IRF IRG4BC30UPBF Ultrafast speed igbt Datasheet

PD - 95169
IRG4BC30UPbF
UltraFast Speed IGBT
INSULATED GATE BIPOLAR TRANSISTOR
Features
C
• UltraFast: optimized for high operating
frequencies 8-40 kHz in hard switching, >200
kHz in resonant mode
• Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
Generation 3
• Industry standard TO-220AB package
• Lead-Free
VCES = 600V
VCE(on) typ. = 1.95V
G
@VGE = 15V, IC = 12A
E
n-channel
Benefits
• Generation 4 IGBTs offer highest efficiency available
• IGBTs optimized for specified application conditions
• Designed to be a "drop-in" replacement for equivalent
industry-standard Generation 3 IR IGBTs
TO-220AB
Absolute Maximum Ratings
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
VGE
EARV
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Parameter
Max.
Units
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current Q
Clamped Inductive Load Current R
Gate-to-Emitter Voltage
Reverse Voltage Avalanche Energy S
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw.
600
23
12
92
92
± 20
10
100
42
-55 to + 150
V
A
V
mJ
W
°C
300 (0.063 in. (1.6mm from case )
10 lbf•in (1.1N•m)
Thermal Resistance
Parameter
RθJC
RθCS
RθJA
Wt
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Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient, typical socket mount
Weight
Typ.
Max.
–––
0.50
–––
2 (0.07)
1.2
–––
80
–––
Units
°C/W
g (oz)
1
04/22/04
IRG4BC30UPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
Collector-to-Emitter Breakdown Voltage
600
—
—
V
VGE = 0V, IC = 250µA
Emitter-to-Collector Breakdown Voltage T 18
—
—
V
VGE = 0V, IC = 1.0A
∆V(BR)CES/∆TJ Temperature Coeff. of Breakdown Voltage —
0.63 —
V/°C VGE = 0V, IC = 1.0mA
— 1.95 2.1
IC = 12A
VGE = 15V
VCE(ON)
Collector-to-Emitter Saturation Voltage
— 2.52 —
IC = 23A
See Fig.2, 5
V
— 2.09 —
IC = 12A , TJ = 150°C
VGE(th)
Gate Threshold Voltage
3.0
—
6.0
VCE = VGE, IC = 250µA
∆VGE(th)/∆TJ Temperature Coeff. of Threshold Voltage
—
-13
— mV/°C VCE = VGE, IC = 250µA
gfe
Forward Transconductance U
3.1
8.6
—
S
VCE = 100V, IC = 12A
—
—
250
VGE = 0V, VCE = 600V
ICES
Zero Gate Voltage Collector Current
µA
—
—
2.0
VGE = 0V, VCE = 10V, TJ = 25°C
—
— 1000
VGE = 0V, VCE = 600V, TJ = 150°C
IGES
Gate-to-Emitter Leakage Current
—
— ±100 nA VGE = ±20V
V(BR)CES
V(BR)ECS
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Ets
LE
Cies
Coes
Cres
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Switching Loss
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
50
8.1
18
17
9.6
78
97
0.16
0.20
0.36
20
13
180
140
0.73
7.5
1100
73
14
Max. Units
Conditions
75
IC = 12A
12
nC
VCC = 400V
See Fig.8
27
VGE = 15V
—
—
TJ = 25°C
ns
120
IC = 12A, VCC = 480V
150
VGE = 15V, RG = 23Ω
—
Energy losses include "tail"
—
mJ
See Fig. 10, 11, 13, 14
0.50
—
TJ = 150°C,
—
IC = 12A, VCC = 480V
ns
—
VGE = 15V, RG = 23Ω
—
Energy losses include "tail"
—
mJ
See Fig. 13, 14
—
nH
Measured 5mm from package
—
VGE = 0V
—
pF
VCC = 30V
See Fig.7
—
ƒ = 1.0MHz
Notes:
Q Repetitive rating; VGE = 20V, pulse width limited by
max. junction temperature. ( See fig. 13b )
R VCC = 80%(VCES), VGE = 20V, L = 10µH, RG = 23Ω,
(See fig. 13a)
T Pulse width ≤ 80µs; duty factor ≤ 0.1%.
