314001, 5962-9314002 are designed to switch loads on 28 Vdc power systems. They meet 80V surge and ±600V spike requirements. CAUTION Maximum Switching Frequency – Care should be taken during repetitive switching of loads so as not to exceed the maximum output current, maximum output power dissipation, maximum case temperature, and maximum junction temperature. Selection Guide – Lead Configuration Options Avago Technologies Part Number and Options Commercial HSSR-7110 MIL-PRF-38534 Class H HSSR-7111 MIL-PRF-38534 Class E Gold Plate Standard Lead Finisha HSSR-7112 Gold Plate HSSR-711E Gold Plate Option -200 Solder Dippedb Option #200 Option -200 Butt Joint/Gold Platea Option #100 Option -100 Gull Wing/Solderedb Option #300 Option -300 Crew Cut/Gold Platea Option #600 Option -600 Gold Platea 59629314001HPC 59629314002HPC 59629314001EPC Solder Dippedb 9314001HPA 9314002HPA 9314001EPA Butt Joint/Gold Platea 9314001HYC 9314002HYC Butt Joint/Solderedb 9314001HYA 9314002HYA Gull Wing/Solderedb 9314001HXA 9314002HXA Crew Cut/Gold Platea 9314001HZC 9314002HZC Crew Cut/Solderedb 9314001HZA 9314002HZA SMD Part Number Prescript for all below a. Gold Plate lead finish: Maximum gold thickness of leads is <100 μin. Typical is 60 μin to 90 μin. b. Solder lead finish: Sn63/Pb37. Broadcom -2- ASSR-711E-300 HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Outline Drawing Outline Drawing Device Marking AVAGO DESIGNATOR AVAGO P/N DLA SMD[1] DLA SMD[1] PIN ONE/ ESD IDENT 8-Pin DIP Through Hole 10.03 (0.395) 10.29 (0.405) 1.02 (0.040) 1.52 (0.060) 8.13 (0.320) MAX. 7.16 (0.282 ) 7.57 (0.298 ) [1] A QYYWWZ XXXXXX XXXXXXX XXX XXX 50434 COMPLIANCE INDICATOR,[1] DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. AVAGO CAGE CODE[1] QML PARTS ONLY 4.32 (0.170 ) MAX. Thermal Resistance 0.51 (0.020) MIN. 3.81 (0.150 ) MIN. 0.20 (0.008 ) 0.33 (0.013 ) 7.36 (0.290) 7.87 (0.310) 0.51 (0.020 ) MAX. 2.29 (0.090) 2.79 (0.110) Maximum Output MOSFET Junction to Case – θJC = 15°C/W ESD Classification MIL-STD-883, Method 3015 , Class 2 NOTE: DIMENSIONS IN MILLIMETERS (INCHES). Hermetic Optocoupler Options Note: Dimensions in millimeters (inches). Option 100 Description Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial, Class H and E product. 4.32 (0.170) MAX. 0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110) 1.14 (0.045) 1.40 (0.055) 0.20 (0.008) 0.33 (0.013) 0.51 (0.020) MAX. 7.36 (0.290) 7.87 (0.310) 200 Lead finish is solder dipped rather than gold plated. This option is available on Commercial, Class H and E product. DLA Drawing (SMD) part numbers contain provisions for lead finish. 300 Surface-mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on Commercial, Class H and E product. This option has solder dipped leads. 4.57 (0.180) MAX. 0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110) 600 1.40 (0.055) 1.65 (0.065) 0.51 (0.020) MAX. 4.57 (0.180) MAX. 5˚ MAX. 0.20 (0.008) 0.33 (0.013) 9.65 (0.380) 9.91 (0.390) 1.07 (0.042) 1.31 (0.052) Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial, Class H and E product. 