SUTEX HV830 High voltage el lamp driver ic Datasheet

HV830
High Voltage EL Lamp Driver IC
Features
General Description
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The Supertex HV830 is a high-voltage driver designed for
driving EL lamps of up to 50nF. EL lamps greater than 50nF
can be driven for applications not requiring high brightness.
The input supply voltage range is from 2.0V to 9.5V. The device uses a single inductor and a minimum number of passive
components. The nominal regulated output voltage that is
applied to the EL lamp is ±100V. The chip can be enabled by
connecting the resistors on the RSW-Osc and REL-Osc pins
to the VDD pin, and disabled when connected to GND.
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Processed with HVCMOS® technology
2.0V to 9.5V operating supply voltage
DC to AC conversion
200V peak-to-peak typical output voltage
Large output load capability typically 50nF
Permits the use of high-resistance elastomeric lamp
components
Adjustable output lamp frequency to control lamp
color,lamp life, and power consumption
Adjustable converter frequency to eliminate harmonics
and optimize power consumption
Enable/disable function
Low current draw under no load condition
Very low standby current - 30nA typical
Applications
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Handheld personal computers
Electronic personal organizers
GPS units
Pagers
Cellular phones
Portable instrumentation
The HV830 has two internal oscillators, a switching MOSFET
and a high-voltage EL lamp driver. The frequency of the
switching converter MOSFET is set by an external resistor
connected between the RSW-Osc and the VDD pins. The EL
lamp driver frequency is set by an external resistor connected
between the REL-Osc and the VDD pins. An external inductor
is connected between the LX and VDD pins. A 0.01µF to 0.1µF
capacitor is connected between the CS pin and the GND. The
EL lamp is connected between the VA and VB pins.
The switching MOSFET charges the external inductor and
discharges it into the CS capacitor. The voltage at CS will start
to increase. Once the voltage at CS reaches a nominal value
of 100V, the switching MOSFET is turned OFF to conserve
power. The output pins VA and VB are configured as an Hbridge and are switched in opposite states to achieve 200V
peak-to-peak across the EL lamp.
Block Diagram
LX
VDD
CS
RSW-Osc
ENABLE
Switch
Osc
Q
VA
GND
+
Disable
C
Q
_
VREF
Output
Osc
Q
VB
REL-Osc
Q
HV830
Ordering Information
Package Option
Device
HV830
Pin Configuration
8-Lead SOIC
HV830LG
VDD
1
8
REL-Osc
RSW-Osc
2
7
VA
CS
3
6
VB
LX
4
5
GND
HV830LG-G
-G indicates the package is RoHS compliant - “Green”
8-Lead SOIC
(top view)
Product Marking
Absolute Maximum Ratings
Parameter
Value
HV830
Supply voltage, VDD
-0.5 to +10V
LLLL
Output voltage, VCS
-0.5 to +120V
Power dissipation
Storage temperature
Y = Last Digit of Year Sealed
WW = Week Sealed
L = Lot Number
= “Green” Packaging
YWW
400mW
-65OC to +150OC
Operating temperature
-25OC to +85OC
Absolute Maximum Ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions is not implied. Continuous
operation of the device at the absolute rating level may affect device reliability. All
voltages are referenced to device ground.
Recommended Operating Conditions
Symbol Parameter
VDD
Supply voltage
fEL
VA-B output drive frequency
TA
Operating temperature
DC Electrical Characteristics (V
IN
VCS
VA - VB
Typ
Max
Unit
2.0
-
9.5
V
---
-
-
1.5
KHz
---
-25
-
+85
O
C
Conditions
---
= 3.0V, RSW = 1.0MΩ, REL = 3.3MΩ, TA = 25°C unless otherwise specified)
Symbol Parameter
RDS(ON)
Min
Min
Typ
Max
Unit
-
2.0
4.0
Ω
I = 100mA
Output voltage - regulation
90
100
110
V
VDD = 2.0V to 9.5V
Output peak-to-peak voltage
180
200
220
V
VDD = 2.0V to 9.5V
ON resistance of switching transistor
Conditions
IDDQ
Quiescent VDD current - diabled
-
30
-
nA
RSW-Osc = Low
IDD
VDD supply current
-
100
150
µA
VDD = 3.0V. See Fig.1
IIN
Input current including inductor current
-
35
40
mA
VDD = 3.0V. See Fig.1
VCS
Output voltage on VCS
-
95
-
V
VDD = 3.0V. See Fig.1
fEL
VA - VB output drive frequency
220
250
280
Hz
VDD = 3.0V. See Fig.1
fSW
Inductor switching frequency
55
65
75
KHz
VDD = 3.0V. See Fig.1
D
Switching transistor duty cycle
-
88
-
%
2
---
HV830
Fig.1: Test Circuit, VIN = 3.0V
ON = VDD
OFF = 0V
3.3MΩ
1
VDD
REL-Osc
2
RSW-Osc
VA
7
3
CS
VB
6
4
LX
GND
5
8
1.0MΩ
220µH1
VDD = VIN = 3.0V
BAS21LT1
0.1µF2
0.01µF
200V
1nF
3.0 square inch lamp.
HV830
Notes:
1. Murata part # LQH4N221K04 (DC resistanve < 5.4Ω).
2. Larger values may be required depending upon supply impedence.
Enable/Disable Configuration
The HV830 can be easily enabled and disabled via a logic control signal on the RSW and REL resistors as shown in Fig.4
below. The control signal can be from a microprocessor. RSW and REL are typically very high values, therefore, only 10’s of
microamperes will be drawn from the logic signal when it is at a logic high (enable) state. When the microprocessor signal
is high the device is enabled and when the signal is low, it is disabled.
