IRF IRPT1053D Power module for 1 hp motor drive Datasheet

PD 6.092
IRPT1053A
PRELIMINARY
POWIRTRAIN
Power Module for 1 hp Motor Drives
· 1 hp (0.75kW) power output
Industrial rating at 150% overload for 1 minute
· 180 - 240V AC input, 50/60Hz
· 3-phase rectifier bridge
· 3-phase ultrafast IGBT inverter
· HEXFRED ultrafast soft recovery freewheeling diodes
· Low inductance (current sense)
shunts in positive and negative DC rail
· NTC temperature sensor
· Pin-to-base plate isolation 2500V rms
· Easy-to-mount two-screw package
· Case temperature range -25°C to 125°C operational
Figure 1. IRPT1053A Power Module
180-240V
3-phase input
IRPT1053A
Power Module
PWM
variable
frequency
output
IRPT1053D
POWIRTRAIN
Driver-Plus Board
PWM
generator
AC
motor
feedback
(non-isolated)
feedback
processing
keyboard
External Control Functions
Figure 2. The IRPT1053C POWIRTRAIN within a motor control system
Revised 3/97
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IRPT1053A
The IRPT1053A Power Module
PowIRtrain and Design Kit
The IRPT1053A Power Module, shown in figure 1, is a chip
and wire epoxy encapsulated module. It houses input rectifiers
output inverter, current sense shunts and NTC thermistor. The 3phase input bridge rectifiers are rated at 800V. The inverter
section employs 600V, short circuit rated, ultrafast IGBTs and
ultrafast freewheeling diodes. Current sensing is achieved
through 45mΩ low inductance shunts provided in the positive
and negative DC bus rail. The NTC thermistor provides temperature sensing capability. The lead spacing on the power module
meets UL840 pollution level 3 requirements.
The power circuit and layout within the module are carefully
designed to minimize inductance in the power path, to reduce
noise during inverter operation and to improve the inverter efficiency. The Driver-Plus Board required to run the inverter can be
soldered to the power module pins, thus minimizing assembly and
alignment. The power module is designed to be mounted to a heat
sink with two screw mount positions, in order to insure good
thermal contact between the module substrate and the heat sink.
The IRPT1053A PowIRtrain (Figure 3) provides the complete
power conversion function for a 1hp (0.75kW) variable voltage,
variable frequency AC motor controller. The PowIRtrain combines the Power Module (IRPT1053A) with a Driver-Plus Board
(IRPT1053D). The PowIRtrain Design Kit, IRPT1053E includes the following:
•
•
•
•
•
•
•
Complete PowIRtrain integrated power stage
Specification and operating instructions
Bill of materials
Electrical schematic
Mechanical layout for Driver-Plus Board
Software transferrable files for easy design integration
Application information and layout considerations
Figure 3. IRPT1053C PowIRtrain
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IRPT1053A
Specifications
PARAMETERS
Input Power
VALUES
Voltage
Frequency
Current
IFSM
220V, -15%, +10%, 3-phase
50 - 60Hz
6.2 Arms @ nominal output
175 A
CONDITIONS
TA = 40°C, RthSA = 1.07°C/W
10ms half-cycle, non-repetitive surge
Output Power
Voltage
Nominal motor hp (kW)
0 - 230V rms
1hp (0.75kW) nominal full load power
150% overload for 1 minute
4.4A nominal full load current
6.6A 150% overload for 1 minute
Nominal motor current
defined by external PWM control
Vin = 220V, fpwm = 4kHz, fo = 60Hz
TA = 40°C, RthSA = 1.07°C/W
DC Link
DC link voltage
425V maximum
Sensor
Temp. sense resistance
50kOhms ± 5%
3.1kOhms ±10%
@ TNTC = 25°C
@ TNTC = 100°C
Current sense
45mOhms ± 5%
@ TSHUNT = 25°C
Protection
IGBT short circuit time
Recommended short circuitshutdown current
10µs
DC bus = 425V, VGE = 15V, line to line short
30A peak
Gate Drive
QG
Recommended gate driver
39 nC (typical)
IR2132J (see figure 10)
VGE = 15V refer Figure 5b
refer design kit IRPT1053E
Module
Isolation voltage
2500V rms
