IDT IDT72V261LA 3.3 volt cmos supersync fifo Datasheet

3.3 VOLT CMOS SuperSync FIFO™
16,384 x 9
32,768 x 9
FEATURES:
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Choose among the following memory organizations:
IDT72V261LA
—
16,384 x 9
IDT72V271LA
—
32,768 x 9
Pin-compatible with the IDT72V281/72V291 and IDT72V2101/
72V2111SuperSync FIFOs
Functionally compatible with the 5 Volt IDT72261/72271 family
10ns read/write cycle time (6.5ns access time)
Fixed, low first word data latency time
5V input tolerant
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Retransmit operation with fixed, low first word data
latency time
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag
can default to one of two preselected offsets
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IDT72V261LA
IDT72V271LA
Program partial flags by either serial or parallel means
Select IDT Standard timing (using EF and FF flags) or First
Word Fall Through timing (using OR and IR flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
Independent Read and Write clocks (permit reading and writing
simultaneously)
Available in the 64-pin Thin Quad Flat Pack (TQFP) and the 64pin Slim Thin Quad Flat Pack (STQFP)
High-performance submicron CMOS technology
Industrial temperature range (–40°°C to +85°°C) is available
DESCRIPTION:
The IDT72V261LA/72V271LA are functionally compatible versions of
the IDT72261/72271 designed to run off a 3.3V supply for very low power
consumption. The IDT72V261LA/72V271LA are exceptionally deep, high
speed, CMOS First-In-First-Out (FIFO) memories with clocked read and
FUNCTIONAL BLOCK DIAGRAM
WEN
D0 -D8
WCLK
LD SEN
INPUT REGISTER
OFFSET REGISTER
FLAG
LOGIC
WRITE CONTROL
LOGIC
RAM ARRAY
16,384 x 9
32,768 x 9
WRITE POINTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
READ POINTER
READ
CONTROL
LOGIC
RT
OUTPUT REGISTER
MRS
PRS
RESET
LOGIC
RCLK
REN
OE
Q0 -Q8
4673 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
APRIL 2002
1
 2002 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
DSC-4673/2
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
SuperSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to
buffer large amounts of data.
The input port is controlled by a Write Clock (WCLK) input and a Write
Enable (WEN) input. Data is written into the FIFO on every rising edge of
WCLK when WEN is asserted. The output port is controlled by a Read
Clock (RCLK) input and Read Enable (REN) input. Data is read from the
FIFO on every rising edge of RCLK when REN is asserted. An Output
Enable (OE) input is provided for three-state control of the outputs.
The frequencies of both the RCLK and the WCLK signals may vary from
0 to fMAX with complete independence. There are no restrictions on the
frequency of one clock input with respect to the other.
DESCRIPTION (CONTINUED)
write controls. These FIFOs offer numerous improvements over previous
SuperSync FIFOs, including the following:
• The limitation of the frequency of one clock input with respect to the
other has been removed. The Frequency Select pin (FS) has been
removed, thus it is no longer necessary to select which of the two clock
inputs, RCLK or WCLK, is running at the higher frequency.
• The period required by the retransmit operation is now fixed and short.
• The first word data latency period, from the time the first word is written
to an empty FIFO to the time it can be read, is now fixed and short.
(The variable clock cycle counting delay associated with the latency
period found on previous SuperSync devices has been eliminated on
this SuperSync family.)
RCLK
REN
RT
OE
EF/OR
VCC
PAE
MRS
LD
FWFT/SI
GND
FF/IR
PAF
HF
WCLK
PRS
PIN CONFIGURATIONS
PIN 1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
WEN
SEN
DC(1)
VCC
VCC
GND(2)
GND(2)
GND(2)
GND(2)
GND(2)
GND(2)
GND(2)
GND(2)
GND(2)
D8
D7
1
2
3
4
5
6
7
8
9
10
11
12
13
48
47
46
45
44
43
42
41
40
39
38
14
15
16
35
34
33
37
36
DNC(3)
DNC(3)
GND
DNC(3)
DNC(3)
VCC
DNC(3)
DNC(3)
DNC(3)
GND
DNC(3)
DNC(3)
Q8
Q7
Q6
GND
Q3
VCC
Q4
Q5
GND
Q0
Q1
GND
Q2
D1
D0
D5
D4
D3
D2
D6
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
TQFP (PN64-1, ORDER CODE: PF)
STQFP (PP64-1, ORDER CODE: TF)
TOP VIEW
NOTES:
1. DC = Don’t Care. Must be tied to GND or VCC, cannot be left open.
2. This pin may either be tied to ground or left open.
3. DNC = Do Not Connect.
2
4673 drw 02
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
For serial programming, SEN together with LD on each rising edge of
WCLK, are used to load the offset registers via the Serial Input (SI). For
parallel programming, WEN together with LD on each rising edge of WCLK,
are used to load the offset registers via Dn. REN together with LD on each
rising edge of RCLK can be used to read the offsets in parallel from Qn
regardless of whether serial or parallel offset loading has been selected.
During Master Reset (MRS) the following events occur: The read and
write pointers are set to the first location of the FIFO. The FWFT pin
selects IDT Standard mode or FWFT mode. The LD pin selects either a
partial flag default setting of 127 with parallel programming or a partial flag
default setting of 1,023 with serial programming. The flags are updated
according to the timing mode and default offsets selected.
The Partial Reset (PRS) also sets the read and write pointers to the first
location of the memory. However, the timing mode, partial flag programming method, and default or programmed offset settings existing before
Partial Reset remain unchanged. The flags are updated according to the
timing mode and offsets in effect. PRS is useful for resetting a device in
mid-operation, when reprogramming partial flags would be undesirable.
The Retransmit function allows data to be reread from the FIFO more
than once. A LOW on the RT input during a rising RCLK edge initiates a
retransmit operation by setting the read pointer to the first location of the
memory array.
If, at any time, the FIFO is not actively performing an operation, the chip
will automatically power down. Once in the power down state, the standby
supply current consumption is minimized. Initiating any operation (by activating control inputs) will immediately take the device out of the power
down state.
The IDT72V261LA/72V271LA are fabricated using IDT’s high speed
submicron CMOS technology.
DESCRIPTION (CONTINUED)
There are two possible timing modes of operation with these devices:
IDT Standard mode and First Word Fall Through (FWFT) mode.
In IDT Standard mode, the first word written to an empty FIFO will not
appear on the data output lines unless a specific read operation is
performed. A read operation, which consists of activating REN and
enabling a rising RCLK edge, will shift the word from internal memory to
the data output lines.
In FWFT mode, the first word written to an empty FIFO is clocked
directly to the data output lines after three transitions of the RCLK signal. A
REN does not have to be asserted for accessing the first word. However,
subsequent words written to the FIFO do require a LOW on REN for
access. The state of the FWFT/SI input during Master Reset determines
the timing mode in use.
For applications requiring more data storage capacity than a single
FIFO can provide, the FWFT timing mode permits depth expansion by
chaining FIFOs in series (i.e. the data outputs of one FIFO are connected
to the corresponding data inputs of the next). No external logic is required.
These FIFOs have five flag pins, EF/OR (Empty Flag or Output Ready),
FF/IR (Full Flag or Input Ready), HF (Half-full Flag), PAE (Programmable
Almost-Empty flag) and PAF (Programmable Almost-Full flag). The EF
and FF functions are selected in IDT Standard mode. The IR and OR
functions are selected in FWFT mode. HF, PAE and PAF are always
available for use, irrespective of timing mode.
PAE and PAF can be programmed independently to switch at any point
in memory. (See Table 1 and Table 2.) Programmable offsets determine
the flag switching threshold and can be loaded by two methods: parallel or
serial. Two default offset settings are also provided, so that PAE can be
set to switch at 127 or 1,023 locations from the empty boundary and the
PAF threshold can be set at 127 or 1,023 locations from the full boundary.
These choices are made with the LD pin during Master Reset.
PARTIAL RESET (PRS)
MASTER RESET (MRS)
WRITE CLOCK (WCLK)
READ CLOCK (RCLK)
WRITE ENABLE (WEN)
READ ENABLE (REN)
OUTPUT ENABLE (OE)
LOAD (LD)
DATA OUT (Q0 - Qn)
DATA IN (D0 - Dn)
SERIAL ENABLE(SEN)
FIRST WORD FALL THROUGH/SERIAL INPUT
(FWFT/SI)
IDT
72V261LA
72V271LA
RETRANSMIT (RT)
EMPTY FLAG/OUTPUT READY (EF/OR)
PROGRAMMABLE ALMOST-EMPTY (PAE)
FULL FLAG/INPUT READY (FF/IR)
HALF FULL FLAG (HF)
PROGRAMMABLE ALMOST-FULL (PAF)
4673 drw 03
Figure 1. Block Diagram of Single 16,384 x 9 and 32,768 x 9 Synchronous FIFO
3
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN DESCRIPTION
Symbol
Name
I/O
Description
D0–D8
MRS
Data Inputs
Master Reset
I
I
Data inputs for a 9-bit bus.
