IK Semicon IN74HC32A Quad 2-input or gate high-performance silicon-gate cmo Datasheet

TECHNICAL DATA
IN74HC32A
Quad 2-Input OR Gate
High-Performance Silicon-Gate CMOS
N SUFFIX
PLASTIC DIP
The IN74HC32A is identical in pinout to the LS/ALS32. The device
inputs are compatible with standard CMOS outputs; with pullup resistors,
they are compatible with LS/ALSTTL outputs.
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
14
1
D SUFFIX
SOIC
14
1
ORDERING INFORMATION
IN74HC32AN Plastic DIP
IN74HC32AD SOIC
TA = -55° to 125° C for all packages
LOGIC DIAGRAM
PIN ASSIGNMENT
FUNCTION TABLE
Inputs
PIN 14 =VCC
PIN 7 = GND
Output
A
B
Y
L
L
L
L
H
H
H
L
H
H
H
H
L – LOW voltage level
H – HIGH voltage level
Rev. 00
IN74HC32A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
-0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
-1.5 to VCC +1.5
V
DC Output Voltage (Referenced to GND)
-0.5 to VCC +0.5
V
DC Input Current, per Pin
±20
mA
IOUT
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
mW
-65 to +150
°C
260
°C
VOUT
IIN
Tstg
TL
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
Min
Max
Unit
2.0
6.0
V
0
VCC
V
-55
+125
°C
0
0
0
1000
500
400
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
Rev. 00
IN74HC32A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
VCC
Symbol
Parameter
Test Conditions
V
-55°C
to
25°C
≤85°C
≤125°C
Unit
VIH
Minimum HighLevel Input
Voltage
VOUT= VCC-0.1 V
⎢IOUT⎢≤ 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low Level Input
Voltage
VOUT=0.1 V or VCC-0.1 V
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
0.5
1.35
1.8
0.5
1.35
1.8
0.5
1.35
1.8
V
VOH
Minimum HighLevel Output
Voltage
VIN=VIH or VIL
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN= VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
VIN=VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
VOL
Maximum LowLevel Output
Voltage
VIN= VIL
⎢IOUT⎢ ≤ 20 µA
V
IIN
Maximum Input
Leakage Current
VIN=VCC or GND
6.0
±0.1
±1.0
±1.0
µA
ICC
Maximum
Quiescent Supply
Current
(per Package)
VIN=VCC or GND
IOUT=0µA
6.0
1.0
10
40
µA
Rev. 00
IN74HC32A
AC ELECTRICAL CHARACTERISTICS (CL=50 pF,Input tr=tf=6.0 ns, VIH=VCC, VIL=0 V)
Guaranteed Limit
VCC
Symbol
Parameter
V
-55°C
to
25°C
≤85°C
≤125°C
Unit
tPLH, tPHL
Maximum Propagation Delay, Input A or B to
Output Y (Figures 1 and 2)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
tTLH, tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
-
10
10
10
pF
CIN
Maximum Input Capacitance
Power Dissipation Capacitance (Per Gate)
CPD
Typical @25°C,VCC=5.0 V
Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
tr
TEST POINT
VCC
DEVICE
UNDER
TEST
GND
t PLH
t PHL
OUTPUT Y
50%
10%
pF
tf
90%
50%
10%
INPUT
A or B
20
OUTPUT
*
CL
90%
tTLH
tTHL
* Includes all probe and jig capacitance
Figure 1. Switching Waveforms
Figure 2. Test Circuit
EXPANDED LOGIC DIAGRAM
(1/4 of the Device)
Rev. 00
IN74HC32A
N SUFFIX PLASTIC DIP
(MS - 001AA)
A
Dimension, mm
8
14
B
7
1
Symbol
MIN
MAX
A
18.67
19.69
B
6.1
7.11
5.33
C
F
L
C
-T- SEATING
PLANE
N
G
M
K
J
H
D
0.25 (0.010) M T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D
0.36
0.56
F
1.14
1.78
G
2.54
H
7.62
J
0°
10°
K
2.92
3.81
L
7.62
8.26
M
0.2
0.36
N
0.38
D SUFFIX SOIC
(MS - 012AB)
Dimension, mm
A
14
8
H
B
1
G
P
7
R x 45
C
-TK
D
SEATING
PLANE
J
0.25 (0.010) M T C M
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B ‑ 0.25 mm (0.010) per side.
F
M
Symbol
MIN
MAX
A
8.55
8.75
B
3.8
4
C
1.35
1.75
D
0.33
0.51
F
0.4
1.27
G
1.27
H
5.27
J
0°
8°
K
0.1
0.25
M
0.19
0.25
P
5.8
6.2
R
0.25
0.5
Rev. 00
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