IK Semicon IN74HC74A Dual d flip-flop with set and reset Datasheet

TECHNICAL DATA
IN74HC74A
Dual D Flip-Flop with Set and Reset
The IN74HC74A is identical in pinout to the LS/ALS74. The device inputs
are compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LS/ALSTTL outputs.
This device consists of two D flip-flops with individual Set, Reset, and
Clock inputs. Information at a D-input is transferred to the corresponding Q
output on the next positive going edge of the clock input. Both Q and Q
outputs are available from each flip-flop. The Set and Reset inputs are
asynchronous.
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION
IN74HC74AN Plastic
IN74HC74AD SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
FUNCTION TABLE
Inputs
PIN 14 =VCC
PIN 7 = GND
Outputs
Set
Reset
Clock
Data
Q
Q
L
H
X
X
H
L
H
L
X
X
L
H
L
L
H
X
*
H*
X
H
H
H
H
L
H
H
L
L
H
H
H
L
X
No Change
H
H
H
X
No Change
H
H
X
No Change
*Both outputs will remain high as long as Set
and Reset are low, but the output states are
unpredictable if Set and Reset go high
simultaneously.
X = don’t care
Rev. 00
IN74HC74A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
-0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
-1.5 to VCC +1.5
V
DC Output Voltage (Referenced to GND)
-0.5 to VCC +0.5
V
DC Input Current, per Pin
±20
mA
IOUT
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
750
500
mW
-65 to +150
°C
260
°C
VOUT
IIN
PD
Tstg
TL
**
Power Dissipation in Still Air, Plastic DIP
SOIC Package**
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
**
Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
Min
Max
Unit
2.0
6.0
V
0
VCC
V
-55
+125
°C
0
0
0
1000
500
400
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
Rev. 00
IN74HC74A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
Test Conditions
VCC
Guaranteed Limit
V
25 °C
to
-55°C
≤85
°C
≤125
°C
Unit
VIH
Minimum HighLevel Input Voltage
VOUT=0.1 V or VCC-0.1 V
⎢IOUT⎢≤ 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low Level Input Voltage
VOUT=0.1 V or VCC-0.1 V
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
0.5
1.35
1.8
0.5
1.35
1.8
0.5
1.35
1.8
V
VOH
Minimum HighLevel Output Voltage
VIN=VIH or VIL
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN=VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
VIN=VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
VOL
Maximum LowLevel Output Voltage
VIN=VIH or VIL
⎢IOUT⎢ ≤ 20 µA
V
IIN
Maximum Input
Leakage Current
VIN=VCC or GND
6.0
±0.1
±1.0
±1.0
µA
ICC
Maximum Quiescent
Supply Current
(per Package)
VIN=VCC or GND
IOUT=0µA
6.0
2.0
20
80
µA
Rev. 00
IN74HC74A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
Symbol
Parameter
VCC
Guaranteed Limit
Unit
V
25 °C
to
-55°C
≤85°C
≤125°C
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
4.5
6.0
6.0
30
35
4.8
24
28
4.0
20
24
MHz
tPLH, tPHL
Maximum Propagation Delay, Clock to Q or Q
(Figures 1 and 4)
2.0
4.5
6.0
100
20
17
125
25
21
150
30
26
ns
tPLH, tPHL
Maximum Propagation Delay, Set or Reset to Q or
Q (Figures 2 and 4)
2.0
4.5
6.0
105
21
18
130
26
22
160
32
27
ns
tTLH, tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
-
10
10
10
pF
CIN
Maximum Input Capacitance
CPD
Power Dissipation Capacitance (Per Flip-Flop)
Typical @25°C,VCC=5.0 V
Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
39
pF
TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns)
Symbol
Parameter
VCC
Guaranteed Limit
Unit
V
25 °C
to55°C
≤85°C
≤125°C
tsu
Minimum Setup Time, Data to Clock (Figure 3)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
th
Minimum Hold Time, Clock to Data (Figure 3)
2.0
4.5
6.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
ns
trec
Minimum Recovery Time, Set or Reset Inactive to
Clock (Figure 2)
2.0
4.5
6.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
ns
tw
Minimum Pulse Width, Clock (Figure 1)
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
tw
Minimum Pulse Width, Set or Reset (Figure 2)
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
tr, tf
Maximum Input Rise and Fall Times (Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
ns
Rev. 00
IN74HC74A
Figure 1. Switching Waveform
Figure 2. Switching Waveform
Figure 3. Switching Waveform
Figure 4.Test Circuit
EXPANDED LOGIC DIAGRAM
Rev. 00
IN74HC74A
N SUFFIX PLASTIC DIP
(MS - 001AA)
A
Dimension, mm
8
14
B
7
1
Symbol
MIN
MAX
A
18.67
19.69
B
6.1
7.11
5.33
C
F
L
C
-T- SEATING
PLANE
N
G
M
K
J
H
D
0.25 (0.010) M T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D
0.36
0.56
F
1.14
1.78
G
2.54
H
7.62
J
0°
10°
K
2.92
3.81
L
7.62
8.26
M
0.2
0.36
N
0.38
D SUFFIX SOIC
(MS - 012AB)
Dimension, mm
A
14
8
H
B
1
G
P
7
R x 45
C
-TK
D
SEATING
PLANE
J
0.25 (0.010) M T C M
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B ‑ 0.25 mm (0.010) per side.
F
M
Symbol
MIN
MAX
A
8.55
8.75
B
3.8
4
C
1.35
1.75
D
0.33
0.51
F
0.4
1.27
G
1.27
H
5.27
J
0°
8°
K
0.1
0.25
M
0.19
0.25
P
5.8
6.2
R
0.25
0.5
Rev. 00
Similar pages