MRS initializes the read and write pointers to zero and sets the output register to all zeroes.
During Master Reset, the FIFO is configured for either FWFT or IDT Standard mode, one of
two programmable flag default settings, and serial or parallel programming of the offset settings.
PRS initializes the read and write pointers to zero and sets the output register to all zeroes.
During Partial Reset, the existing mode (IDT or FWFT), programming method (serial or parallel),
and programmable flag settings are all retained.
PRS
Partial Reset
I
RT
Retransmit
I
RT asserted on the rising edge of RCLK initializes the READ pointer to zero, sets the EF flag to
LOW (OR to HIGH in FWFT mode) temporarily and does not disturb the write pointer, programming
method, existing timing mode or programmable flag settings. RT is useful to reread data from the first
physical location of the FIFO.
FWFT/SI
First Word Fall
Through/Serial In
I
During Master Reset, selects First Word Fall Through or IDT Standard mode. After Master Reset,
this pin functions as a serial input for loading offset registers
WCLK
Write Clock
I
WEN
Write Enable
I
When enabled by WEN, the rising edge of WCLK writes data into the FIFO and offsets into the
programmable registers for parallel programming, and when enabled by SEN, the rising edge of
WCLK writes one bit of data into the programmable register for serial programming.
WEN enables WCLK for writing data into the FIFO memory and offset registers.
RCLK
Read Clock
I
When enabled by REN, the rising edge of RCLK reads data from the FIFO memory and offsets
from the programmable registers.
REN
OE
Read Enable
Output Enable
I
I
REN enables RCLK for reading data from the FIFO memory and offset registers.
OE controls the output impedance of Qn.
SEN
LD
Serial Enable
Load
I
I
SEN enables serial loading of programmable flag offsets.
During Master Reset, LD selects one of two partial flag default offsets (127 or 1,023) and determines
the flag offset programming method, serial or parallel. After Master Reset, this pin enables writing to
and reading from the offset registers.
DC
FF/IR
Don't Care
Full Flag/
Input Ready
I
O
EF/OR
Empty Flag/
Output Ready
O
PAF
Programmable
Almost-Full Flag
O
This pin must be tied to either VCC or GND and must not toggle after Master Reset.
In the IDT Standard mode, the FF function is selected. FF indicates whether or not the FIFO
memory is full. In the FWFT mode, the IR function is selected. IR indicates whether or not there
is space available for writing to the FIFO memory.
In the IDT Standard mode, the EF function is selected. EF indicates whether or not the FIFO
memory is empty. In FWFT mode, the OR function is selected. OR indicates whether or not
there is valid data available at the outputs.
PAF goes LOW if the number of words in the FIFO memory is more than total word capacity of
the FIFO minus the full offset value m, which is stored in the Full Offset register. There are two
possible default values for m: 127 or 1,023.
PAE
Programmable
Almost-Empty Flag
O
PAE goes LOW if the number of words in the FIFO memory is less than offset n, which is stored
in the Empty Offset register. There are two possible default values for n: 127 or 1,023. Other values
for n can be programmed into the device.
HF
Q0–Q8
Half-Full Flag
Data Outputs
O
O
HF indicates whether the FIFO memory is more or less than half-full.
Data outputs for a 9-bus
VCC
GND
Power
Ground
+3.3 Volt power supply pins.
Ground pins.
4
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
ABSOLUTE MAXIMUM RATINGS
Symbol
VTERM
Rating
Terminal Voltage
with respect to GND
Commercial
–0.5 to +5
TSTG
Storage
Temperature
–55 to +125
°C
IOUT
DC Output Current
–50 to +50
mA
RECOMMENDED DC OPERATING
CONDITIONS
Unit
V
Symbol
Min.
Typ.
Max.
VCC
Supply Voltage (Com’l/Ind’l)
3.0
3.3
3.6
V
Supply Voltage (Com’l/Ind’l)
0
0
0
V

5.0
V
VIH
Input High Voltage (Com’l/Ind’l)
2.0
VIL
Input Low Voltage (Com’l/Ind’l)


0.8
V
TA
Operating Temperature
Commercial
0

70
°C
TA
Operating Temperature
Industrial
0

85
°C
NOTE:
1. 1.5V undershoots are allowed for 10ns once per cycle.
DC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 3.3V ± 03.V, TA = 0°C to + 70°C; Industrial: VCC = 3.3V ± 03.V, TA = -40°C to +85°C)
IDT72V261LA
IDT72V271LA
Commercial & Industrial(1)
tCLK = 10, 15, 20 ns
Symbol
Parameter
Min.
Max.
Unit
ILI
ILO(3)
Input Leakage Current
Output Leakage Current
–1
–10
1
10
µA
µA
VOH
VOL
Output Logic “1” Voltage, IOH = –2 mA
Output Logic “0” Voltage, IOL = 8 mA
2.4
—
—
0.4
V
V
ICC1(4,5,6)
Active Power Supply Current
—
55
mA
Standby Current
—
20
mA
(2)
(4,7)
ICC2
NOTES:
1. Industrial temperature range product for 15ns speed grade is available as a standard device. All other speed grades are available by special order.
2. Measurements with 0.4 ≤ VIN ≤ VCC.
3. OE ≥ VIH, 0.4 ≤ VOUT ≤ VCC.
4. Tested with outputs disabled (I OUT = 0).
5. RCLK and WCLK toggle at 20 MHz and data inputs switch at 10 MHz.
6. Typical ICC1 = 10 + 0.95*fS + 0.02*CL*fS (in mA) with V CC = 3.3V, tA = 25°C, fS = WCLK frequency = RCLK frequency (in MHz, using TTL levels), data switching at fS/2,
CL = capacitive load (in pF).
7. All Inputs = V CC - 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz.
CAPACITANCE
(TA = +25°C, f = 1.0MHz)
Symbol
Parameter(1)
Conditions
Max.
Unit
(2)
Input
Capacitance
VIN = 0V
10
pF
COUT(1,2)
Output
Capacitance
VOUT = 0V
10
pF
CIN
NOTES:
1. With output deselected, (OE ≥ VIH).
2. Characterized values, not currently tested.
5
Unit
GND
(1)
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
Parameter
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS(1)
(Commercial: VCC = 3.3V ± 0.3V, TA = 0°C to +70°C; Industrial: VCC = 3.3V ± 0.3V, TA = -40°C to +85°C)
Commercial
IDT72V261LA10
IDT72V271LA10
Symbol
Parameter
Com’l & Ind’l(2)
IDT72V261LA15
IDT72V271LA15
Commercial
IDT72V261LA20
IDT72V271LA20
Min.
Max.
Min.
Max.
Min.
Max.
Unit
fS
Clock Cycle Frequency
—
100
—
66.7
—
50
MHz
tA
Data Access Time
2
6.5
2
10
2
12
ns
t CLK
Clock Cycle Time
10
—
15
—
20
—
ns
t CLKH
Clock High Time
4.5
—
6
—
8
—
ns
t CLKL
Clock Low Time
4.5
—
6
—
8
—
ns
t DS
Data Setup Time
3
—
4
—
5
—
ns
t DH
Data Hold Time
0.5
—
1
—
1
—
ns
t ENS
Enable Setup Time
3
—
4
—
5
—
ns
t ENH
Enable Hold Time
0.5
—
1
—
1
—
ns
t LDS
Load Setup Time
3
—
4
—
5
—
ns
t LDH
Load Hold Time
0.5
—
1
—
1
—
ns
t RS
Reset Pulse Width(3)
10
—
15
—
20
—
ns
t RSS
Reset Setup Time
10
—
15
—
20
—
ns
t RSR
Reset Recovery Time
10
—
15
—
20
—
ns
t RSF
Reset to Flag and Output Time
—
10
—
15
—
20
ns
t FWFT
Mode Select Time
0
—
0
—
0
—
ns
t RTS
Retransmit Setup Time
3
—
4
—
5
—
ns
0
—
0
—
0
—
ns
t OLZ
Output Enable to Output in Low Z
(4)
t OE
Output Enable to Output Valid
2
6
3
8
3
10
ns
t OHZ
Output Enable to Output in High Z(4)
2
6
3
8
3
10
ns
t WFF
Write Clock to FF or IR
—
6.5
—
10
—
12
ns
t REF
Read Clock to EF or OR
—
6.5
—
10
—
12
ns
t PAF
Write Clock to PAF
—
6.5
—
10
—
12
ns
t PAE
Read Clock to PAE
—
6.5
—
10
—
12
ns
t HF
Clock to HF
—
16
—
20
—
22
ns
t SKEW1
Skew time between RCLK and WCLK for
FF/IR
5
—
6
—
10
—
ns
t SKEW2
Skew time between RCLK and WCLK for
PAE and PAF
Skew time between RCLK and WCLK for
EF/OR
12
—
15
—
20
—
ns
60
—
60
—
60
—
ns
t SKEW3
NOTES:
1. All AC timings apply to both Standard IDT mode and First Word Fall Through mode.
2. Industrial temperature range product for 15ns speed grade is available as a standard device.
All other speed grades are available by special order.