3.81 (0.150) MAX. 0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110) 0.20 (0.008) 0.33 (0.013) 1.02 (0.040) TYP. 7.36 (0.290) 7.87 (0.310) Broadcom -3- HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Absolute Maximum Ratings Absolute Maximum Ratings Parameter Symbol Min Max Unit Storage Temperature Range TS –65 +150 °C Operating Ambient Temperature TA –55 +125 °C Junction Temperature TJ — +150 °C Operating Case Temperaturea TC — +145 °C — 260 for 10 s °C IF — 20 mA Peak Repetitive Input Current (Pulse Width < 100 ms; duty cycle < 50%) IFPK — 40 mA Peak Surge Input Current (Pulse Width < 0.2 ms; duty cycle < 0.1%) IFPK surge — 100 mA Reverse Input Voltage VR — 5 V Average Output Current (See Figure 2.) Connection A Connection B IO — — 0.8 1.6 A A — — 5.0 10.0 A A –90 0 90 90 V V — 800 mW Lead Solder Temperature Average Input Current Single Shot Output Current (See Figure 3.) Connection A (Pulse width < 10 ms) Connection B (Pulse width < 10 ms) IOPK surge Output Voltage Connection A Connection B VO Average Output Power Dissipationb (See Figure 4.) a. Maximum junction to case thermal resistance for the device is 15°C/W, where case temperature, TC, is measured at the center of the package bottom. b. For rating, see Figure 4. The output power PO rating curve is obtained when the part is handling the maximum average output current IO as shown in Figure 2. Recommended Operating Conditions Parameter Symbol Min Max Unit Input Current (on)a IF(ON) 5 20 mA Input Current (on)b IF(ON) 10 20 mA Input Voltage (off ) VF(OFF) 0 0.6 V TA –55 +125 °C Operating Temperature a. Applies to HSSR-7112 and 5962-9314002Hxx devices only. b. Applies to HSSR-7110, HSSR-7111, HSSR-711E, 5962-9314001Hxx, and 5962-9314001Exx devices only. Broadcom -4- HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Electrical Specifications Electrical Specifications TA = –55°C to +125°C, unless otherwise specified. Parameter Output Withstand Voltage Output On-Resistance Connection A Output On-Resistance Connection B Output Leakage Current Input Forward Voltage Symbol Group A Subgroupa |VO(OFF)| 1, 2, 3 R(ON) 1, 2, 3 R(ON) 1, 2, 3 Max Unit Figure Note VF = 0.6V, IO = 10 μA 90 110 — V 5 IF = 10 mA, IO = 800 mA, (pulse duration ≤ 30 ms) — 0.40 1.0 Ω 6, 7 IF = 5 mA, IO = 800 mA, (pulse duration ≤ 30 ms) — — 1.0 IF = 10 mA, IO = 1.6A, (pulse duration ≤ 30 ms) — 0.12 0.25 IF = 5 mA, IO = 1.6A, (pulse duration ≤ 30 ms) — — 0.25 Ω 6, 7 10-4 10 μA 8 VF 1, 2, 3 IF = 10 mA 1.0 1.24 1.7 V 9 IF = 5 mA — — — IR = 100 μA 5.0 — — V RH ≤ 65%, t = 5s, VI-O = 1500 Vdc, TA = 25°C — — 1.0 μA IF = 10 mA, VDD = 28V, IO = 800 mA — 1.25 6.0 ms IF = 5 mA, VDD = 28V, IO = 800 mA — — 6.0 IF = 10 mA, VDD = 28V, IO = 800 mA — 0.02 0.25 IF = 5 mA, VDD = 28V, IO = 800 mA — — 0.25 1000 — — V/μs 17 500 — — V/μs 18 II-O 1 Turn On Time tON 9, 10, 11 tOFF dVo ---------dt dVio ----------dt 9, 10, 11 9 VPEAK = 50V, CM = 1000 pF, VDD = 5V, VI-O(PEAK) = 50V, e, f 1, 10, 11, 12, 13 ms 1, 10, 14, 15 Commercial parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD, Class H, and Class E parts receive 100% testing at 25°C, 125°C, and –55°C (subgroups 1 and 9, 2 and 10, 3 and 11, respectively). b. During the pulsed RON measurement (IO duration <30 ms), ambient (TA) and case temperature (TC) are equal. Applies to HSSR-7110, HSSR-7111, HSSR-711E, 5962-9314001Hxx and 5962-9314001Exx devices only. Applies to HSSR-7112 and 5962-9314002Hxx devices only. e. Device considered a two-terminal device: pins 1 