Fig. 2: Enable/Disable Configuration
ON =VDD
Remote Enable
REL
OFF = 0V
1
VDD
REL-Osc
2
RSW-Osc
VA
7
3
CS
VB
6
4
LX
GND
5
8
RSW
LX
+
VIN = VDD
BAS21LT1
4.7µF
15V
CS
200V
1.0nF
Enable/Disable Table
RSW Resistor
HV830
VDD
Enable
0V
Disable
3
HV830
EL Lamp
HV830
Fig. 3 Split Supply Configuration
Remote
Enable
ON = VDD
OFF = 0V
REL
VDD = Regulated
Voltage
1
VDD
REL-Osc
2
RSW-Osc
8
RSW
LX
VA
7
EL Lamp
+
VIN = Battery
Voltage
3
CS
VB
6
4
LX
GND
5
BAS21LT1
–
0.1µF*
HV830
CS
200V
1nF
* Larger values may be required depending upon supply impedence.
Split Supply Configuration Using a Single Cell (1.5V) Battery
The HV830 can also be used for handheld devices operating
from a single cell 1.5V battery where a regulated voltage is
available. This is shown in Fig. 3. The regulated voltage can
be used to run the internal logic of the HV830. The amount of
current necessary to run the internal logic is typically 100µA
at a VDD of 3.0V. Therefore, the regulated voltage could easily
provide the current without being loaded down. The HV830
used in this configuration can also be enabled/disabled via
logic control signal on the RSW and REL resistors as shown
in Fig.2.
Split Supply Configuration for Battery Voltages of Higher than 9.5V
Fig. 3 can also be used with high battery voltages, such as
12V, as long as the input voltage, VDD, to the HV830 device
is within its specifications of 2.0V to 9.5V.
4
HV830
External Component Description
External
Component
Description
Diode
Fast reverse recovery diode, BAS21LT1 or equivalent.
CS Capacitor
0.01µF to 0.1µF, 200V capacitor to GND is used to store the energy transferred from the inductor.
REL-Osc
The EL lamp frequency is controlled via an external REL resistor connected between REL-Osc and VDD
pins of the device. The lamp frequency increases as REL decreases. As the EL lamp frequency increases,
the amount of current drawn from the battery will increase and the output voltage VCS will decrease. The
color of the EL lamp is dependent upon its frequency.
A 3.3MΩ resistor would provide lamp frequency of 220 to 280Hz. Decreasing the REL-Osc by a factor of 2 will
increase the lamp frequency by a factor of 2.
RSW-Osc
The switching frequency of the converter is controlled via an external resistor, RSW between the RSW-Osc
and VDD pins of the device. The switching frequency increases as RSW decreases. With a given inductor,
as the switching frequency increases, the amount of current drawn from the battery will decrease and the
output voltage, VCS, will also decrease.
A 1nF capacitor is recommended between the RSW-Osc pin and GND when a 0.01µF CS capacitor is used.
This capacitor is used to shunt any switching noise that may couple into the RSW-Osc pin. The CSW capaciCSW Capacitor
tor may also be needed when driving large EL lamp due to increase in switching noise. A CSW larger than
1.0nF is not recommended.
LX Inductor
The inductor LX is used to boost the low input voltage by inductive flyback. When the internal switch is
on, the inductor is being charged. When the internal switch is off, the charge stored in the inductor will be
transferred to the high voltage capacitor CS. The energy stored in the capacitor is connected to the internal
H-bridge and therefore to the EL lamp. In general, smaller value inductors, which can handle more current,
are more suitable to drive larger size lamps. As the inductor value decreases, the switching frequency of
the inductor (controlled by RSW) should be increased to avoid saturation.
220µH Murata inductors with 5.4Ω series DC resistance is typically recommended. For inductors with the
same inductance value but with lower series DC resistance, lower RSW value is needed to prevent high current draw and inductor saturation.
Lamp
As the EL lamp size increases, more current will be drawn from the battery to maintain high voltage across
the EL lamp. The input power, (VIN x IIN), will also increase. If the input power is greater than the power dissipation of the package (400mW), an external resistor in series with one side of the lamp is recommended
to help reduce the package power dissipation.
5
HV830
8-Lead SOIC (Narrow Body) Package Outline (LG)
4.9x3.9mm body, 1.75mm height (max), 1.27mm pitch
D
θ1
8
E
E1
L2
Note 1
(Index Area
D/2 x E1/2)
L
1
θ
L1
Top View
Gauge
Plane
Seating
Plane
View B
A
View B
Note 1
h
h
A2
A
Seating
Plane
b
e
A1
A
Side View
View A-A
Note 1:
This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either a
mold, or an embedded metal or marked feature.
Symbol
A
MIN
Dimension
(mm)
1.35
A1
0.10
A2
1.25
b
0.31
D
4.80
E
E1
5.80
e
3.80
NOM
-
-
-
-
4.90
6.00
3.90
MAX
1.75
0.25
1.50
0.51
5.00
6.20
4.00
h
0.25
1.27
BSC
L
L1
L2
0.40
-
-
0.50
1.27
θ
0
1.04
REF
0.25
BSC
O
θ1
5O
-
-
8O
15O
JEDEC Registration MS-012, Variation AA, Issue E, Sept. 2005.
Drawings not to scale.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Doc. # DSFP-HV830
C081507
6
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