ISSI IS61SP25618-133TQI 256k x 16, 256k x 18 synchronous pipelined static ram Datasheet

IS61SP25616
IS61SP25618
ISSI
®
256K x 16, 256K x 18 SYNCHRONOUS
PIPELINED STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Pentium™ or linear burst sequence control using
MODE input
• Three chip enables for simple depth expansion
and address pipelining
• Common data inputs and data outputs
• JEDEC 100-Pin TQFP and
119-pin PBGA package
• Single +3.3V, +10%, -5% power supply
• Power-down snooze mode
APRIL 2001
DESCRIPTION
The ISSI IS61SP25616 and IS61SP25618 is a high-speed
synchronous static RAM designed to provide a burstable,
high-performance memory for high speed networking and
communication applications. It is organized as 262,144
words by 16 bits and 18 bits, fabricated with ISSI's
advanced CMOS technology. The device integrates a 2-bit
burst counter, high-speed SRAM core, and high-drive
capability outputs into a single monolithic circuit. All
synchronous inputs pass through registers controlled by
a positive-edge-triggered single clock input.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock input. Write cycles can be from
one to four bytes wide as controlled by the write control
inputs.
Separate byte enables allow individual bytes to be written.
BW1 controls DQ1-8, BW2 controls DQ9-16, conditioned
by BWE being LOW. A LOW on GW input would cause all
bytes to be written.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be generated
internally and controlled by the ADV (burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW.
Interleave burst is achieved when this pin is tied HIGH or
left floating.
FAST ACCESS TIME
Symbol
tKQ
t KC
Parameter
Clock Access Time
Cycle Time
Frequency
-166
3.5
6
166
-150
3.8
6.7
150
-133
4
7.5
133
-5
5
10
100
Units
ns
ns
MHz
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any
errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
1
IS61SP25616
IS61SP25618
ISSI
®
BLOCK DIAGRAM
MODE
ADV
CLK
BURST
COUNTER
ADSC
CLK2
2
18
256K x 16/256K x 18
MEMORY ARRAY
CLR
ADSP
A2-A17
A1
A0
2
18
16
ADDRESS
REGISTER
16 or 18
GW
16 or 18
BWE
BW1
BW2
BW1
BYTE WRITE
REGISTER
BW2
BYTE WRITE
REGISTER
2
CLK
CLK2
CE1
CE2
ENABLE
REGISTER
DATA
INPUT
REGISTER
DATA
OUTPUT
REGISTER
CLK
ENABLE
REGISTER
CE2
OE
DQ1 - DQ16
or
DQ1 - DQ18
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61SP25616
IS61SP25618
ISSI
®
PIN CONFIGURATION
100-Pin TQFP
1
2
3
4
5
6
7
VCCQ
A6
A4
ADSP
A8
A16
VCCQ
NC
CE2
A3
ADSC
A9
CE2
NC
NC
A7
A2
VCC
A12
A15
NC
DQ9
NC
GND
NC
GND
NC
NC
NC
DQ10
GND
CE
GND
NC
DQ8
VCCQ
NC
GND
OE
GND
DQ7
VCCQ
NC
DQ11
BW2
ADV
GND
NC
DQ6
DQ12
NC
GND
GW
GND
DQ5
NC
VCCQ
VCC
NC
VCC
NC
VCC
VCCQ
NC
DQ13
GND
CLK
GND
NC
DQ4
DQ14
NC
GND
NC
BW1
DQ3
NC
VCCQ
DQ15
GND
BWE
GND
NC
VCCQ
DQ16
NC
GND
A1
GND
DQ2
NC
NC
NC
GND
A0
GND
NC
DQ1
NC
A5
MODE
VCC
NC
A13
NC
NC
A11
A10
NC
A14
A17
ZZ
VCCQ
NC
NC
NC
NC
NC
VCCQ
A
B
A6
A7
CE
CE2
NC
NC
BW2
BW1
CE2
VCC
GND
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A8
A9
119-pin PBGA (Top View)
NC
NC
NC
VCCQ
GND
NC
NC
DQ9
DQ10
GND
VCCQ
DQ11
DQ12
NC
VCC
NC
GND
DQ13
DQ14
VCCQ
GND
DQ15
DQ16
NC
NC
GND
VCCQ
NC
NC
NC
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A17
NC
NC
VCCQ
GND
NC
NC
DQ8
DQ7
GND
VCCQ
DQ6
DQ5
GND
NC
VCC
ZZ
DQ4
DQ3
VCCQ
GND
DQ2
DQ1
NC
NC
GND
VCCQ
NC
NC
NC
MODE
A5
A4
A3
A2
A1
A0
NC
NC
GND
VCC
NC
NC
A10
A11
A12
A13
A14
A15
A16
U
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
80
1
79
2
78
3
77
4
76
5
75
6
74
7
73
8
72
9
71
10
70
11
69
12
68
13
67
14
66
15
65
16
64
17
63
18
62
19
61
20
60
21
59
22
58
23
57
24
56
25
55
26
54
27
53
28
52
29
51
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
256K x 16
PIN DESCRIPTIONS
A0, A1
Synchronous Address Inputs. These
pins must tied to the two LSBs of the
address bus.
