ETC IS61LV6424

ISSI
IS61LV6424
64K x 24 HIGH-SPEED CMOS STATIC RAM
WITH 3.3V SUPPLY
FEATURES
• High-speed access time: 9, 10, 12, 15 ns
• CMOS low power operation
❑ 594 mW (max.) operating @ 9 ns
❑ 36 mW (max.) CMOS standby
• TTL compatible interface levels
• Single 3.3V power supply
• Fully static operation: no clock or refresh
required
• Three state outputs
• Available in 100-pin TQFP
• Industrial temperature available
®
DECEMBER 2000
DESCRIPTION
The ISSI IS61LV6424 is a high-speed, static RAM organized
as 65,536 words by 24 bits. It is fabricated using ISSI's highperformance CMOS technology. This highly reliable process
coupled with innovative circuit design techniques, yields access times as fast as 9 ns with low power consumption.
When CE1 is HIGH or CE2 is LOW (deselected), the device
assumes a standby mode at which the power dissipation can
be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE1, CE2, and OE. The active LOW
Write Enable (WE) controls both writing and reading of the
memory.
The IS61LV6424 is packaged in the JEDEC standard
100-pin TQFP
FUNCTIONAL BLOCK DIAGRAM
VCC
GND
A0-A14
ROW
DECODER
A15
X/Y
V/S
MULTIPLEX
ADDRESS
CONTROL
CE1
CE2
OE
WE
CONTROL
CIRCUIT
64K x 24
MEMORY ARRAY
COLUMN
DECODER
I/O DATA
CIRCUIT
I/O0-I/O23
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any
errors which may appear in this publication. © Copyright 2000, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
1
ISSI
IS61LV6424
®
A14
A15
CE1
CE2
NC
NC
NC
X/Y
V/S
VCC
GND
NC
WE
NC
OE
NC
NC
NC
A0
A1
PIN CONFIGURATION
100-Pin TQFP
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
10
71
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
NC
NC
NC
NC
NC
I/O11
I/O10
I/O9
I/O8
GNDQ
VCCQ
I/O7
I/O6
GND
NC
VCC
NC
I/O5
I/O4
VCCQ
GNDQ
I/O3
I/O2
I/O1
I/O0
NC
NC
NC
NC
NC
NC
A13
A12
A11
A10
A9
A8
NC
NC
GND
VCC
NC
NC
A7
A6
A5
A4
A3
A2
NC
NC
NC
NC
NC
NC
I/O12
I/O13
I/O14
I/O15
GNDQ
VCCQ
I/O16
I/O17
NC
VCC
NC
GND
I/O18
I/O19
VCCQ
GNDQ
I/O20
I/O21
I/O22
I/O23
NC
NC
NC
NC
NC
PIN DESCRIPTIONS
2
A0-A14
Address Inputs
A15, X/Y
Multiplexed Address
I/O0-I/O23
Data Inputs/Outputs
CE1, CE2
Chip Enable Input
OE
Output Enable Input
WE
Write Enable Input
V/S
Address Multiplexer
NC
No Connection
VCC
Power
VCCQ
Isolated Output Buffer Supply
GND
Ground
GNDQ
Isolated Output Buffer Ground
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
ISSI
IS61LV6424
®
TRUTH TABLE
Mode
CE1
CE2
OE
WE
V/S
I/O0-I/O23
Vcc Current
H
X
L
L
L
L
L
X
L
H
H
H
H
H
X
X
L
L
X
X
H
X
X
H
H
L
L
H
X
X
H
L
H
L
X
High-Z
High-Z
DOUT
DOUT
DIN
DIN
High-Z
ISB1, ISB2
Not Selected
Read Using X/Y
Read Using A15
Write Using X/Y
Write Using A15
Output Disable
1
ICC
ICC
ICC
ICC
ICC
2
3
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VCC
VTERM
TSTG
TBIAS
PT
IOUT
Parameter
Power Supply Voltage Relative to GND
Terminal Voltage with Respect to GND
Storage Temperature
Temperature Under Bias:
Com.
Ind.