through 4 shorted together and pins 5 through 8 shorted together. f. This is a momentary withstand test, not an operating condition. Broadcom -5- c d a. d. c d RL = 20 kΩ, CL = 15 pF c. c d CL = 15 pF, RM ≥ 1 MΩ 9 b, c b, d — Input-Output Insulation b, c b, d VF = 0.6V, VO = 90V 1, 2, 3 Input-Output Transient Rejection Typ 1, 2, 3 VR Output Transient Rejection Min IO(OFF) Input Reverse Breakdown Voltage Turn Off Time Test Conditions HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Typical Characteristics Typical Characteristics All typical values are at TA = 25°C, IF(ON) = 10 mA, VF(OFF) = 0.6V unless otherwise specified. Parameter Symbol Output Off-Capacitance CO(OFF) Output Offset Voltagea |VOS| Test Conditions VO = 28V, f = 1 MHz IF = 10 mA, IO = 0 mA ΔVF/ΔTA Input Diode Temperature Coefficient IF = 10 mA Typ Unit Figure 145 pF 16 2 μV 19 –1.4 mV/°C Input Capacitanceb CIN VF = 0V, f = 1 MHz 20 pF Input-Output Capacitancec CI-O VI-O = 0V, f = 1 MHz 1.5 pF Input-Output Resistancec RI-O VI-O = 500V, t = 60s 1013 Ω Turn On Time With Peakingd tON IFPK = 100 mA, IFSS = 10 mA, 0.22 ms VDD = 28V, IO = 800 mA a. VOS is a function of IF, and is defined between pins 5 and 8, with pin 5 as the reference. VOS must be measured in a stable ambient (free of temperature gradients). b. Zero-bias capacitance measured between the LED anode and cathode. c. Device considered a two-terminal device: pins 1 through 4 shorted together and pins 5 through 8 shorted together. d. For a faster turn-on time, the optional peaking circuit shown in Figure 1 can be implemented. Figure 1 Recommended Input Circuit HSSR-711x VCC (+5V) 1 8 + 2 VF - 3 7 6 4 5 IF R2 1200 : R1 330 : R3 C 15 μF IN 1/4 54ACTOO 1/4 54ACTOO* R1 = REQUIRED CURRENT LIMITING RESISTOR FOR I F (ON) = 10 mA. R2 = PULL-UP RESISTOR FOR V F (OFF) < 600 mV; I F (V CC - V OH) < 600 mV, OMIT R2. R3, C = OPTIONAL PEAKING CIRCUIT. TYPICAL VALUES * USE SECOND GATE IF I F (PK) > 50 mA REMINDER: TIE ALL UNUSED INPUTS TO GROUND OR V CC R3 (:) 330 100 33 IF (PK) (mA) 10 (NO PK) 20 40 100 Broadcom -6- HSSR-711x tON (ms) 2.0 1.0 0.48 0.22 1 HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Typical Characteristics Figure 2 Maximum Average Output Current Rating vs. Ambient Temperature Figure 3 Single Shot (Non-Repetitive) Output Current vs. Pulse Duration 1.0 12 IO P K S U R G E - O U T P U T C U R R E N T - A IO - OUTPUT CURRENT - A 0.8 0.6 0.4 0.2 0 -55 CONNECTION - A I F 10 mA CA = 40˚C/W CA = 80˚C/W -25 5 35 65 95 125 9 CONNECTION-B 8 7 6 5 CONNECTION-A 4 3 155 10 200 600 400 800 1000 PULSE DURATION - ms Figure 4 Output Power Rating vs. Ambient Temperature Figure 5 Normalized Typical Output Withstand Voltage vs. Temperature 1.0 1.10 V F = 0.6 V I O = 10 μA 1.08 0.8 NORMALIZED TYPICAL OUTPUT WITHSTAND VOLTAGE 1.06 0.6 0.4 0.2 0 -55 CONNECTION - A IF 10 mA CA = 40˚C/W CA = 80˚C/W -25 35 5 1.04 1.02 1.00 0.98 0.96 0.94 65 95 125 155 0.92 T A - AMBIENT TEMPERATURE - ˚C 1.8 1.6 5 35 0.8 CONNECTION - A I F 10 mA IO = 800 mA (PULSE DURATION 30 ms) 0.6 0.4 I O - OUTPUT CURRENT - A 1.2 1.0 0.8 5 35 65 95 125 CONNECTION - A IO 10 mA IO (PULSE DURATION 30 ms) 0.2 0 T A = 125˚C -0.2 T A = 25˚C -0.4 T A = -55˚C -0.6 -25 65 Figure 7 Typical On State Output I-V Characteristics 1.4 0.6 -55 -25 -55 T A - AMBIENT