A2-A17
Synchronous Address Inputs
CLK
Synchronous Clock
ADSP
Synchronous Processor Address
Status
BWE
Synchronous Byte Write Enable
GW
Synchronous Global Write Enable
CE, CE2, CE2 Synchronous Chip Enable
OE
Output Enable
DQ1-DQ16
Synchronous Data Input/Output
MODE
Burst Sequence Mode Selection
ADSC
Synchronous Controller Address
Status
VCC
+3.3V Power Supply
GND
Ground
ADV
Synchronous Burst Address Advance
VCCQ
Isolated Output Buffer Supply: +3.3V
BW1-BW2
Synchronous Byte Write Enable
ZZ
Snooze Enable
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
3
IS61SP25616
IS61SP25618
ISSI
®
PIN CONFIGURATION
100-Pin TQFP
1
2
3
4
5
6
7
VCCQ
A6
A4
ADSP
A8
A16
VCCQ
NC
CE2
A3
ADSC
A9
CE2
NC
NC
A7
A2
VCC
A12
A15
NC
DQ9
NC
GND
NC
GND
DQP1
NC
NC
DQ10
GND
CE
GND
NC
DQ8
VCCQ
NC
GND
OE
GND
DQ7
VCCQ
NC
DQ11
BW2
ADV
GND
NC
DQ6
DQ12
NC
GND
GW
GND
DQ5
NC
VCCQ
VCC
NC
VCC
NC
VCC
VCCQ
NC
DQ13
GND
CLK
GND
NC
DQ4
DQ14
NC
GND
NC
BW1
DQ3
NC
VCCQ
DQ15
GND
BWE
GND
NC
VCCQ
DQ16
NC
GND
A1
GND
DQ2
NC
NC
DQP2
GND
A0
GND
NC
DQ1
NC
A5
MODE
VCC
GND
A13
NC
NC
A11
A10
NC
A14
A17
ZZ
VCCQ
NC
NC
NC
NC
NC
VCCQ
A
B
A6
A7
CE
CE2
NC
NC
BW2
BW1
CE2
VCC
GND
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A8
A9
119-pin PBGA (Top View)
NC
NC
NC
VCCQ
GND
NC
NC
DQ9
DQ10
GND
VCCQ
DQ11
DQ12
NC
VCC
NC
GND
DQ13
DQ14
VCCQ
GND
DQ15
DQ16
DQP2
NC
GND
VCCQ
NC
NC
NC
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A17
NC
NC
VCCQ
GND
NC
DQP1
DQ8
DQ7
GND
VCCQ
DQ6
DQ5
GND
NC
VCC
ZZ
DQ4
DQ3
VCCQ
GND
DQ2
DQ1
NC
NC
GND
VCCQ
NC
NC
NC
MODE
A5
A4
A3
A2
A1
A0
NC
NC
GND
VCC
NC
NC
A10
A11
A12
A13
A14
A15
A16
U
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
80
1
79
2
78
3
77
4
76
5
75
6
74
7
73
8
72
9
71
10
70
11
69
12
68
13
67
14
66
15
65
16
64
17
63
18
62
19
61
20
60
21
59
22
58
23
57
24
56
25
55
26
54
27
53
28
52
29
51
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
256K x 18
PIN DESCRIPTIONS
A0, A1
GW
Synchronous Global Write Enable
CE, CE2, CE2 Synchronous Chip Enable
OE
Output Enable
DQ1-DQ16
Synchronous Data Input/Output
MODE
Burst Sequence Mode Selection
VCC
+3.3V Power Supply
Synchronous Controller Address
Status
GND
Ground
VCCQ
Isolated Output Buffer Supply: +3.3V
ADV
Synchronous Burst Address Advance
ZZ
Snooze Enable
BW1-BW2
Synchronous Byte Write Enable
DQP1-DQP2
BWE
Synchronous Byte Write Enable
Parity Data I/O DQP1 is parity for DQ1-8;
DQP2 is parity for DQ9-16
A2-A17
Synchronous Address Inputs
CLK
Synchronous Clock
ADSP
Synchronous Processor Address
Status
ADSC
4
Synchronous Address Inputs. These