3. Pulse widths less than minimum values are not allowed.
4. Values guaranteed by design, not currently tested.
3.3V
330Ω
D.U.T.
AC TEST CONDITIONS
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
510Ω
GND to 3.0V
3ns
1.5V
1.5V
See Figure 1
30pF*
4673 drw 04
* Includes jig and scope capacitances.
Figure 2. Output Load
6
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
If the FIFO is full, the first read operation will cause FF to go HIGH.
Subsequent read operations will cause PAF and HF to go HIGH at the
conditions described in Table 1. If further read operations occur, without
write operations, PAE will go LOW when there are n words in the FIFO,
where n is the empty offset value. Continuing read operations will cause
the FIFO to become empty. When the last word has been read from the
FIFO, the EF will go LOW inhibiting further read operations. REN is
ignored when the FIFO is empty.
When configured in IDT Standard mode, the EF and FF outputs are
double register-buffered outputs.
Relevant timing diagrams for IDT Standard mode can be found in
Figure 7, 8 and 11.
FUNCTIONAL DESCRIPTION
TIMING MODES:
IDT STANDARD VS FIRST WORD FALL THROUGH (FWFT) MODE
The IDT72V261LA/72V271LA support two different timing modes of
operation: IDT Standard mode or First Word Fall Through (FWFT) mode.
The selection of which mode will operate is determined during Master
Reset, by the state of the FWFT/SI input.
If, at the time of Master Reset, FWFT/SI is LOW, then IDT Standard
mode will be selected. This mode uses the Empty Flag (EF) to indicate
whether or not there are any words present in the FIFO. It also uses the
Full Flag function (FF) to indicate whether or not the FIFO has any free
space for writing. In IDT Standard mode, every word read from the
FIFO, including the first, must be requested using the Read Enable
(REN) and RCLK.
If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode
will be selected. This mode uses Output Ready (OR) to indicate whether
or not there is valid data at the data outputs (Qn). It also uses Input
Ready (IR) to indicate whether or not the FIFO has any free space for
writing. In the FWFT mode, the first word written to an empty FIFO
goes directly to Qn after three RCLK rising edges, REN = LOW is not
necessary. Subsequent words must be accessed using the Read Enable (REN) and RCLK.
Various signals, both input and output signals operate differently
depending on which timing mode is in effect.
FIRST WORD FALL THROUGH MODE (FWFT)
In this mode, the status flags, IR, PAF, HF, PAE, and OR operate in
the manner outlined in Table 2. To write data into to the FIFO, WEN
must be LOW. Data presented to the DATA IN lines will be clocked into
the FIFO on subsequent transitions of WCLK. After the first write is
performed, the Output Ready (OR) flag will go LOW. Subsequent writes
will continue to fill up the FIFO. PAE will go HIGH after n + 2 words
have been loaded into the FIFO, where n is the empty offset value. The
default setting for this value is stated in the footnote of Table 2. This
parameter is also user programmable. See section on Programmable
Flag Offset Loading.
If one continued to write data into the FIFO, and we assumed no
read operations were taking place, the HF would toggle to LOW once
the 8,194th word for the IDT72V261LA and 16,386th word for the
IDT72V271LA, respectively was written into the FIFO. Continuing to
write data into the FIFO will cause the PAF to go LOW. Again, if no
reads are performed, the PAF will go LOW after (16,385-m) writes for
the IDT72V261LA and (32,769-m) writes for the IDT72V271LA, where
m is the full offset value. The default setting for this value is stated in
the footnote of Table 2.
When the FIFO is full, the Input Ready (IR) flag will go HIGH, inhibiting further write operations. If no reads are performed after a reset, IR
will go HIGH after D writes to the FIFO. D = 16,385 writes for the
IDT72V261LA and 32,769 writes for the IDT72V271LA, respectively.
Note that the additional word in FWFT mode is due to the capacity of
the memory plus output register.
If the FIFO is full, the first read operation will cause the IR flag to go
LOW. Subsequent read operations will cause the PAF and HF to go
HIGH at the conditions described in Table 2. If further read operations
occur, without write operations, the PAE will go LOW when there are n
+ 1 words in the FIFO, where n is the empty offset value. Continuing
read operations will cause the FIFO to become empty. When the last
word has been read from the FIFO, OR will go HIGH inhibiting further
read operations. REN is ignored when the FIFO is empty.
When configured in FWFT mode, the OR flag output is triple registerbuffered, and the IR flag output is double register-buffered.
Relevant timing diagrams for FWFT mode can be found in Figure 9,
10 and 12.
IDT STANDARD MODE
In this mode, the status flags, FF, PAF, HF, PAE, and EF operate in
the manner outlined in Table 1. To write data into to the FIFO, Write
Enable (WEN) must be LOW. Data presented to the DATA IN lines will
be clocked into the FIFO on subsequent transitions of the Write Clock
(WCLK). After the first write is performed, the Empty Flag (EF) will go
HIGH. Subsequent writes will continue to fill up the FIFO. The Programmable Almost-Empty flag (PAE) will go HIGH after n + 1 words have
been loaded into the FIFO, where n is the empty offset value. The
default setting for this value is stated in the footnote of Table 1. This
parameter is also user programmable. See section on Programmable
Flag Offset Loading.
If one continued to write data into the FIFO, and we assumed no
read operations were taking place, the Half-Full flag (HF) would toggle
to LOW once the 8,193th word for IDT72V261LA and 16,385th word for
IDT72V271LA respectively was written into the FIFO. Continuing to
write data into the FIFO will cause the Programmable Almost-Full flag
(PAF) to go LOW. Again, if no reads are performed, the PAF will go
LOW after (16,384-m) writes for the IDT72V261LA and (32,768-m) writes
for the IDT72V271LA. The offset “m” is the full offset value. The default
setting for this value is stated in the footnote of Table 1. This parameter
is also user programmable. See section on Programmable Flag Offset
Loading.
When the FIFO is full, the Full Flag (FF) will go LOW, inhibiting
further write operations. If no reads are performed after a reset, FF will
go LOW after D writes to the FIFO. D = 16,384 writes for the
IDT72V261LA and 32,768 for the IDT72V271LA, respectively.
7
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
values, and in addition, sets a default PAE offset value of 07FH (a
threshold 127 words from the empty boundary), and a default PAF
offset value of 07FH (a threshold 127 words from the full boundary).
See Figure 3, Offset Register Location and Default Values.
In addition to loading offset values into the FIFO, it also possible to read
the current offset values. It is only possible to read offset values via parallel
read.
Figure 4, Programmable Flag Offset Programming Sequence, summarizes the control pins and sequence for both serial and parallel programming modes. For a more detailed description, see discussion that follows.
The offset registers may be programmed (and reprogrammed) any time
after Master Reset, regardless of whether serial or parallel programming
has been selected.
PROGRAMMING FLAG OFFSETS
Full and Empty Flag offset values are user programmable. The
IDT72V261LA/72V271LA has internal registers for these offsets. Default settings are stated in the footnotes of Table 1 and Table 2. Offset
values can be programmed into the FIFO in one of two ways; serial or
parallel loading method. The selection of the loading method is done
using the LD (Load) pin. During Master Reset, the state of the LD input
determines whether serial or parallel flag offset programming is enabled. A HIGH on LD during Master Reset selects serial loading of
offset values and in addition, sets a default PAE offset value of 3FFH (a
threshold 1,023 words from the empty boundary), and a default PAF
offset value of 3FFH (a threshold 1,023 words from the full boundary).
A LOW on LD during Master Reset selects parallel loading of offset
TABLE 1 — STATUS FLAGS FOR IDT STANDARD MODE
Number of
Words in
FIFO
IDT72V261LA
IDT72V261LA
0
0
1 to n
(1)
1 to n
(1)
FF PAF
HF
H
H
H
PAE EF
L
L
H
H
H
H
L
(n + 1) to 8,192
(n + 1) to 16,384
H
H
H
H
H
8,193 to (16,384-(m+1))
16,385 to (32,768-(m+1))
H
H
L
H
H
(16,384-m)(2) to 16,383
(32,768-m) (2) to 32,767
H
L
L
H
H
16,384
32,768
L
L
L
H
H
NOTES:
1. n = Empty Offset, Default Values: n = 127 when parallel offset loading is selected or n = 1,023 when serial offset loading is selected.
2. m = Full Offset, Default Values: m = 127 when parallel offset loading is selected or m = 1,023 when serial offset loading is selected.
TABLE 2 — STATUS FLAGS FOR FWFT MODE
Number of
Words in
FIFO (1)
IDT72V271LA
IDT72V271LA
0
0
1 to n+1
(1)
1 to n+1
(1)
FF PAF
HF
L
H
H
L
H
L
H
PAE EF
L
H
H
L
L
H
H
L
(n + 2) to 8,193
(n + 2) to 16,385
8,194 to (16,385-(m+1))(2)
16,386 to (32,769-(m+1)) (2)
L
H
L
H
L
(16,385-m) to 16,384
(32,769-m) (2) to 32,768
L
L
L
H
L
16,385
32,769
H
L
L
H
L
NOTES:
1. n = Empty Offset, Default Values: n = 127 when parallel offset loading is selected or n = 1,023 when serial offset loading is selected.