TEMPERATURE - ˚C Figure 6 Normalized Typical Output Resistance vs. Temperature NORMALIZED TYPICAL OUTPUT RESISTANCE 10 mA 10 T A - AMBIENT TEMPERATURE - ˚C P O - OUTPUT POWER DISSIPATION - W IF 11 95 -0.8 - 0 .6 125 -0.4 -0.2 0 0.2 V O - OUTPUT VOLTAGE - V T A - AMBIENT TEMPERATURE - ˚C Broadcom -7- 0.4 0 .6 HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Typical Characteristics Figure 8 Typical Output Leakage Current vs. Temperature Figure 9 Typical Input Forward Current vs. Input Forward Voltage 10 -1 CONNECTION A V F = 0.6 V V O = 90 V 10 -8 10 10 -2 I F - INPUT FORWARD CURRENT - A IO (OFF) - OUTPUT LEAKAGE CURRENT - A 10 -7 -9 10 -10 10 -11 10 -3 T A = 125˚C 10 -4 T A = -55˚C 10 20 35 65 95 125 T A = 25˚C 10 -5 -6 0.4 0 .6 0.8 1.0 1.2 1.4 1 .6 V F - INPUT FORWARD VOLTAGE - V T A - TEMPERATURE - ˚C Figure 10 Switching Test Circuit for tON, tOFF V DD 50% PULSE GEN. Z O = 50 tf = t r = 5 ns 50% IF P.W. = 15 ms IF VO RL HSSR-711x 90% 1 8 + 2 VF - 3 7 6 4 5 VO MONITOR NODE C L = 25 pF (C L INCLUDES PROBE AND FIXTURE CAPACITANCE) IF MONITOR 10% R (MONITOR) 200 tON tOFF GND GND Broadcom -8- HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Figure 11 Typical Turn On Time vs. Temperature Typical Characteristics Figure 12 Typical Turn On Time vs. Input Current 2.6 2.2 2.0 2.2 1.8 1.6 1.4 1.2 1.8 1.4 1.0 0.6 1.0 0.8 - 55 -25 CONNECTION A V DD = 28 V I O = 800 mA T A = 25˚C 2.6 T ON - TURN ON TIME - ms T ON - TURN ON TIME - ms 3.0 CONNECTION A I F = 10 mA V DD = 28 V I O = 800 mA 2.4 5 35 65 95 0.2 125 5 Figure 13 Typical Turn On Time vs. Voltage 14.6 1.2 1.0 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 60 70 CONNECTION A I F = 10 mA V DD = 28 V I O = 800 mA 14.8 T OFF - TURN OFF TIME - μs T ON - TURN ON TIME - ms 1.4 80 14.4 14.2 14.0 13.8 13.6 13.4 13.2 90 - 55 V DD - VOLTAGE - V 5 35 65 95 125 Figure 16 Typical Output Off Capacitance vs. Output Voltage 440 45 35 C O(OFF) - OUTPUT OFF CAPACITANCE - pF CONNECTION A V DD = 28 V I O = 800 mA T A = 25˚C 40 T OFF - TURN OFF TIME - μs -25 T A -TEMPERATURE - ˚C Figure 15 Typical Turn Off Time vs. Input Current 30 25 20 15 10 5 20 15.0 CONNECTION - A I F = 10 mA IO = 800 mA T A = 25˚C 1.6 15 Figure 14 Typical Turn Off Time vs. Temperature 2.0 1.8 10 I F - INPUT CURRENT - mA T A - TEMPERATURE - ˚C 5 10 15 360 320 280 240 200 160 120 20 I F - INPUT CURRENT - mA Broadcom -9- CONNECTION A f = 1 MHz T A = 25˚C 400 0 20 5 10 15 V O(OFF) - OUTPUT VOLTAGE - V 25 30 HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Typical Characteristics Figure 17 Output Transient Rejection Test Circuit HSSR-711x 1 8 + 2 VF - 3 7 6 4 5 VM MONITOR NODE IF INPUT OPEN CM + RM V PEAK - PULSE GENERATOR C M INCLUDES PROBE AND FIXTURE CAPACITANCE R M INCLUDES PROBE AND FIXTURE RESISTANCE 90% 90% V PEAK 10% 10% tr V M (MAX) tf 5V (0.8) V (PEAK) dV O = tr dt OR (0.8) V (PEAK) tf OVERSHOOT ON V PEAK IS TO BE 10%. Figure 18 Input-Output Transient Rejection Test Circuit V DD HSSR-711x IF S1 A 8 + 2 VF - 3 7 CL 6 (C L INCLUDES PROBE PLUS FIXTURE CAPACITANCE ) 4 5 V IN V I-O + PULSE GENERATOR 90% V I-O(PEAK) 10% 10% tf tr V O(OFF) S 1 AT A (VF = 0 V) V O(OFF) (min) 3.25 V V O(ON) (max) 0.8 V O(ON) S 1 AT B (I F = 10 mA)11 OR (I F = 5 mA)10 (0.8) V I-O(PEAK) dV I-O = OR dt tr VO 1 B 90% RL (0.8) VI-O(PEAK) tf OVERSHOOT ON V I-O(PEAK) IS TO BE 10% Broadcom - 10 - HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Applications Information Figure 19 Voltage Offset Test Setup Figure 21 Thermal Model ISOTHERMAL CHAMBER T je T jd T jf1 T jf2 HSSR-711x IF 104 8 + 1 + 2 7 - 3 6 15 15 15 TC DIGITAL NANOVOLTMETER V OS CA 4 5 - TA T je = LED JUNCTION TEMPERATURE T jf1 = FET 1 JUNCTION TEMPERATURE T jf2 = FET 2 JUNCTION TEMPERATURE T jd = FET DRIVER JUNCTION TEMPERATURE T C = CASE TEMPERATURE (MEASURED AT CENTER OF PACKAGE BOTTOM) T A = AMBIENT TEMPERATURE (MEASURED 6" AWAY FROM THE PACKAGE) CA = CASE-TO-AMBIENT THERMAL RESISTANCE Figure 20 Burn-In Circuit HSSR-711x 1 8 2 7 3 6 4 5 R OUT VO (SEE NOTE) 1.0 V IN 5.5 V R IN 200 ALL THERMAL RESISTANCE VALUES ARE IN ˚C/W R OUT 1.0 On-Resistance and Rating Curves NOTE: IN ORDER TO DETERMINE V OUT CORRECTLY, THE CASE TO AMBIENT THERMAL IMPEDANCE MUST BE MEASURED FOR THE BURN-IN BOARDS TO BE USED. THEN, KNOWING CA , DETERMINE THE CORRECT OUTPUT CURRENT PER FIGURES 2 AND 4 TO INSURE THAT THE DEVICE MEETS THE DERATING REQUIREMENTS AS SHOWN. Applications Information Thermal Model The steady-state thermal model for the HSSR-711x is shown in Figure 21. The thermal resistance values given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal resistances between the LED and other internal nodes are very large in comparison with the other terms and are omitted for simplicity. The components do, however, interact indirectly through θCA, the case-to-ambient thermal resistance. All heat generated flows through θCA, which raises the case temperature TC accordingly. The value of θCA depends on the conditions of the board design and is, therefore, determined by the designer. The maximum value for each output MOSFET junction-to-case thermal resistance is specified as 15°C/W. The thermal resistance from FET driver junction-to-case is also 15°C/W/W. The power dissipation in the FET driver, however, is negligible in comparison to the MOSFETs. The output on-resistance, RON, specified in this data sheet, is the resistance measured across the output contact when a pulsed current signal (IO = 800 mA) is applied to the output pins. The use of a pulsed signal (≤30 ms) implies that each junction temperature is equal to the ambient and case temperatures. The steady-state resistance, RSS, on the other hand, is the value of the resistance measured across the output contact when a DC current signal is applied to the output pins for a duration sufficient to reach thermal equilibrium. RSS includes the effects of the temperature rise of each element in the thermal model. Rating curves are shown in Figure 2 and Figure 4. Figure 2 specifies the maximum average output current allowable for a given ambient temperature. Figure 4 specifies the output power dissipation allowable for a given ambient temperature. Above 55°C (for θCA = 80°C/W) and 107°C (for θCA = 40°C/W/W), the maximum allowable output current and power dissipation are related by the expression RSS = PO(max)/ (IO(max))2 from which RSS can be calculated. Staying within the safe area assures that the steady-state junction temperatures remain less than 150°C. As an example, for TA = 95°C and θCA = 80°C/W, Figure 2 shows that the output current should be limited