Operating case temperature
-25°C to 125°C
Mounting torque
1 Nm
Storage temp. range
-40°C to 125°C
Soldering temperature for 10 sec. 260°C maximum
pin to base plate, 60Hz, 1 minute
95%RH max. (non-condensing)
M4 screw type
at the pins (.06" from case)
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IRPT1053A
Thermal Resistance (RthSA°C/
W)
90
1.2
RthSA 100% load continuous
10-60 Hz
RthSA 150% load (1 min)
10-60 Hz
1
0.8
80
70
Power
150%
60
50
0.6
0.4
40
Power
100%
1.0hp
(0.75kW)
30
RthSA 150% load (1 min)
down to 3 Hz
Total Power Dissipation (Watts)
100
1.4
20
0.2
10
0
0
1
4
8
12
16
PWM Frequency (kHz) - (Induction Motor Load)
20
24
Figure 4a. 1hp/4.4A output Heat sink Thermal Resistance and Power Dissipation vs. PWM Frequency
70
Thermal Resistance (RthSA°C/
W)
1.6
RthSA 100% load continuous
10-60 Hz
1.4
60
50
1.2
Power
150%
40
RthSA 150% load (1 min)
10-60 Hz
30
1
RthSA 150% load (1 min)
down to 3 Hz
Power
100%
20
0.75hp
(0.55kW)
0.8
Total Power Dissipation (Watts)
80
1.8
10
0.6
0
1
4
8
12
16
PWM Frequency (kHz) - (Induction Motor Load)
20
24
Figure 4b. 0.75hp/3.5A output Heat sink Thermal Resistance and Power Dissipation vs. PWM Frequency
NOTE: For figures 4a and 4b – Operating Conditions: Vin = 230 Vrms, MI = 1.15, P.F. = 0.8, TA = 40°C. ZthSA limits
∆Tc rise during 1 minute overload to 10°C.
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IRPT1053A
20
V GE =
C ie s =
C re s =
C oes =
C , C a pa cita n ce (pF )
1200
0V ,
f = 1M H z
C g e + C g c , C c e S H O R TE D
C gc
C ce + C gc
V G E , G a te -to -E m itte r V olta ge (V )
1400
1000
C ie s
800
C oes
600
400
C re s
200
A
0
1
10
V C E = 4 0 0V
IC = 14A
16
12
8
4
A
0
0
100
10
20
30
40
Q g , To tal G a te C h a rge (n C )
V C E , C o lle cto r-to -E m itte r V o lta g e (V )
Figure 5a - Typical Capacitance vs.
Collector-to-Emitter Voltage
Figure 5b - Typical Gate Charge vs.
Gate-to-Emitter Voltage
50,000
Resistance (ohms)
TJ = 1 5 0 °C
10
TJ = 2 5 °C
40,000
30,000
20,000
10,000
109
97
103
91
85
79
73
67
61
55
49
43
37
31
0
25
I C , C o llecto r-to -E m itte r C u rre nt (A )
100
Temperature (deg.C)
V CC = 100V
5 µ s P U L S E W ID T H A
1
5
10
15
20
VG E , G a te -to -E m itte r V o lta g e (V )
Figure 5c - Typical Transfer Characteristics
Figure 6 - Normal R-T Characteristics of the
NTC Thermistor
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IRPT1053A
Mounting Procedure
Mounting
Functional Information
Heat Sink Requirements
1. Connect the driver board and the IRPT1053A power
module.
2. Remove all particles and grit from the heat sink and
power substrate.
3. Spread a .004" to .005" layer of silicone grease on the
heat sink, covering the entire area that the power substrate
will occupy. Recommended heat sink flatners is .001 inch/
inch and Total Indicator Readout (TIR) of .003 inch below
substrate
4. Place the power substrate onto the heat sink with the
mounting holes aligned and press it firmly into the silicone
grease.
5. Place the 2 M4 mounting screws through the PCB and
power module and into the heat sink and tighten the screws
to 1 Nm torque.
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2
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Figure 6. Power Module Mounting Screw Sequence
Power Connections
The power module pin designation, function and other
details can be obtained from the package outline in Figure 8
and circuit diagram in Figure 9. Three phase input connections made to pins R, S and T and inverter output connections are
made to pins U, V and W. Positive rectifier output and positive
inverter bus are brought out to pins RP and P respectively in order to provide DC bus capacitor soft charging implementation
option. The current shunt terminals are connected to pins ISI, IS2
and IS3, IS4 on the positive and negative DC rail respectively.