2. m = Full Offset, Default Values: m = 127 when parallel offset loading is selected or m = 1,023 when serial offset loading is selected.
8
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V261LA  16,384 x 9 − BIT
8
7
IDT72V271LA  32,768 x 9 − BIT
0
7
8
DEFAULT VALUE
07FH if LD is LOW at Master Reset
3FFH if LD is HIGH at Master Reset
DEFAULT VALUE
07FH if LD is LOW at Master Reset
3FFH if LD is HIGH at Master Reset
8
5
0
EMPTY OFFSET (LSB) REG.
EMPTY OFFSET (LSB) REG.
8
0
0
6
EMPTY OFFSET (MSB) REG.
EMPTY OFFSET (MSB) REG.
00H
00H
8
7
7
8
0
0
FULL OFFSET (LSB) REG.
FULL OFFSET (LSB) REG.
DEFAULT VALUE
07FH if LD is LOW at Master Reset
3FFH if LD is HIGH at Master Reset
DEFAULT VALUE
07FH if LD is LOW at Master Reset
3FFH if LD is HIGH at Master Reset
8
0
5
8
0
6
FULL OFFSET (MSB) REG.
FULL OFFSET (MSB) REG.
00H
00H
4673 drw 06
Figure 3. Offset Register Location and Default Values
LD
WEN
REN
SEN
0
0
1
1
0
1
0
1
0
1
1
0
X
1
1
1
1
0
X
X
1
X
0
X
X
1
1
1
X
X
WCLK
RCLK
X
Selection
Parallel write to registers:
Empty Offset (LSB)
Empty Offset (MSB)
Full Offset (LSB)
Full Offset (MSB)
Parallel read from registers:
Empty Offset (LSB)
Empty Offset (MSB)
Full Offset (LSB)
Full Offset (MSB)
X
X
X
Serial shift into registers:
28 bits for the 72V261LA
30 bits for the 72V271LA
1 bit for each rising WCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
X
No Operation
X
Write Memory
Read Memory
X
No Operation
NOTES:
1. The programming method can only be selected at Master Reset.
2. Parallel reading of the offset registers is always permitted regardless of which programming method has been selected.
3. The programming sequence applies to both IDT Standard and FWFT modes.
Figure 4. Programmable Flag Offset Programming Sequence
9
4673 drw 07
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
SERIAL PROGRAMMING MODE
If Serial Programming mode has been selected, as described above,
then programming of PAE and PAF values can be achieved by using a
combination of the LD, SEN, WCLK and SI input pins. Programming
PAE and PAF proceeds as follows: when LD and SEN are set LOW,
data on the SI input are written, one bit for each WCLK rising edge,
starting with the Empty Offset LSB and ending with the Full Offset MSB.
A total of 28 bits for the IDT72V261LA and 30 bits for the IDT72V271LA.
See Figure 13, Serial Loading of Programmable Flag Registers, for the
timing diagram for this mode.
Using the serial method, individual registers cannot be programmed
selectively. PAE and PAF can show a valid status only after the complete set of bits (for all offset registers) has been entered. The registers
can be reprogrammed as long as the complete set of new offset bits is
entered. When LD is LOW and SEN is HIGH, no serial write to the
registers can occur.
Write operations to the FIFO are allowed before and during the serial
programming sequence. In this case, the programming of all offset bits
does not have to occur at once. A select number of bits can be written
to the SI input and then, by bringing LD and SEN HIGH, data can be
written to FIFO memory via Dn by toggling WEN. When WEN is brought
HIGH with LD and SEN restored to a LOW, the next offset bit in sequence is written to the registers via SI. If an interruption of serial
programming is desired, it is sufficient either to set LD LOW and deactivate SEN or to set SEN LOW and deactivate LD. Once LD and SEN
are both restored to a LOW level, serial offset programming continues.
From the time serial programming has begun, neither partial flag will
be valid until the full set of bits required to fill all the offset registers has
been written. Measuring from the rising WCLK edge that achieves the
above criteria; PAF will be valid after two more rising WCLK edges plus
tPAF, PAE will be valid after the next two rising RCLK edges plus tPAE
plus tSKEW2.
It is not possible to read the flag offset values in a serial mode.
PARALLEL MODE
If Parallel Programming mode has been selected, as described above,
then programming of PAE and PAF values can be achieved by using a
combination of the LD, WCLK , WEN and Dn input pins. For the
IDT72V261LA and the IDT72V271LA, programming PAE and PAF proceeds as follows: when LD and WEN are set LOW, data on the inputs
Dn are written into the Empty Offset LSB Register on the first LOW-toHIGH transition of WCLK. Upon the second LOW-to-HIGH transition of
WCLK, data are written into the Empty Offset MSB Register. Upon the
third LOW-to-HIGH transition of WCLK, data are written into the Full
Offset LSB Register. Upon the fourth LOW-to-HIGH transition of WCLK,
data are written into the Full Offset MSB Register. The fifth transition of
WCLK writes, once again, to the Empty Offset LSB Register. See Figure 14, Parallel Loading of Programmable Flag Registers for the
IDT72V261LA, for the timing diagram for this mode.
The act of writing offsets in parallel employs a dedicated write offset
register pointer. The act of reading offsets employs a dedicated read
offset register pointer. The two pointers operate independently; however, a read and a write should not be performed simultaneously to the
offset registers. A Master Reset initializes both pointers to the Empty
Offset (LSB) register. A Partial Reset has no effect on the position of
these pointers.
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
Write operations to the FIFO are allowed before and during the parallel programming sequence. In this case, the programming of all offset
registers does not have to occur at one time. One, two or more offset
registers can be written and then by bringing LD HIGH, write operations
can be redirected to the FIFO memory. When LD is set LOW again,
and WEN is LOW, the next offset register in sequence is written to. As
an alternative to holding WEN LOW and toggling LD, parallel programming can also be interrupted by setting LD LOW and toggling WEN.
Note that the status of a partial flag (PAE or PAF) output is invalid
during the programming process. From the time parallel programming
has begun, a partial flag output will not be valid until the appropriate
offset word has been written to the register(s) pertaining to that flag.
Measuring from the rising WCLK edge that achieves the above criteria;
PAF will be valid after two more rising WCLK edges plus tPAF, PAE will
be valid after the next two rising RCLK edges plus tPAE plus tSKEW2.
The act of reading the offset registers employs a dedicated read
offset register pointer. The contents of the offset registers can be read
on the Q0-Qn pins when LD is set LOW and REN is set LOW. For the
IDT72V261LA and IDT72V271LA, data are read via Qn from the Empty
Offset LSB Register on the first LOW-to-HIGH transition of RCLK. Upon
the second LOW-to-HIGH transition of RCLK, data are read from the
Empty Offset MSB Register. Upon the third LOW-to-HIGH transition of
RCLK, data are read from the Full Offset LSB Register. Upon the
fourth LOW-to-HIGH transition of RCLK, data are read from the Full
Offset MSB Register. The fifth transition of RCLK reads, once again,
from the Empty Offset LSB Register. See Figure 15, Parallel Read of
Programmable Flag Registers for the IDT72V261LA, for the timing diagram for this mode.
It is permissible to interrupt the offset register read sequence with
reads or writes to the FIFO. The interruption is accomplished by
deasserting REN, LD, or both together. When REN and LD are restored
to a LOW level, reading of the offset registers continues where it left
off. It should be noted, and care should be taken from the fact that
when a parallel read of the flag offsets is performed, the data word that
was present on the output lines Qn will be overwritten.
Parallel reading of the offset registers is always permitted regardless
of which timing mode (IDT Standard or FWFT modes) has been selected.
RETRANSMIT OPERATION
The Retransmit operation allows data that has already been read to
be accessed again. There are two stages: first, a setup procedure that
resets the read pointer to the first location of memory, then the actual
retransmit, which consists of reading out the memory contents, starting
at the beginning of memory.
Retransmit setup is initiated by holding RT LOW during a rising RCLK
edge. REN and WEN must be HIGH before bringing RT LOW. At least
one word, but no more than D - 2 words should have been written into
the FIFO between Reset (Master or Partial) and the time of Retransmit
setup. D = 16,384 for the IDT72V261LA and D = 32,768 for the
IDT72V271LA in IDT Standard mode. In FWFT mode, D = 16,385 for
the IDT72V261LA and D = 32,769 for the IDT72V271LA.
If IDT Standard mode is selected, the FIFO will mark the beginning of
the Retransmit setup by setting EF LOW. The change in level will only
be noticeable if EF was HIGH before setup. During this period, the
internal read pointer is initialized to the first location of the RAM array.
