ILSI I324-1O5-20.000 Leaded oscillator, tcxo, tcvcxo metal package, full size dip Datasheet

I123/I124/I323/I324 Series
Leaded Oscillator, TCXO, TCVCXO
Metal Package, Full Size DIP
Product Features:
Applications:
Available in Both Clipped Sinewave and
HCMOS Output Levels
Compatible with Leadfree Processing
Base Station
IP
WiMax/Wlan
General Purpose
Frequency
I123/I323
I124/I324
9.600 Mhz to 40 Mhz
1.000 Mhz to 40 Mhz
Output Level
Clipped Sinewave
HCMOS
1.0 V p-p Min.
‘0’=0.1 VCC Max., ‘1’=0.9Vcc Min.
Output Load
Clipped Sinewave
HCMOS
20K Ohms / 10 pF
15pF
Duty Cycle (HCMOS)
50% ±10%
Rise / Fall Time
(HCMOS)
Frequency Stability
10 nS Max.
Frequency Tolerance @ 25 C
Included in Stability Tolerance
18.3
11.7
1.0
4.0 Min.
9.0 Max.
See Frequency Stability Table
0.50
4.0
2.5
0.45
Aging
 1 ppm / Year Max.
Supply Voltage
See Supply Voltage Table , tolerance  5%
Current
3.0 mA Max. (Clipped Sinewave)
15.00
20.0 mA Max. (HCMOS)
Voltage Control
( I321/ I322)
7.60
1.65 VDC  1.5 VDC,  5.0 ppm Min. for Vcc = 3.3 VDC
2.5 VDC  2.0 VDC,  5.0 ppm Min. for Vcc = 5.0 VDC
Slope
Positive
Operating
See Operating Temperature Table
Storage
-40 C to +85 C
Pin
1
7
8
14
Connection
Vcontrol / N.C.
GND
Output
Vcc
Dimension Units: mm
Package
I123 (Clipped Sinewave TCXO)
I124 (HCMOS TCXO)
I323 (Clipped Sinewave TCVCXO)
I324 (HCMOS TCVCXO)
Part Number Guide
Operating Temperature
Sample Part Number: I123-1Q3-20.000 Mhz
FrequencyStability vs Temperature
Supply
Voltage
7 = 0 C to +50 C
**O = 1.5 ppm
3 = 3.3 V
1 = 0 C to +70 C
**P = 2.0 ppm
5 = 5.0 V
3 = -20 C to +70 C
Q = 2.5 ppm
2 = -40 C to +85 C
R = 3.0 ppm
J = 5.0 ppm
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/10_B
Specifications subject to change without notice
Page 1
Frequency
- 20.000 MHz
I123/I124/I323/I324 Series
Leaded Oscillator, TCXO, TCVCXO
Metal Package, Full Size DIP
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 2a
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: IXXX-XXX (Part Number detail = IXXX-XXX-Freq.)
Line 3: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/10_B
Specifications subject to change without notice
Page 2
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