Power Dissipation
DC Output Current
Value
–0.5 to 5.0
–0.5 to Vcc + 0.5
–65 to + 150
–10 to + 85
–45 to + 90
2.0
±20
4
Unit
V
V
°C
°C
°C
W
mA
5
6
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these or
any other conditions above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
7
OPERATING RANGE
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
–40°C to +85°C
VCC (9, 10 ns)
3.3V + 10%, – 5%
3.3V + 10%, – 5%
8
VCC (12, 15 ns)
3.3V ± 10%
3.3V ± 10%
9
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
2.4
—
V
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
—
0.4
V
VIH
Input HIGH Voltage
2.2
VCC + 0.3
V
–0.3
0.8
V
Voltage(1)
VIL
Input LOW
ILI
Input Leakage
GND - VIN - VCC
–1
1
µA
ILO
Output Leakage
GND - VOUT - VCC, Outputs Disabled
–1
1
µA
10
11
12
Note:
1. VIL (min.) = –0.3V DC; VIL (min.) = –2.0V AC (pulse width - 2.0 ns).
VIH (max.) = VCC + 0.3V DC; VIH (max.) = VCC + 2.0V AC (pulse width - 2.0 ns).
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
3
ISSI
IS61LV6424
®
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
Symbol Parameter
Test Conditions
-9 ns
-10ns
-12 ns
-15 ns
Min. Max.
Min. Max.
Min. Max.
Min. Max.
Unit
ICC
Vcc Dynamic Operating VCC = Max.,
Supply Current
IOUT = 0 mA, f = fMAX
Com.
Ind.
—
—
165
170
—
—
150
155
—
—
125
130
—
—
100
105
mA
ISB1
TTL Standby Current
(TTL Inputs)
VCC = Max.,
VIN = VIH or VIL, f = max.
CE1 • VIH, CE2 - VIL
Com.
Ind.
—
—
40
45
—
—
40
45
—
—
35
40
—
—
30
25
mA
ISB2
CMOS Standby
Current (CMOS Inputs)
VCC = Max.,
Com.
CE1 • VCC – 0.2V,
Ind.
CE2 - 0.2V, VIN • VCC – 0.2V,
or VIN - 0.2V, f = 0
—
—
10
15
—
—
10
15
—
—
10
15
—
—
10
15
mA
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
CAPACITANCE(1)
Symbol
Parameter
CIN
Input Capacitance
COUT
Input/Output Capacitance
Conditions
Max.
Unit
VIN = 0V
6
pF
VOUT = 0V
8
pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0V to 3.0V
2 ns
1.5V
See Figures 1 and 2
AC TEST LOADS
319 Ω
3.3V
ZO = 50Ω
OUTPUT
50Ω
1.5V
Figure 1
4
OUTPUT
5 pF
Including
jig and
scope
353 Ω
Figure 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
ISSI
IS61LV6424
®
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-9
Symbol
Parameter
Min.
Max.
Min.
-10
Max.
-12
Min.
Max.
-15
Min. Max.
tRC
Read Cycle Time
9
—
10
—
12
—
15
—
ns
tAA
Address Access Time
—
9
—
10
—
12
—
15
ns
tAV
V/S Access Time
—
9
—
10
—
12
—
15
ns
tOH
Output Hold Time
From MUX Change
3
—
3
—
3
—
3
—
ns
tOHA
Output Hold Time
From Address Change
3
—
3
—
3
—
3
—
ns
tACE
tACE2
CE1Access Time
CE2 Access Time
—
9
—
10
—
12
—
15
ns
tDOE
OE Access Time
—
5
—
5
—
6
—
7
ns
tHZOE(2) OE to High-Z Output
0
3
0
3
0
3
0
3
ns
tLZOE(2) OE to Low-Z Output
0
—
0
—
0
—
0
—
ns
tHZCE CE1 to High-Z Output
tHZCE2(2) CE2 to High-Z Output
0
5
0
5
0
6
0
7
ns
tLZCE(2) CE to Low-Z Output
tLZCE2(2) CE2 to Low-Z Output
3
—
3
—
3
—
3
—
ns
(2)
1
Unit
2
3
4
5
6
Notes:
1. Test conditions assume signal transition times of 2 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±200 mV from steady-state voltage. Not 100% tested.
7
8
9
10
11
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
5
ISSI
IS61LV6424
®
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CE1= OE = VIL; CE2 = VIH)
t RC
ADDRESS
t AV
t OH
V/S
t AA
t OHA
DOUT
t OHA
DATA VALID
PREVIOUS DATA VALID
6424RD1.eps
READ CYCLE NO. 2(1,3)
t RC
ADDRESS
t AA
t OHA
OE
t HZOE
t DOE
t LZOE
CE1
CE2
t AV
V/S
t ACE1
t ACE2
t LZCE1
t LZCE2
DOUT
HIGH-Z
t HZCE1
t HZCE2
DATA VALID
6424CE2_RD2.eps
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE1= VIL. CE2 = VIH.