10
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
When EF goes HIGH, Retransmit setup is complete and read operations may begin starting with the first location in memory. Since IDT
Standard mode is selected, every word read including the first word
following Retransmit setup requires a LOW on REN to enable the rising
edge of RCLK. See Figure 11, Retransmit Timing (IDT Standard Mode),
for the relevant timing diagram.
If FWFT mode is selected, the FIFO will mark the beginning of the
Retransmit setup by setting OR HIGH. During this period, the internal
read pointer is set to the first location of the RAM array.
When OR goes LOW, Retransmit setup is complete; at the same
time, the contents of the first location appear on the outputs. Since
FWFT mode is selected, the first word appears on the outputs, no LOW
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
on REN is necessary. Reading all subsequent words requires a LOW
on REN to enable the rising edge of RCLK. See Figure 12, Retransmit
Timing (FWFT Mode), for the relevant timing diagram.
For either IDT Standard mode or FWFT mode, updating of the PAE,
HF and PAF flags begin with the rising edge of RCLK that RT is setup.
PAE is synchronized to RCLK, thus on the second rising edge of RCLK
after RT is setup, the PAE flag will be updated. HF is asynchronous,
thus the rising edge of RCLK that RT is setup will update HF. PAF is
synchronized to WCLK, thus the second rising edge of WCLK that
occurs tSKEW after the rising edge of RCLK that RT is setup will update
PAF. RT is synchronized to RCLK.
11
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
SIGNAL DESCRIPTION
INPUTS:
DATA IN (D0 - D8)
Data inputs for 9-bit wide data.
CONTROLS:
MASTER RESET (MRS)
A Master Reset is accomplished whenever the MRS input is taken to
a LOW state. This operation sets the internal read and write pointers to
the first location of the RAM array. PAE will go LOW, PAF will go
HIGH, and HF will go HIGH.
If FWFT is LOW during Master Reset then the IDT Standard mode,
along with EF and FF are selected. EF will go LOW and FF will go
HIGH. If FWFT is HIGH, then the First Word Fall Through mode
(FWFT), along with IR and OR, are selected. OR will go HIGH and IR
will go LOW.
If LD is LOW during Master Reset, then PAE is assigned a threshold
127 words from the empty boundary and PAF is assigned a threshold
127 words from the full boundary; 127 words corresponds to an offset
value of 07FH. Following Master Reset, parallel loading of the offsets
is permitted, but not serial loading.
If LD is HIGH during Master Reset, then PAE is assigned a threshold 1,023 words from the empty boundary and PAF is assigned a threshold 1,023 words from the full boundary; 1,023 words corresponds to an
offset value of 3FFH. Following Master Reset, serial loading of the
offsets is permitted, but not parallel loading.
Parallel reading of the registers is always permitted. (See section
describing the LD pin for further details.)
During a Master Reset, the output register is initialized to all zeroes.
A Master Reset is required after power up, before a write operation can
take place. MRS is asynchronous.
See Figure 5, Master Reset Timing, for the relevant timing diagram.
PARTIAL RESET (PRS)
A Partial Reset is accomplished whenever the PRS input is taken to
a LOW state. As in the case of the Master Reset, the internal read and
write pointers are set to the first location of the RAM array, PAE goes
LOW, PAF goes HIGH, and HF goes HIGH.
Whichever mode is active at the time of Partial Reset, IDT Standard
mode or First Word Fall Through, that mode will remain selected. If the
IDT Standard mode is active, then FF will go HIGH and EF will go
LOW. If the First Word Fall Through mode is active, then OR will go
HIGH, and IR will go LOW.
Following Partial Reset, all values held in the offset registers remain
unchanged. The programming method (parallel or serial) currently active at the time of Partial Reset is also retained. The output register is
initialized to all zeroes. PRS is asynchronous.
A Partial Reset is useful for resetting the device during the course of
operation, when reprogramming partial flag offset settings may not be
convenient.
See Figure 6, Partial Reset Timing, for the relevant timing diagram.
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
RETRANSMIT (RT)
The Retransmit operation allows data that has already been read to
be accessed again. There are two stages: first, a setup procedure that
resets the read pointer to the first location of memory, then the actual
retransmit, which consists of reading out the memory contents, starting
at the beginning of the memory.
Retransmit setup is initiated by holding RT LOW during a rising RCLK
edge. REN and WEN must be HIGH before bringing RT LOW.
If IDT Standard mode is selected, the FIFO will mark the beginning of
the Retransmit setup by setting EF LOW. The change in level will only
be noticeable if EF was HIGH before setup. During this period, the
internal read pointer is initialized to the first location of the RAM array.
When EF goes HIGH, Retransmit setup is complete and read operations may begin starting with the first location in memory. Since IDT
Standard mode is selected, every word read including the first word
following Retransmit setup requires a LOW on REN to enable the rising
edge of RCLK. See Figure 11, Retransmit Timing (IDT Standard Mode),
for the relevant timing diagram.
If FWFT mode is selected, the FIFO will mark the beginning of the
Retransmit setup by setting OR HIGH. During this period, the internal
read pointer is set to the first location of the RAM array.
When OR goes LOW, Retransmit setup is complete; at the same
time, the contents of the first location appear on the outputs. Since
FWFT mode is selected, the first word appears on the outputs, no LOW
on REN is necessary. Reading all subsequent words requires a LOW
on REN to enable the rising edge of RCLK. See Figure 12, Retransmit
Timing (FWFT Mode), for the relevant timing diagram.
FIRST WORD FALL THROUGH/SERIAL IN (FWFT/SI)
This is a dual purpose pin. During Master Reset, the state of the
FWFT/SI input determines whether the device will operate in IDT Standard mode or First Word Fall Through (FWFT) mode. If, at the time of
Master Reset, FWFT/SI is LOW, then IDT Standard mode will be selected. This mode uses the Empty Flag (EF) to indicate whether or not
there are any words present in the FIFO memory. It also uses the Full
Flag function (FF) to indicate whether or not the FIFO memory has any
free space for writing.
In IDT Standard mode, every word read from the FIFO, including the
first, must be requested using the Read Enable (REN) and RCLK.
If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode
will be selected. This mode uses Output Ready (OR) to indicate whether
or not there is valid data at the data outputs (Qn). It also uses Input
Ready (IR) to indicate whether or not the FIFO memory has any free
space for writing. In the FWFT mode, the first word written to an empty
FIFO goes directly to Qn after three RCLK rising edges, REN = LOW is
n
o
t
necessary. Subsequent words must be accessed using the Read Enable (REN) and RCLK.
After Master Reset, FWFT/SI acts as a serial input for loading PAE
and PAF offsets into the programmable registers. The serial input
function can only be used when the serial loading method has been
selected during Master Reset. Serial programming using the FWFT/SI
pin functions the same way in both IDT Standard and FWFT modes.
12
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
WRITE CLOCK (WCLK)
A write cycle is initiated on the rising edge of the WCLK input. Data
setup and hold times must be met with respect to the LOW-to-HIGH
transition of the WCLK. It is permissible to stop the WCLK. Note that
while WCLK is idle, the FF/IR, PAF and HF flags will not be updated.
(Note that WCLK is only capable of updating HF flag to LOW.) The
Write and Read Clocks can either be independent or coincident.
WRITE ENABLE (WEN)
When the WEN input is LOW, data may be loaded into the FIFO
RAM array on the rising edge of every WCLK cycle if the device is not
full. Data is stored in the RAM array sequentially and independently of
any ongoing read operation.
When WEN is HIGH, no new data is written in the RAM array on
each WCLK cycle.
To prevent data overflow in the IDT Standard mode, FF will go LOW,
inhibiting further write operations. Upon the completion of a valid read
cycle, FF will go HIGH allowing a write to occur. The FF is updated by
two WCLK cycles + tSKEW after the RCLK cycle.
To prevent data overflow in the FWFT mode, IR will go HIGH,
inhibiting further write operations. Upon the completion of a valid read
cycle, IR will go LOW allowing a write to occur. The IR flag is updated
by two WCLK cycles + tSKEW after the valid RCLK cycle.
WEN is ignored when the FIFO is full in either FWFT or IDT Standard
mode.
READ CLOCK (RCLK)
A read cycle is initiated on the rising edge of the RCLK input. Data
can be read on the outputs, on the rising edge of the RCLK input. It is
permissible to stop the RCLK. Note that while RCLK is idle, the EF/OR,
PAE and HF flags will not be updated. (Note that RCLK is only capable
of updating the HF flag to HIGH.) The Write and Read Clocks can be
independent or coincident.
READ ENABLE (REN)
When Read Enable is LOW, data is loaded from the RAM array into
the output register on the rising edge of every RCLK cycle if the device
is not empty.
When the REN input is HIGH, the output register holds the previous
data and no new data is loaded into the output register. The data
outputs Q0-Qn maintain the previous data value.
In the IDT Standard mode, every word accessed at Qn, including the
first word written to an empty FIFO, must be requested using REN.
When the last word has been read from the FIFO, the Empty Flag (EF)
will go LOW, inhibiting further read operations. REN is ignored when
the FIFO is empty. Once a write is performed, EF will go HIGH allowing
a read to occur. The EF flag is updated by two RCLK cycles + tSKEW
after the valid WCLK cycle.