pins must tied to the two LSBs of the
address bus.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61SP25616
IS61SP25618
ISSI
®
TRUTH TABLE
Operation
Deselected, Power-down
Deselected, Power-down
Deselected, Power-down
Deselected, Power-down
Deselected, Power-down
Read Cycle, Begin Burst
Read Cycle, Begin Burst
Write Cycle, Begin Burst
Read Cycle, Continue Burst
Read Cycle, Continue Burst
Read Cycle, Continue Burst
Read Cycle, Continue Burst
Write Cycle, Continue Burst
Write Cycle, Continue Burst
Read Cycle, Suspend Burst
Read Cycle, Suspend Burst
Read Cycle, Suspend Burst
Read Cycle, Suspend Burst
Write Cycle, Suspend Burst
Write Cycle, Suspend Burst
Address
Used
None
None
None
None
None
External
External
External
Next
Next
Next
Next
Next
Next
Current
Current
Current
Current
Current
Current
CE
H
L
L
X
X
L
L
L
X
X
H
H
X
H
X
X
H
H
X
H
CE2
X
X
L
X
L
H
H
H
X
X
X
X
X
X
X
X
X
X
X
X
CE2
X
H
X
H
X
L
L
L
X
X
X
X
X
X
X
X
X
X
X
X
ADSP ADSC
X
L
L
X
L
X
H
L
H
L
L
X
H
L
H
L
H
H
H
H
X
H
X
H
H
H
X
H
H
H
H
H
X
H
X
H
H
H
X
H
ADV WRITE
X
X
X
X
X
X
X
X
X
X
X
X
X
Read
X
Write
L
Read
L
Read
L
Read
L
Read
L
Write
L
Write
H
Read
H
Read
H
Read
H
Read
H
Write
H
Write
OE
X
X
X
X
X
X
X
X
L
H
L
H
X
X
L
H
L
H
X
X
DQ
High-Z
High-Z
High-Z
High-Z
High-Z
Q
Q
D
Q
High-Z
Q
High-Z
D
D
Q
High-Z
Q
High-Z
D
D
PARTIAL TRUTH TABLE
Function
Read
Read
Write Byte 1
Write All Bytes
Write All Bytes
GW
H
H
H
H
L
BWE
H
L
L
L
X
BW1
X
H
L
L
X
BW2
X
H
H
L
X
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
5
IS61SP25616
IS61SP25618
ISSI
®
INTERLEAVED BURST ADDRESS TABLE (MODE = VCC or No Connect)
External Address
A1 A0
00
01
10
11
1st Burst Address
A1 A0
01
00
11
10
2nd Burst Address
A1 A0
10
11
00
01
3rd Burst Address
A1 A0
11
10
01
00
LINEAR BURST ADDRESS TABLE (MODE = GND)
0,0
A1', A0' = 1,1
0,1
1,0
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
TBIAS
TSTG
PD
IOUT
VIN, VOUT
VIN
VCC
Parameter
Value
Unit
Temperature Under Bias
–40 to +85
°C
Storage Temperature
–55 to +150
°C
Power Dissipation
1.6
W
Output Current (per I/O)
100
mA
Voltage Relative to GND for I/O Pins
–0.5 to VCCQ + 0.3
V
Voltage Relative to GND for
–0.5 to VCC + 0.5
V
for Address and Control Inputs
Voltage on Vcc Supply Relatiive to GND
–0.5 to 4.6
V
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. This device contains circuitry to protect the inputs against damage due to high static voltages
or electric fields; however, precautions may be taken to avoid application of any voltage higher
than maximum rated voltages to this high-impedance circuit.