Figures 4a-4b show the thermal resistance of the heat
sink required for various output power levels and PulseWidth-Modulated (PWM) switching frequencies. Maximum
total losses of the unit are also shown. This data is based
on the following key operating conditions:
• The maximum continuous combined losses of the rectifier and inverter occur at full pulse-width-modulation.
These maximum losses set the maximum continuous
operating temperature of the heat sink.
• The maximum combined losses of the rectifier and inverter at full pulse-width-modulation under overload set
the incremental temperature rise of the heat sink during
overload.
• The minimum output frequency at which full load current is to be delivered sets the peak IGBT junction
temperature.
• At low output frequency, IGBT junction temperature
tends to follow the instantaneous fluctuations of the
output current. Thus, peak junction temperature rise
increases as output frequency decreases.
Over Temperature Protection
Over temperature can be detected using the NTC thermistor included in the power module for thermal sensing.
Protection circuit that initiates a shutdown if the temperature of the IMS substrate exceeds a set level can be
implemented. The nominal resistance vs. temperature
characteristic of the thermistor is given in Figure 6.
Voltage Rise During Braking
The motor will feed energy back to the DC link during
regenerative braking, forcing the DC bus voltage to rise
above the level defined by input line voltage. Deceleration
of the motor must be controlled by appropriate PWM control to keep the DC bus voltage within the rated maximum
value.
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IRPT1053A
IRPT1053A Mechanical Specifications
NOTE: Dimensions are in inches [milliimeters]
2.600
[66.04]
2.282
28X
.650
.032 [0.81]
[16.51]
E5
G5
RT1
RT2
N/C
.020 [0.51]
THICKNESS
E3
G3
E1
G1
P
IS1
IS2
N
RP
[57.96]
2X R .210 [5.33]
2X R .080 [2.03]
W
E4
G4
E6
G6
N/C
V
U
IS4
IS3
E2
G2
T
1.750
[44.45]
R
1.419
[36.04]
S
1.770
[44.96]
2.265
.209
[57.53]
[5.31]
.307
[7.80]
Figure 7.
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IRPT1053A
IRPT1053A
IRPT1053A Mechanical Specifications
.750 [19.05]
.950 [24.13]
.450 [11.43]
.550 [13.97]
.150 [ 3.81]
.250 [ 6.35]
.150 [ 3.81]
.050 [ 1.27]
.550 [13.97]
.450 [11.43]
.850 [21.59]
1.050 [26.67]
NOTE: Dimensions are in inches [milliimeters]
ALL PIN COORDINATE DIMENSIONS ARE BASIC
.875 [22.23]
PIN CENTER
.000 [ 0.00]
PIN CENTER
PIN DIAGONAL
1.050 [26.67]
.850 [21.59]
.650 [16.51]
.350 [ 8.89]
.250 [ 6.35]
.000 [ 0.00]
.050 [ 1.27]
.650 [16.51]
.875 [22.23]
.037 - .034
[.940 - .864]
28X
.010
M
A
28X ( .026 - .024)
28X .040 [1.02]
MOUNTING SURFACE IN CLAMPED CONDITION
A
Figure 8.
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IRPT1053A
Figure 9. Power Module Circuit Diagram
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IRPT1053A
Figure 10. Recommended Gate Drive Circuit
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IRPT1053A
Part Number Identification and Ordering Instructions
IRPT1053A Power Module
IRPT1053D Driver-Plus Board
Chip and wire epoxy encapsulated module with 800V rectifiers, 600V short-circuit rated, ultra-fast IGBT inverter with
ultra-fast freewheeling diodes, temperature sensing NTC thermistor and current-sensing low-inductance shunts.
Printed Circuit board assembled with DC link capacitors, NTC
in-rush limiting thermistor, high-power terminal blocks, surge suppression MOVs, IGBT gate drivers, protection circuitry and low
power supply. The PCB is functionally tested with standard power
module to meet all system specifications.
IRPT1053C POWIRTRAIN
Integrated Power Module (IRPT1053A) and Driver-Plus
Board (IRPT1053D) pre-assembled and tested to meet all system
specifications.
IRPT1053E Design Kit
Complete POWIRTRAIN (IRPT1053C) with full set of design
documentation including schematic diagram, bill of material, mechanical layoutof Driver Board, schematic files, Gerber files and
design tips.
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IRPT1053A
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020
IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111
IR FAR EAST: 171 (K&H Bldg.), 30-4 Nishi-ikebukuro 3-Chome, Toshima-ku, Tokyo Japan Tel: 81 3 3983 0086
IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371
3/97
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