In the FWFT mode, the first word written to an empty FIFO automatically goes to the outputs Qn, on the third valid LOW to HIGH transition
of RCLK + tSKEW after the first write. REN does not need to be
asserted LOW. In order to access all other words, a read must be
executed using REN. The RCLK LOW to HIGH transition after the last
word has been read from the FIFO, Output Ready (OR) will go HIGH
with a true read (RCLK with REN = LOW), inhibiting further read operations. REN is ignored when the FIFO is empty.
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
SERIAL ENABLE (SEN)
The SEN input is an enable used only for serial programming of the
offset registers. The serial programming method must be selected
during Master Reset. SEN is always used in conjunction with LD.
When these lines are both LOW, data at the SI input can be loaded into
the program register one bit for each LOW-to-HIGH transition of WCLK.
(See Figure 4.)
When SEN is HIGH, the programmable registers retains the previous
settings and no offsets are loaded. SEN functions the same way in
both IDT Standard and FWFT modes.
OUTPUT ENABLE (OE)
When Output Enable is enabled (LOW), the parallel output buffers
receive data from the output register. When OE is HIGH, the output
data bus (Qn) goes into a high impedance state.
LOAD (LD)
This is a dual purpose pin. During Master Reset, the state of the LD
input determines one of two default offset values (127 or 1,023) for the
PAE and PAF flags, along with the method by which these offset registers can be programmed, parallel or serial. After Master Reset, LD
enables write operations to and read operations from the offset registers. Only the offset loading method currently selected can be used to
write to the registers. Offset registers can be read only in parallel. A
LOW on LD during Master Reset selects a default PAE offset value of
07FH (a threshold 127 words from the empty boundary), a default PAF
offset value of 07FH (a threshold 127 words from the full boundary),
and parallel loading of other offset values. A HIGH on LD during
Master Reset selects a default PAE offset value of 3FFH (a threshold
1,023 words from the empty boundary), a default PAF offset value of
3FFH (a threshold 1,023 words from the full boundary), and serial loading of other offset values.
After Master Reset, the LD pin is used to activate the programming
process of the flag offset values PAE and PAF. Pulling LD LOW will
begin a serial loading or parallel load or read of these offset values.
See Figure 4, Programmable Flag Offset Programming Sequence.
OUTPUTS:
FULL FLAG (FF/IR)
This is a dual purpose pin. In IDT Standard mode, the Full Flag (FF)
function is selected. When the FIFO is full, FF will go LOW, inhibiting
further write operations. When FF is HIGH, the FIFO is not full. If no
reads are performed after a reset (either MRS or PRS), FF will go LOW
after D writes to the FIFO (D = 16,384 for the IDT72V261LA and 32,768
for the IDT72V271LA). See Figure 7, Write Cycle and Full Flag Timing
(IDT Standard Mode), for the relevant timing information.
In FWFT mode, the Input Ready (IR) function is selected. IR goes
LOW when memory space is available for writing in data. When there
is no longer any free space left, IR goes HIGH, inhibiting further write
operations. If no reads are performed after a reset (either MRS or
PRS), IR will go HIGH after D writes to the FIFO (D = 16,385 for the
IDT72V261LA and 32,769 for the IDT72V271LA) See Figure 9, Write
Timing (FWFT Mode), for the relevant timing information.
The IR status not only measures the contents of the FIFO memory,
but also counts the presence of a word in the output register. Thus, in
13
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
FWFT mode, the total number of writes necessary to deassert IR is one
greater than needed to assert FF in IDT Standard mode.
FF/IR is synchronous and updated on the rising edge of WCLK. FF/
IR are double register-buffered outputs.
EMPTY FLAG (EF/OR)
This is a dual purpose pin. In the IDT Standard mode, the Empty
Flag (EF) function is selected. When the FIFO is empty, EF will go
LOW, inhibiting further read operations. When EF is HIGH, the FIFO is
not empty. See Figure 8, Read Cycle, Empty Flag and First Word
Latency Timing (IDT Standard Mode), for the relevant timing information.
In FWFT mode, the Output Ready (OR) function is selected. OR
goes LOW at the same time that the first word written to an empty FIFO
appears valid on the outputs. OR stays LOW after the RCLK LOW to
HIGH transition that shifts the last word from the FIFO memory to the
outputs. OR goes HIGH only with a true read (RCLK with REN =
LOW). The previous data stays at the outputs, indicating the last word
was read. Further data reads are inhibited until OR goes LOW again.
See Figure 10, Read Timing (FWFT Mode), for the relevant timing
information.
EF/OR is synchronous and updated on the rising edge of RCLK.
In IDT Standard mode, EF is a double register-buffered output. In
FWFT mode, OR is a triple register-buffered output.
PROGRAMMABLE ALMOST-FULL FLAG (PAF)
The Programmable Almost-Full flag (PAF) will go LOW when the
FIFO reaches the almost-full condition. In IDT Standard mode, if no
reads are performed after reset (MRS), PAF will go LOW after (D - m)
words are written to the FIFO. The PAF will go LOW after (16,384-m)
writes for the IDT72V261LA and (32,768-m) writes for the IDT72V271LA.
The offset “m” is the full offset value. The default setting for this value is
stated in the footnote of Table 1.
In FWFT mode, the PAF will go LOW after (16,385-m) writes for
the IDT72V261LA and (32,769-m) writes for the IDT72V271LA, where
m is the full offset value. The default setting for this value is stated in
the footnote of Table 2.
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
See Figure 16, Programmable Almost-Full Flag Timing (IDT Standard and FWFT Mode), for the relevant timing information.
PAF is synchronous and updated on the rising edge of WCLK.
PROGRAMMABLE ALMOST-EMPTY FLAG (PAE)
The Programmable Almost-Empty flag (PAE) will go LOW when the
FIFO reaches the almost-empty condition. In IDT Standard mode, PAE
will go LOW when there are n words or less in the FIFO. The offset “n”
is the empty offset value. The default setting for this value is stated in
the footnote of Table 1.
In FWFT mode, the PAE will go LOW when there are n+1 words or
less in the FIFO. The default setting for this value is stated in the
footnote of Table 2.
See Figure 17, Programmable Almost-Empty Flag Timing (IDT
Standard and FWFT Mode), for the relevant timing information.
PAE is synchronous and updated on the rising edge of RCLK.
HALF-FULL FLAG (HF)
This output indicates a half-full FIFO. The rising WCLK edge that fills
the FIFO beyond half-full sets HF LOW. The flag remains LOW until the
difference between the write and read pointers becomes less than or
equal to half of the total depth of the device; the rising RCLK edge that
accomplishes this condition sets HF HIGH.
In IDT Standard mode, if no reads are performed after reset (MRS or
PRS), HF will go LOW after (D/2 + 1) writes to the FIFO, where
D = 16,384 for the IDT72V261LA and 32,768 for the IDT72V271LA.
In FWFT mode, if no reads are performed after reset (MRS or PRS),
HF will go LOW after (D-1/2 + 2) writes to the FIFO, where D = 16,385
for the IDT72V261LA and 32,769 for the IDT72V271LA.
See Figure 18, Half-Full Flag Timing (IDT Standard and FWFT Modes),
for the relevant timing information. Because HF is updated by both
RCLK and WCLK, it is considered asynchronous.
DATA OUTPUTS (Q0-Q8)
(Q0 - Q8) are data outputs for 9-bit wide data.
14
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tRS
MRS
tRSS
tRSR
tRSS
tRSR
REN
WEN
tRSR
tFWFT
FWFT/SI
tRSR
tRSS
LD
tRSS
RT
tRSS
SEN
If FWFT = HIGH, OR = HIGH
tRSF
EF/OR
If FWFT = LOW, EF = LOW
If FWFT = LOW, FF = HIGH
tRSF
FF/IR
If FWFT = HIGH, IR = LOW
tRSF
PAE
tRSF
PAF, HF
tRSF
OE = HIGH
Q0 - Qn
OE = LOW
Figure 5. Master Reset Timing
15
4673 drw 08
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
PRS
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tRS
tRSS
tRSR
tRSS
tRSR
REN
WEN
tRSS
RT
tRSS
SEN
If FWFT = HIGH, OR = HIGH
tRSF
EF/OR
If FWFT = LOW, EF = LOW
If FWFT = LOW, FF = HIGH
tRSF
FF/IR
If FWFT = HIGH, IR = LOW
tRSF
PAE
tRSF
PAF, HF
tRSF
OE = HIGH
Q0 - Qn
OE = LOW
Figure 6. Partial Reset Timing
16
4673 drw 09
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tCLK
tCLKH
NO WRITE
WCLK
tSKEW1
tCLKL
NO WRITE
2
1
1
(1)
(1)
tDS
D0 - Dn
2
tSKEW1
tDH
tDS
tDH
DX
tWFF
DX+1
tWFF
tWFF
tWFF
FF
WEN
RCLK
tENS
tENS
tENH
tENH
REN
tA
tA
Q0 - Qn
DATA IN OUTPUT REGISTER
DATA READ
NEXT DATA READ
4673 drw10
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go high (after one WCLK cycle pus tWFF). If the time between the
rising edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle.