3. Address is valid prior to or coincident with CE1 LOW and CE2 HIGH transition.
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
ISSI
IS61LV6424
®
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-9
Symbol Parameter
Min.
Max.
Min.
-10
Max.
-12
Min.
Max.
-15
Min. Max.
Unit
tWC
Write Cycle Time
9
—
10
—
12
—
15
—
ns
tSCE
tSCE2
CE1 to Write End
CE2 to Write End
7
7
—
—
7
7
—
—
8
8
—
—
10
10
—
—
ns
tAW
Address Setup Time
to Write End
7
—
7
—
8
—
10
—
ns
tHA
Address Hold from Write End
0
—
0
—
0
—
0
—
ns
tSA
Address Setup Time
0
—
0
—
0
—
0
—
ns
tVS
V/S Setup Time
0
—
0
—
0
—
0
—
ns
tPWE1
WE Pulse Width (OE = HIGH)
7
—
7
—
8
—
10
—
ns
tPWE2
WE Pulse Width (OE = LOW)
9
—
10
—
12
—
15
—
ns
tSD
Data Setup to Write End
5
—
5
—
6
—
7
—
ns
tVW
V/S to Write End
7
—
7
—
8
—
10
—
ns
tHD
Data Hold from Write End
0
—
0
—
0
—
0
—
ns
(2)
WE LOW to High-Z Output
—
4
—
5
—
6
—
7
ns
tLZWE
WE HIGH to Low-Z Output
3
—
3
—
3
—
3
—
ns
tHZWE
(2)
1
2
3
4
5
6
Notes:
1. Test conditions assume signal transition times of 2 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V
and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±200 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE1, LOW, CE2 HIGH and WE LOW. All signals must be in valid states
to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced
to the rising or falling edge of the signal that terminates the write.
7
8
9
10
11
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
7
ISSI
IS61LV6424
®
WRITE CYCLE NO. 1 (CE Controlled, OE = HIGH or LOW)
t WC
VALID ADDRESS
ADDRESS
t SCE1
t SCE2
t SA
t HA
CE1
CE2
t VW
t VS
V/S
t AW
t PWE1
t PWE2
WE
t HZWE
DOUT
t LZWE
HIGH-Z
DATA UNDEFINED
t SD
t HD
DATAIN VALID
DIN
6424CE2_WR1.eps
WRITE CYCLE NO. 2(1) (WE Controlled: OE = HIGH during Write Cycle)
t WC
ADDRESS
VALID ADDRESS
t HA
OE
CE1
LOW
CE2
HIGH
t VW
t VS
V/S
t AW
t PWE1
WE
t HZWE
t SA
DOUT
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
6424CE2_WR2.eps
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
ISSI
IS61LV6424
®
WRITE CYCLE NO. 3(1) (WE Controlled: OE I S LOW DURING WRITE CYLE)
t WC
ADDRESS
1
VALID ADDRESS
OE
LOW
CE1
LOW
CE2
HIGH
t HA
2
3
t VW
V/S
t AW
4
t PWE2
WE
t SA
DOUT
t HZWE
DATA UNDEFINED
t LZWE
HIGH-Z
5
t SD
DIN
t HD
DATAIN VALID
6
6424CE2_WR3.eps
Note:
1. The internal Write time is defined by the overlap of CE1 = LOW, CE2 = HIGH and WE = LOW. All signals must be in valid
states to initiate a Write, but any can be deasserted to terminate the Write. The Data Input Setup and Hold timing is
referenced to the rising or falling edge of the signal that terminates the Write.
7
8
9
10
11
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00
9
ISSI
IS61LV6424
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
ORDERING INFORMATION
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No.
Speed (ns) Order Part No.
Package
®
Package
9
IS61LV6424-9TQ
TQFP
9
IS61LV6424-9TQI
TQFP
10
IS61LV6424-10TQ
TQFP
10
IS61LV6424-10TQI
TQFP
12
IS61LV6424-12TQ
TQFP
12
IS61LV6424-12TQI
TQFP
15
IS61LV6424-15TQ
TQFP
15
IS61LV6424-15TQI
TQFP
ISSI
®
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774
Fax: (408) 588-0806
E-mail: [email protected]
www.issi.com
10
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
12/19/00