U Pulse width 5.0µs, single shot.
S Repetitive rating; pulse width limited by maximum
junction temperature.
2
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IRG4BC30UPbF
35
T ria n g u la r w a ve :
F o r b o th :
D uty cy cle: 50%
T J = 125°C
T s ink = 90°C
Gate drive as s pecified
Load Current ( A )
30
25
I
C la m p vo l ta g e :
8 0 % o f ra te d
P o w e r D is s ip a tio n = 2 1 W
20
S q u a re wave :
6 0 % o f ra te d
v o lta g e
15
I
10
Id e al d io de s
5
A
0
0.1
1
10
100
f, Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(For square wave, I=IRMS of fundamental; for triangular wave, I=IPK)
100
TJ = 2 5 ° C
T J = 1 5 0 °C
10
1
VG E = 1 5 V
2 0 µ s P U L S E W ID T H A
0.1
0.1
1
10
I C , C o lle cto r-to -E m itte r C u rre n t (A )
I C , C olle cto r-to -E m itte r C u rre n t (A )
100
T J = 1 5 0 °C
10
T J = 2 5 °C
1
V CC = 10V
5 µ s P U L S E W ID T H
0.1
5
6
7
8
9
10
11
V C E , C o lle cto r-to -E m itte r V o lta g e (V )
VG E , G a te -to -E m itte r V o lta g e (V )
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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A
12
3
25
3.0
V GE = 15V
V C E , C ollector-to-Em itter Volta ge (V)
M a xim u m D C C o lle c to r C u rre n t (A
IRG4BC30UPbF
20
15
10
5
A
0
25
50
75
100
125
VGE = 15V
8 0 µ s P U L S E W ID T H
IC = 2 4 A
2.5
IC = 1 2 A
2.0
I C = 6 .0 A
A
1.5
-60
150
-40
-20
0
20
40
60
80
100 120 140 160
T J , Ju n c tio n T e m p e ra tu re (°C )
TC , C a s e Te m p e ra tu re (°C )
Fig. 4 - Maximum Collector Current vs. Case
Temperature
Fig. 5 - Collector-to-Emitter Voltage vs.
Junction Temperature
T he rm al R e sp ons e (Z thJ C )
10
1
D = 0 .5 0
0 .2 0
PD M
0 .1 0
0 .1
0 .0 1
0 .0 0 0 0 1
t
0 .0 5
0 .0 2
0 .0 1
1
t2
S IN G L E P U L S E
(T H E R M A L R E S P O N S E )
N o te s :
1 . D u ty fa c to r D = t
1
/t
2
2 . P e a k T J = P D M x Z th J C + T C
0 .0 0 0 1
0 .0 0 1
0 .0 1
0 .1
1
10
t 1 , R e c ta n gu la r P u ls e D ura tio n (s e c )
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4BC30UPbF
V GE =
C ie s =
C re s =
C oes =
1600
20
0V ,
f = 1MHz
C g e + C g c , C ce S H O R TE D
C gc
C ce + C g c
V G E , G ate -to -E m itter V olta g e (V )
C , C a pac ita n ce (pF )
2000
C ie s
1200
800
C oes
400
C re s
16
12
A
0
1
10
VCE = 400V
I C = 12A
8
4
A
0
100
0
10
V C E , C o lle c to r-to -E m itte r V o lta g e (V )
10
= 480V
= 15V
= 2 5 °C
= 12A
0.4
0.3
A
0.2
0
10
20
30
40
50
60
R G , G a te R e s ista n ce ( Ω )
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
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40
50
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
T otal S witch ing L os se s (m J )
T otal S witch ing Lo ss e s (m J )
VCC
VGE
TJ
IC
30
Q g , To ta l G a te C h a rg e (n C )
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
0.5
20
RG
= 23 Ω
V GE = 15V
V CC = 480V
IC = 2 4 A
1
IC = 12A
I C = 6 .0 A
A
0.1
-60
-40
-20
0
20
40
60
80
100
120 140
160
TJ , Ju n c tio n T e m p e ra tu re (°C )
Fig. 10 - Typical Switching Losses vs.
