Infineon IPP14N03LA Optimos 2 power-transistor Datasheet

IPB14N03LA
IPI14N03LA, IPP14N03LA
OptiMOS®2 Power-Transistor
Product Summary
Features
• Ideal for high-frequency dc/dc converters
• N-channel
V DS
25
V
R DS(on),max (SMD version)
13.6
mΩ
ID
30
A
• Logic level
• Excellent gate charge x R DS(on) product (FOM)
• Very low on-resistance R DS(on)
• Superior thermal resistance
P-TO263-3-2
P-TO262-3-1
P-TO220-3-1
• 175 °C operating temperature
• dv /dt rated
Type
Package
Ordering Code
Marking
IPB14N03LA
P-TO263-3-2
Q67042-S4156
14N03LA
IPI14N03LA
P-TO262-3-1
Q67042-S4157
14N03LA
IPP14N03LA
P-TO220-3-1
Q67042-S4158
14N03LA
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C1)
30
T C=100 °C
30
Unit
A
Pulsed drain current
I D,pulse
T C=25 °C2)
210
Avalanche energy, single pulse
E AS
I D=24 A, R GS=25 Ω
60
mJ
Reverse diode dv /dt
dv /dt
I D=30 A, V DS=20 V,
di /dt =200 A/µs,
T j,max=175 °C
6
kV/µs
Gate source voltage3)
V GS
Power dissipation
P tot
Operating and storage temperature
T j, T stg
T C=25 °C
IEC climatic category; DIN IEC 68-1
Rev. 1.3
±20
V
46
W
-55 ... 175
°C
55/175/56
page 1
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
3.2
minimal footprint
-
-
62
6 cm2 cooling area4)
-
-
40
Thermal characteristics
Thermal resistance, junction - case
R thJC
SMD version, device on PCB
R thJA
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
25
-
-
Gate threshold voltage
V GS(th)
V DS=V GS, I D=20 µA
1.2
1.6
2
Zero gate voltage drain current
I DSS
V DS=25 V, V GS=0 V,
T j=25 °C
-
0.1
1
V DS=25 V, V GS=0 V,
T j=125 °C
-
10
100
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
10
100
nA
Drain-source on-state resistance
R DS(on)
V GS=4.5 V, I D=20 A
-
18.5
23.1
mΩ
V GS=4.5 V, I D=20 A,
SMD version
-
18.2
22.7
V GS=10 V, I D=30 A
-
11.6
13.9
V GS=10 V, I D=30 A,
SMD version
-
11.3
13.6
-
0.9
-
Ω
17
33
-
S
Gate resistance
RG
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=30 A
1)
Current is limited by bondwire; with an R thJC=3.2 K/W the chip is able to carry 45 A.
2)
See figure 3
3)
T j,max=150 °C and duty cycle D <0.25 for V GS<-5 V
4)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.3
page 2
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
849
1129
-
364
484
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
Crss
-
58
87
Turn-on delay time
t d(on)
-
7
10
Rise time
tr
-
27
41
Turn-off delay time
t d(off)
-
18
27
Fall time
tf
-
3.4
5
Gate to source charge
Q gs
-
2.9
3.9
Gate charge at threshold
Q g(th)
-
1.4
1.8
Gate to drain charge
Q gd
-
2.2
3.2
Switching charge
Q sw
-
3.7
5.3
Gate charge total
Qg
-
7.0
9.3
Gate plateau voltage
V plateau
-
3.4
-
Gate charge total, sync. FET
Q g(sync)
V DS=0.1 V,
V GS=0 to 5 V
-
6.0
7.9
Output charge
Q oss
V DD=15 V, V GS=0 V
-
8
10
-
-
30
-
-
210
V GS=0 V, V DS=15 V,
f =1 MHz
V DD=15 V, V GS=10 V,
I D=20 A, R G=2.7 Ω
pF
ns
Gate Charge Characteristics5)
V DD=15 V, I D=15 A,
V GS=0 to 5 V
nC
V
nC
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
V GS=0 V, I F=30 A,
T j=25 °C
-
0.97
1.2
V
Reverse recovery charge
Q rr
V R=15 V, I F=I S,
di F/dt =400 A/µs
-
-
10
nC
5)
T C=25 °C
A