to less than 610 mA. A check with Figure 4 shows that the output power dissipation at TA = 95°C and IO = 610 mA, is limited to less than 0.35W. This yields an RSS of 0.94Ω. Broadcom - 11 - HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Data Sheet Design Considerations for Replacement of Electromechanical Relays Design Considerations for Replacement of Electromechanical Relays The HSSR-711x family can replace electromechanical relays with comparable output voltage and current ratings. The following design issues need to be considered in the replacement circuit. Input Circuit The drive circuit of the electromechanical relay coil needs to be modified so that the average forward current driving the LED of the HSSR-711x does not exceed 20 mA. A nominal forward drive current of 10 mA is recommended. A recommended drive circuit with 5V VCC and CMOS logic gates is shown in Figure 1. If higher VCC voltages are used, adjust the current limiting resistor to a nominal LED forward current of 10 mA. One important consideration to note is that when the LED is turned off, no more than 0.6V forward bias should be applied across the LED. Even a few microamps of current may be sufficient to turn on the HSSR- 711x, although it may take a considerable time. The drive circuit should maintain at least 5 mA of LED current during the ON condition. If the LED forward current is less than the 5 mA level, it causes the HSSR-711x to turn on with a longer delay. In addition, the power dissipation in the output power MOSFETs increases, which, in turn, may violate the power dissipation guidelines and affect the reliability of the device. Output Circuit Unlike with electromechanical relays, when considering solid-state relays, the designer should pay careful attention to the output on-resistance. The previous section, On-Resistance and Rating Curves, describes the issues that need to be considered. In addition, for strictly dc applications, the designer has an advantage using Connection B, which has twice the output current rating as Connection A. Furthermore, for dc-only applications, with Connection B the on-resistance is considerably less when compared to Connection A. Output over-voltage protection is yet another important design consideration when replacing electromechanical relays with the HSSR-711x. The output power MOSFETs can be protected using Metal oxide varistors (MOVs) or TransZorbs against voltage surges that exceed the 90V output withstand voltage rating. Examples of sources of voltage surges are inductive load kickbacks, lightning strikes, and electrostatic voltages that exceed the specifications on this data sheet. For more information on output load and protection, refer to Application Note 1047. References Broadcom - 12 - Application Note 1047, Low On-Resistance Solid State Relays for High Reliability Applications. Reliability Data for HSSR-7111, HSSR-7112, and HSSR-711E. For product information and a complete list of distributors, please go to our web site: www.broadcom.com. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom in the United States, certain other countries and/or the EU. Copyright © 2016 Broadcom. All Rights Reserved. The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. AV02-3835EN – November 11, 2016