3. This device contains circuitry that will ensure the output devices are in High-Z at power up.
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61SP25616
IS61SP25618
ISSI
®
OPERATING RANGE
Range
Ambient Temperature
VCC
0°C to +70°C
3.3V, +10%, –5%
–40°C to +85°C
3.3V, +10%, –5%
Commercial
Industrial
DC ELECTRICAL CHARACTERISTICS(1) (Over Operating Range)
Symbol
VOH
VOL
VIH
VIL
ILI
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage Current
Test Conditions
IOH = –4.0 mA
IOL = 8.0 mA
ILO
Output Leakage Current
GND ≤ VOUT ≤ VCCQ, OE = VIH
GND ≤ VIN ≤ VCCQ(2)
Com.
Ind.
Com.
Ind.
Min.
2.4
—
2.0
–0.3
–2
–5
–2
–5
Max.
—
0.4
VCCQ + 0.3
0.8
2
5
2
5
Unit
V
V
V
V
µA
µA
POWER SUPPLY CHARACTERISTICS (Over Operating Range)
Symbol
ICC
Parameter
AC Operating
Supply Current
ISB
Standby Current
IZZ
Power-down Mode
Current
Test Conditions
Device Selected,
Com.
All Inputs = VIL or VIH
Ind.
OE = VIH, Vcc = Max.
Cycle Time ≥ tKC min.
Device Deselected,
Com.
VCC = Max.,
Ind.
All Inputs = VIH or VIL
CLK Cycle Time ≥ tKC min.
ZZ = VCC
Com.
Clock Running
Ind.
All Inputs ≤ GND + 0.2V
or ≥ Vcc – 0.2V
-166
Max.
210
—
-150
Max.
190
200
-133
Max
170
180
-5
Max.
160
170
Unit
mA
mA
60
—
60
70
60
70
60
70
mA
mA
15
—
15
20
15
20
15
20
mA
mA
Notes:
1. The MODE pin has an internal pullup. This pin may be a No Connect, tied to GND, or tied to VCC.
2. The MODE pin could be tied to Vcc or GND. It exhibits ±10 µA maximum leakage current when tied to ≤ GND + 0.2V
or ≥ Vcc – 0.2V.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
7
IS61SP25616
IS61SP25618
ISSI
®
CAPACITANCE(1,2)
Symbol
CIN
COUT
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
VIN = 0V
VOUT = 0V
Max.
6
8
Unit
pF
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 3.3V.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0V to 3.0V
1.5 ns
1.5V
See Figures 1 and 2
AC TEST LOADS
317 Ω
ZO = 50Ω
Output
Buffer
30 pF
3.3V
OUTPUT
50Ω
5 pF
Including
jig and
scope
1.5V
Figure 1
8
351 Ω
Figure 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61SP25616
IS61SP25618
ISSI
®
READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
Symbol
fMAX(3)
tKC(3)
tKH
tKL(3)
tKQ(3)
tKQX(1)
tKQLZ(1,2)
tKQHZ(1,2)
tOEQ(3)
tOEQX(1)
tOELZ(1,2)
tOEHZ(1,2)
tAS(3)
tSS(3)
tWS(3)
tCES(3)
tAVS(3)
tAH(3)
tSH(3)
tWH(3)
tCEH(3)
tAVH(3)
Parameter
Clock Frequency
Cycle Time
Clock High Time
Clock Low Time
Clock Access Time
Clock High to Output Invalid
Clock High to Output Low-Z
Clock High to Output High-Z
Output Enable to Output Valid
Output Disable to Output Invalid
Output Enable to Output Low-Z
Output Disable to Output High-Z
Address Setup Time
Address Status Setup Time
Write Setup Time
Chip Enable Setup Time
Address Advance Setup Time
Address Hold Time
Address Status Hold Time
Write Hold Time
Chip Enable Hold Time
Address Advance Hold Time
-166
Min. Max.
—
166
6
—
2.4
—
2.4
—
—
3.5
3
—
0
—
1.5
3.5
—
3.5
0
—
0
—
2
3.5
2
—
2
—
2
—
2
—
2
—
0.5
—
0.5
—
0.5
—
0.5
—
0.5
—
-150
Min. Max.