Junction Temperature
5
IRG4BC30UPbF
RG
TJ
V CC
V GE
1.2
1000
= 23 Ω
= 1 5 0 °C
= 480V
= 15V
I C , C ollector-to-E m itter C urrent (A )
T ota l S witch in g Los se s (m J)
1.6
0.8
0.4
A
0.0
0
10
20
I C , C o lle c to r-to -E m itte r C u rre n t (A )
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
6
30
VGGE E= 2 0V
T J = 12 5 °C
100
S A FE O P E R A TIN G A R E A
10
1
0 .1
1
10
100
1000
V C E , Collecto r-to-E m itter V oltage (V )
Fig. 12 - Turn-Off SOA
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IRG4BC30UPbF
L
D .U .T.
VC *
50V
RL =
0 - 480V
1 00 0V
Q
480V
4 X IC@25°C
480µF
960V
R
* Driver s am e ty pe as D .U .T.; Vc = 80% of V ce (m ax )
* Note: D ue to the 50V pow er s upply, pulse w idth a nd inductor
w ill inc rea se to obta in ra ted Id.
Fig. 13a - Clamped Inductive
Fig. 13b - Pulsed Collector
Load Test Circuit
Current Test Circuit
IC
L
D river*
D .U .T.
VC
Fig. 14a - Switching Loss
Test Circuit
50V
1000V
Q
* Driver same type
as D.U.T., VC = 480V
R
S
Q
R
9 0%
1 0%
S
VC
90 %
Fig. 14b - Switching Loss
t d (o ff)
10 %
IC 5%
Waveforms
tf
tr
t d (o n )
t=5µ s
E on
E o ff
E ts = ( Eo n +E o ff )
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7
IRG4BC30UPbF
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
2.87 (.113 )
2.62 (.103 )
10.54 (.415)
10.29 (.405)
-B-
3.78 (.149)
3.54 (.139)
4.69 (.18 5)
4.20 (.16 5)
-A -
1.32 (.052)
1.22 (.048)
6.47 (.255)
6.10 (.240)
4
1 5.24 (.600)
1 4.84 (.584)
LEA D ASS IG N M EN TS
1.15 (.045)
M IN
1
2
4- DR AIN
14.09 (.555)
13.47 (.530)
1.40 (.055)
1.15 (.045)
4- CO LLEC TO R
4.06 (.160)
3.55 (.140)
3X
3X
LEAD AS SIG N M E NTS
IG BT s, CoP AC K
1 - G ATE
2 - D R A IN
1- GA TE
1- GA TE
3 - SO U R C E 2- CO LLEC TO R
2- DR AIN
3- SO UR
3- EM ITT ER
4 -C
DE
R A IN
H EXF ET
3
0.93 (.037)
0.69 (.027)
0.36 (.014)
3X
M
B
A M
0.55 (.022)
0.46 (.018)
2.92 (.115)
2.64 (.104)
2.54 (.100)
2X
NO TES:
1 D IM E N SIO N IN G & TO LE R AN C IN G P ER AN SI Y14.5M , 1982.
2 CO NTROLLING DIM EN SIO N : INCH
3 O U TLIN E C O N F O R M S TO JE D EC O U TLIN E TO -220AB .
4 HEA TSINK & LE AD M EASU RE M ENTS D O NO T INCLUD E BU RRS.
TO-220AB Part Marking Information
E X AM P L E :
T H IS IS AN IR F 1 01 0
L OT COD E 1 78 9
AS S E M B L E D O N W W 1 9, 19 9 7
IN T H E AS S E M B L Y L IN E "C"
N ote: "P " in a ssem bly lin e
p osition in dicate s "L e ad -Fre e"
IN T E R N AT IO N AL
R E CT IF I E R
L OGO
AS S E M B L Y
L OT C OD E
P AR T N U M B E R
D AT E CO D E
Y E AR 7 = 1 9 97
W E E K 19
L IN E C
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 04/04
8
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