2. LD = HIGH, OE = LOW, EF = HIGH
Figure 7. Write Cycle and Full Flag Timing (IDT Standard Mode)
tCLK
tCLKH
RCLK
1
tENS
tCLKL
2
tENH
tENS
REN
tENH
tENH
tENS
NO OPERATION
NO OPERATION
tREF
tREF
tREF
EF
tA
tA
Q0 - Qn
LAST WORD
tOLZ
OE
LAST WORD
tA
D0
D1
t OLZ
tOHZ
tOE
(1)
tSKEW3
WCLK
tENS
tENH
tENS
tDHS
tDS
tENH
WEN
tDS
D0 - Dn
D0
tDH
D1
4673 drw 11
NOTES:
1. tSKEW3 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising
edge of WCLK and the rising edge of RCLK is less than tSKEW3, then EF deassertion may be delayed one extra RCLK cycle.
2. LD = HIGH.
3. First word latency: 60ns + tREF + 1*TRCLK.
Figure 8. Read Cycle, Empty Flag and First Data Word Latency Timing (IDT Standard Mode)
17
18
tDS
W1
tENS
W2
2
DATA IN OUTPUT REGISTER
1
tSKEW3(1)
tDH
W3
3
tREF
tA
W4
tDS
W1
W[n +2]
W[n+3]
1
tPAE
tSKEW2 (2)
2
W[n+4]
W[
2
tDS
]
D-1 +1
W[
]
D-1 +2
2
tHF
W[
2
]
D-1 +3
W[D-m-2]
tDS
W[D-m-1]
W[D-m]
1
tPAF
W[D-m+1]
W[D-m+2]
W[D-1]
WD
Figure 9. Write Timing (First Word Fall Through Mode)
tENH
4673 drw 12
tWFF
NOTES:
1. tSKEW3 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that OR will go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW3, then OR assertion may be delayed one extra RCLK cycle.
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH after one RCLK cycle plus tPAE. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
3. LD = HIGH, OE = LOW
4. n = PAE offset, m = PAF offset and D = maximum FIFO depth.
5. D = 16,385 for the IDT72V261LA and 32,769 for the IDT72V271LA.
6. First word latency: 60ns + tREF + 2*TRCLK.
IR
PAF
HF
PAE
OR
Q0 - Q8
REN
RCLK
D0 - D8
WEN
WCLK
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
19
tDS
tENS
W1
tOHZ
WD
tENS
tWFF
tDH
tENH
W1
tOE
tA
W2
1
(1)
tSKEW1
tA
2
tWFF
W3
(2)
Wm+2
tSKEW2
W[m+3]
tA
tPAF
W[m+4]
W[
]
D-1 + 1
2
tHF
W[
tA
]
D-1 + 2
2
W[D-n-1]
tA
W[D-n]
1
tPAE
W[D-n+1]
W[D-n+2]
W[D-1]
tA
tENS
WD
4673 drw 13
tREF
Figure 10. Read Timing (First Word Fall Through Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK cycle plus tWFF. If the time between the rising edge of RCLK and the rising edge of WCLK
is less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle.
2. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH after one WCLK cycle plus tPAF. If the time between the rising edge of RCLK and the rising edge of
WCLK is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle.
3. LD = HIGH
4. n = PAE Offset, m = PAF offset and D = maximum FIFO depth.
5. D = 16,385 for the IDT72V261LA and 32,769 for the IDT72V271LA.
IR
PAF
HF
PAE
OR
Q0 - Q8
OE
REN
RCLK
D0 - D8
WEN
WCLK
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
1
RCLK
tENH
tENS
2
tENS
tRTS
tENH
REN
tA
Q0 - Qn
tA
Wx
tA
Wx+1
W1
(3)
W2
(3)
tSKEW2
1
WCLK
2
tRTS
WEN
tENS
tENH
RT
tREF
tREF
(5)
EF
tPAE
PAE
tHF
HF
tPAF
PAF
4673 drw 14
Figure 11. Retransmit Timing (IDT Standard Mode)
20
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tENH
tENS
3
2
1
RCLK
4
tENH
tENH
tRTS
REN
tA
Q0 - Qn
Wx
Wx+1
tA
W1
(4)
W2
W3
tSKEW2
1
WCLK
2
tRTS
WEN
tENS
tENH
RT
tREF (5)
tREF
OR
tPAE
PAE
tHF
HF
tPAF
PAF
4673 drw 15
NOTES:
1. Retransmit setup is complete after OR returns LOW.
2. No more than D - 2 words may be written to the FIFO between Reset (Master or Partial) and Retransmit setup. Therefore, IR will be LOW throughout the Retransmit setup procedure.
D = 16,385 for the IDT72V261LA and 32,769 for the IDT72V271LA.
3. OE = LOW.
4. W1, W2, W3 = first, second and third words written to the FIFO after Master Reset.
5. OR goes LOW at 60 ns + 2 RCLK cycles + tREF.
Figure 12. Retransmit Timing (FWFT Mode)
WCLK
t ENS
tENH
tENH
SEN
tLDS
tLDH
tLDH
LD
tDH
tDS
SI
BIT 0
BIT X
EMPTY OFFSET
(1)
BIT 0
BIT X
FULL OFFSET
NOTE:
1. X = 13 for the IDT72V261LA and X = 14 for the IDT72V271LA.
Figure 13. Serial Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
21
(1)
4673 drw 16
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tCLK
tCLKH
tCLKL
WCLK
tLDS
tLDH
tLDH
LD
tENS
tENH
tENH
WEN
tDS
tDH
tDH
D0 - D7
PAE OFFSET
(LSB)
PAE OFFSET
(MSB)
PAF OFFSET
(LSB)
PAF OFFSET
(MSB)
4673 drw 17
Figure 14. Parallel Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
t CLK
t CLKH
t CLKL
RCLK
t LDS
t LDH
t LDH
LD
t ENS
t ENH
t ENH
REN
tA
tA
Q0 - Q7
DATA IN OUTPUT
REGISTER
PAE OFFSET
(LSB)
PAE OFFSET
(MSB)
PAF OFFSET
(LSB)
NOTE:
1. OE = LOW.
Figure 15. Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes)
22
PAF OFFSET
(MSB)
4673 drw 18
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
t CLKH
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
t CLKL
WCLK
1
2
1
t ENS
2
t ENH
WEN
t PAF
PAF
t PAF
(2)
D-(m+1) words
in FIFO(2)
(2)
D - (m+1) words in FIFO
D - m words in FIFO
t SKEW2
(3)
RCLK
t ENH
t ENS
REN
4673 drw 19
NOTES:
1. m = PAF offset.
2. D = maximum FIFO depth.
In IDT Standard mode: D = 16,384 for the IDT72V261LA and 32,768 for the IDT72V271LA.
In FWFT mode: D = 16,385 for the IDT72V261LA and 32,769 for the IDT72V271LA.
3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus tPAF). If the time between
the rising edge of RCLK and the rising edge of WCLK is less than t SKEW2, then the PAF deassertion time may be delayed one extra WCLK cycle.
4. PAF is asserted and updated on the rising edge of WCLK only.
Figure 16. Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
t CLKH
t CLKL
WCLK
t ENS
t ENH
WEN
PAE
n words in FIFO (2),
n+1 words in FIFO (3)
t SKEW2 (4)
RCLK
n+1 words in FIFO
n+2 words in FIFO
n words in FIFO (2),
n+1 words in FIFO (3)
(2)
,
(3)
t PAE
t PAE
1
2
1
t ENS
2
t ENH
REN
4673 drw 20
NOTES:
1. n = PAE offset.
2. For IDT Standard mode.
3. For FWFT mode.
4. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH (after one RCLK cycle plus tPAE). If the time between
the rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
5. PAE is asserted and updated on the rising edge of WCLK only.
Figure 17. Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)
tCLKH
tCLKL
WCLK
tENH
tENS
WEN
tHF
HF
D/2 + 1 words in FIFO(1),
D/2 words in FIFO(1),
[D-1
2
D-1
(2)
2 + 2 words in FIFO
[
]
+ 1 words in FIFO(2)
]
D/2 words in FIFO(1),
[D-1
2
]
+ 1 words in FIFO(2)
tHF
RCLK
tENS
REN
NOTES:
1. For IDT Standard mode: D = maximum FIFO depth. D = 16,384 for the IDT72V261LA and 32,768 for the IDT72V271LA.
2. For FWFT mode: D = maximum FIFO depth. D = 16,385 for the IDT72V261LA and 32,769 for the IDT72V271LA.
Figure 18. Half-Full Flag Timing (IDT Standard and FWFT Modes)
23
4673 drw 21
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
composite flags, that is, ANDing EF of every FIFO, and separately
ANDing FF of every FIFO. In FWFT mode, composite flags can be
created by ORing OR of every FIFO, and separately ORing IR of every
FIFO.