See figure 16 for gate charge parameter definition
Rev. 1.3
page 3
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
1 Power dissipation
2 Drain current
P tot=f(T C)
I D=f(T C); V GS≥10 V
40
50
40
30
I D [A]
P tot [W]
30
20
20
10
10
0
0
0
50
100
150
0
200
50
100
T C [°C]
150
200
T C [°C]
3 Safe operation area
4 Max. transient thermal impedance
I D=f(V DS); T C=25 °C; D =0
Z thJC=f(t p)
parameter: t p
parameter: D =t p/T
1000
10
1 µs
0.5
I D [A]
limited by on-state
resistance
1
10 µs
0.2
Z thJC [K/W]
100
100 µs
DC
0.1
0.05
0.02
10
1 ms
0.1
0.01
10 ms
single pulse
1
0.01
0.1
1
10
100
10
0 -5
100-4
10-3
0
10 -20
10-10
10 0 1
t p [s]
V DS [V]
Rev. 1.3
010-6
page 4
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
60
60
3.2 V
3V
10 V
3.5 V
3.8 V
4.1 V
4.5 V
50
50
4.5 V
40
R DS(on) [mΩ]
I D [A]
40
4.1 V
30
3.8 V
30
20
20
3.5 V
10
10 V
10
3.2 V
3V
2.8 V
0
0
0
1
2
0
3
10
20
V DS [V]
30
40
50
60
40
50
60
I D [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
parameter: T j
60
50
50
40
40
g fs [S]
I D [A]
30
30
20
20
10
10
175 °C
25 °C
0
0
0
1
2
3
4
5
10
20
30
I D [A]
V GS [V]
Rev. 1.3
0
page 5
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=30 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
parameter: I D
30
2.5
25
2
200 µA
V GS(th) [V]
R DS(on) [mΩ]
20
98 %
15
typ
1.5
20 µA
1
10
0.5
5
0
0
-60
-20
20
60
100
140
180
-60
-20
20
60
100
140
180
T j [°C]
T j [°C]
11 Typ. Capacitances
12 Forward characteristics of reverse diode
C =f(V DS); V GS=0 V; f =1 MHz
I F=f(V SD)
parameter: T j
1000
1000
Ciss
Coss
25 °C
175°C 98%
IF [A]
C [pF]
100
100
175 °C
Crss
10
1
10
0
5
10
15
20
25
30
V DS [V]
Rev. 1.3
25°C 98%
page 6
0.0
0.5
1.0
1.5
2.0
VSD [V]
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
13 Avalanche characteristics
14 Typ. gate charge
I AS=f(t AV); R GS=25 Ω
V GS=f(Q gate); I D=15 A pulsed
parameter: T j(start)
parameter: V DD
100
12
15 V
10
5V
8
V GS [V]
IAV [A]
20 V
25 °C
100 °C
150 °C
10
6
4
2
1
0
1
10
100
1000
0
5
10
15
Q gate [nC]
t AV [µs]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
29
V GS
28
Qg
27
V BR(DSS) [V]
26
25
24
V g s(th)
23
22
Q g (th)
21
Q sw
Q gs
20
-60
-20
20
60
100
140
Q gate
Q gd
180
T j [°C]
Rev. 1.3
page 7
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
Package Outline
P-TO263-3-2: Outline
Footprint
Packaging
Dimensions in mm
Rev. 1.3
page 8
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
P-TO262-3-1: Outline
P-TO220-3-1: Outline
Packaging
Dimensions in mm
Rev. 1.3
page 9
2003-12-18
IPB14N03LA
IPI14N03LA, IPP14N03LA
Published by
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Bereich Kommunikation
St.-Martin-Straße 53
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
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For further information on technology, delivery terms and conditions and prices, please contact your
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For information on the types in question, please contact your nearest Infineon Technologies office.
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Rev. 1.3
page 10
2003-12-18
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