Figure 21 demonstrates a width expansion using two IDT72V261LA/
72V271LA devices. D0 - D8 from each device form a 18-bit wide input
bus and Q0-Q8 from each device form a 18-bit wide output bus. Any
word width can be attained by adding additional IDT72V261LA/72V271LA
devices.
OPTIONAL CONFIGURATIONS
WIDTH EXPANSION CONFIGURATION
Word width may be increased simply by connecting together the
control signals of multiple devices. Status flags can be detected from
any one device. The exceptions are the EF and FF functions in IDT
Standard mode and the IR and OR functions in FWFT mode. Because
of variations in skew between RCLK and WCLK, it is possible for EF/FF
deassertion and IR/OR assertion to vary by one cycle between FIFOs.
In IDT Standard mode, such problems can be avoided by creating
PARTIAL RESET (PRS)
MASTER RESET (MRS)
FIRST WORD FALL THROUGH/
SERIAL INPUT (FWFT/SI)
RETRANSMIT (RT)
Dm+1 - Dn
m+n
DATA IN
D0 - Dm
m
n
READ CLOCK (RCLK)
WRITE CLOCK (WCLK)
READ ENABLE (REN)
WRITE ENABLE (WEN)
OUTPUT ENABLE (OE)
LOAD (LD)
FULL FLAG/INPUT READY (FF/IR) #1
IDT
72V261LA
72V271LA
IDT
72V261LA
72V271LA
EMPTY FLAG/OUTPUT READY (EF/OR) #1
(1)
GATE
(1)
FULL FLAG/INPUT READY (FF/IR) #2
EMPTY FLAG/OUTPUT READY (EF/OR) #2
PROGRAMMABLE (PAF)
HALF-FULL FLAG (HF)
PROGRAMMABLE (PAE)
FIFO
#1
FIFO
#2
m
n
Qm+1 - Qn
Q0 - Qm
NOTES:
1. Use an AND gate in IDT Standard mode, an OR gate in FWFT mode.
2. Do not connect any output control signals directly together.
3. FIFO #1 and FIFO #2 must be the same depth, but may be different word widths.
Figure 19. Block Diagram of 16,384 x 18 and 32,768 x 18 Width Expansion
24
GATE
m+n
DATA OUT
4673 drw 22
IDT72V261LA/72V271LA
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72V261LA can easily be adapted to applications requiring
depths greater than 16,384 and 32,768 for the IDT72V271LA with a 9bit bus width. In FWFT mode, the FIFOs can be connected in series
(the data outputs of one FIFO connected to the data inputs of the next)
with no external logic necessary. The resulting configuration provides
a total depth equivalent to the sum of the depths associated with each
single FIFO. Figure 22 shows a depth expansion using two
IDT72V261LA/72V271LA devices.
Care should be taken to select FWFT mode during Master Reset for
all FIFOs in the depth expansion configuration. The first word written
to an empty configuration will pass from one FIFO to the next ("ripple
down") until it finally appears at the outputs of the last FIFO in the
chain–no read operation is necessary but the RCLK of each FIFO must
be free-running. Each time the data word appears at the outputs of
one FIFO, that device's OR line goes LOW, enabling a write to the next
FIFO in line.
For an empty expansion configuration, the amount of time it takes for
OR of the last FIFO in the chain to go LOW (i.e. valid data to appear on
the last FIFO's outputs) after a word has been written to the first FIFO
is the sum of the delays for each individual FIFO:
that the tSKEW3 specification is not met between WCLK and transfer
clock, or RCLK and transfer clock, for the OR flag.
The "ripple down" delay is only noticeable for the first word written to
an empty depth expansion configuration. There will be no delay evident for subsequent words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one
until it finally moves into the first FIFO of the chain. Each time a free
location is created in one FIFO of the chain, that FIFO's IR line goes
LOW, enabling the preceding FIFO to write a word to fill it.
For a full expansion configuration, the amount of time it takes for IR
of the first FIFO in the chain to go LOW after a word has been read from
the last FIFO is the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the
WCLK period. Note that extra cycles should be added for the possibility
that the tSKEW1 specification is not met between RCLK and transfer
clock, or WCLK and transfer clock, for the IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK,
whichever is faster. Both these actions result in data moving, as quickly
as possible, to the end of the chain and free locations to the beginning
of the chain.
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the
RCLK period. Note that extra cycles should be added for the possibility
FWFT/SI
TRANSFER CLOCK
WRITE CLOCK
FWFT/SI
WCLK
WRITE ENABLE
WEN
INPUT READY
IR
FWFT/SI
RCLK
OR
IDT
72V261LA
72V271LA
REN
OE
DATA IN
n
Dn
Qn
RCLK
WEN
REN
READ ENABLE
OR
OUTPUT READY
OE
OUTPUT ENABLE
IR
IDT
72V261LA
72V271LA
GND
n
READ CLOCK
WCLK
n
Dn
DATA OUT
Qn
4673 drw 23
Figure 20. Block Diagram of 32,768 x 9 and 65,536 x 9 Depth Expansion
25
ORDERING INFORMATION
IDT
XXXXX
Device Type
X
Power
XX
Speed
X
Package
X
Process /
Temperature
Range
BLANK
I(1)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
PF
TF
10
15
20
Thin Plastic Quad Flatpack (TQFP, PN64-1)
Slim Thin Quad Flatpack (STQFP, PP64-1)
Commercial Only
Clock Cycle Time (tCLK)
Com’l & Ind’l
Speed in Nanoseconds
Commercial Only
LA
Low Power
72V261
72V271
16,384 x 9 3.3V SuperSync FIFO
32,768 x 9 3.3V SuperSync FIFO
4673 drw 24
NOTE:
1. Industrial temperature range product for 15ns speed grade is available as a standard device. All other speed grades are available by special order.
DATASHEET DOCUMENT HISTORY
04/25/2001
04/22/2002
pgs. 1, 5, 6 and 26.
pg. 17.
CORPORATE HEADQUARTERS
2975 Stender Way
Santa Clara, CA 95054
for SALES:
800-345-7015 or 408-727-6116
fax: 408-492-8674
www.idt.com
26
for Tech Support:
408-330-1753
email: [email protected]
3.3 VOLT CMOS SuperSync FIFO™
16,384 x 9
32,768 x 9
IDT72V261LA
IDT72V271LA
ADDENDUM
DIFFERENCES BETWEEN THE IDT72V261LA/72V271LA AND IDT72V261L/72V271L
IDT has improved the performance of the IDT72V261/72V271 SuperSync™ FIFOs. The new versions are designated by the “LA” mark. The LA
part is pin-for-pin compatible with the original “L” version. Some difference exist between the two versions. The following table details these differences.
Item
NEW PART
OLD PART
IDT72V261LA
IDT72V271LA
IDT72V261L
IDT72V271L
Comments
Pin #3
DC (Don’t Care) - There is
no restriction on WCLK and
RCLK. See note 1.
FS (Frequency Select)
First Word Latency
(IDT Standard Mode)
60ns(2) + tREF + 1 TRCLK(4)
tFWL1 = 10*Tf(3) + 2TRCLK(4)(ns) First word latency in the LA part is
a fixed value, independent of the
frequency of RCLK or WCLK.
First Word Latency
(FWFT Mode)
60ns(2) + tREF + 2 TRCLK(4)
tFWL2 = 10*Tf(3) + 3TRCLK(4)(ns) First word latency in the LA part is
a fixed value, independent of the
frequency of RCLK or WCLK.
Retransmit Latency
(IDT Standard Mode)
60ns(2) + tREF + 1 TRCLK(4)
tRTF1 = 14*Tf(3) + 3TRCLK(4)(ns)
Retransmit latency in the LA part is
a fixed value, independent of the
frequency of RCLK or WCLK.
Retransmit Latency
(FWFT Mode)
60ns(2) + tREF + 2 TRCLK(4)
tRTF2 = 14*Tf(3) + 4TRCLK(4)(ns)
Retransmit latency in the LA part is
a fixed value, independent of the
frequency of RCLK or WCLK.
ICC1
55mA
150mA
Active supply current
20mA
15mA
Standby current
10 + 0.95*fS + 0.02*CL*fS(mA)
Not Given
Typical ICC1 Current calculation
ICC2
Typical ICC1
(5)
In the LA part this pin must be tied
to either VCC or GND and must
not toggle after reset.
NOTES:
1. WCLK and RCLK can vary independently and can be stopped. There is no restriction on operating WCLK and RCLK.
2. This is tSKEW3.
3. Tf is the period of the ‘selected clock’.
4. TRCLK is the cycle period of the read clock.
5. Typical ICC1 is based on VCC = 3.3V, tA = 25°C, fS = WCLK frequency = RCLK frequency (in MHz using TTL levels), data switching at fS/2, CL = Capacitive Load (in pF).
IDT and the IDT logo are registered trademarks. The SuperSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
27
 2002 Integrated Device Technology, Inc.
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