—
150
6.7
—
2.6
—
2.6
—
—
3.8
3
—
0
—
1.5
3.5
—
3.5
0
—
0
—
2
3.5
2
—
2
—
2
—
2
—
2
—
0.5
—
0.5
—
0.5
—
0.5
—
0.5
—
-133
Min. Max.
—
133
7.5
—
2.8
—
2.8
—
—
4
3
—
0
—
1.5
3.5
—
3.8
0
—
0
—
2
3.8
2
—
2
—
2
—
2
—
2
—
0.5
—
0.5
—
0.5
—
0.5
—
0.5
—
-5
Min.
—
10
3
3
—
3
0
1.5
—
0
0
2
2
2
2
2
2
0.5
0.5
0.5
0.5
0.5
Max.
100
—
—
—
5
—
—
3.5
5
—
—
5
—
—
—
—
—
—
—
—
—
—
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Note:
1. Guaranteed but not 100% tested. This parameter is periodically sampled.
2. Tested with load in Figure 2.
3. Tested with load in Figure 1.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
9
IS61SP25616
IS61SP25618
ISSI
®
READ/WRITE CYCLE TIMING
tKC
CLK
tSS
tSH
tKH
tKL
ADSP is blocked by CE inactive
ADSP
tSS
tSH
ADSC initiate read
ADSC
tAVH
tAVS
Suspend Burst
ADV
tAS
A17-A0
tAH
RD1
RD2
tWS
tWH
tWS
tWH
RD3
GW
BWE
BW2-BW1
tCES
tCEH
tCES
tCEH
tCES
tCEH
CE Masks ADSP
CE
Unselected with CE2
CE2 and CE2 only sampled with ADSP or ADSC
CE2
CE2
tOEHZ
tOEQ
OE
DATAOUT
tKQX
tOEQX
tOELZ
High-Z
1a
2a
2b
2c
2d
tKQLZ
3a
tKQHZ
tKQ
DATAIN
High-Z
Pipelined Read
Single Read
10
Burst Read
Unselected
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61SP25616
IS61SP25618
ISSI
®
WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-166
Symbol
tKC(1)
tKH(1)
tKL(1)
tAS(1)
tSS(1)
tWS(1)
tDS(1)
tCES(1)
tAVS(1)
tAH(1)
tSH(1)
tDH(1)
tWH(1)
tCEH(1)
tAVH(1)
Parameter
Cycle Time
Clock High Time
Clock Low Time
Address Setup Time
Address Status Setup Time
Write Setup Time
Data In Setup Time
Chip Enable Setup Time
Address Advance Setup Time
Address Hold Time
Address Status Hold Time
Data In Hold Time
Write Hold Time
Chip Enable Hold Time
Address Advance Hold Time
Min.
6
2.4
2.4
2
2
2
2
2
2
0.5
0.5
0.5
0.5
0.5
0.5
Max.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
-150
Min.
6.7
2.6
2.6
2
2
2
2
2
2
0.5
0.5
0.5
0.5
0.5
0.5
Max.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
-133
Min.
7.5
2.8
2.8
2
2
2
2
2
2
0.5
0.5
0.5
0.5
0.5
0.5
-5
Max.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Min.
10
4
4
2
2
2
2
2
2
0.5
0.5
0.5
0.5
0.5
0.5
Max.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Note:
1. Tested with load in Figure 1.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
11
IS61SP25616
IS61SP25618
ISSI
®
WRITE CYCLE TIMING
tKC
CLK
tSS
tSH
tKH
tKL
ADSP is blocked by CE inactive
ADSP
ADSC initiate Write
ADSC
tAVH
ADV must be inactive for ADSP Write tAVS
ADV
tAS
A17-A0
tAH
WR1
WR2
tWS
tWH
tWS
tWH
tWS
tWH
WR3
GW
BWE
BW2-BW1
WR1
tCES
tCEH
tCES
tCEH
tCES
tCEH
tWS
tWH
WR2
WR3
CE Masks ADSP
CE
Unselected with CE2
CE2 and CE2 only sampled with ADSP or ADSC
CE2
CE2
OE
DATAOUT
High-Z
tDS
DATAIN
High-Z
Single Write
12
tDH
1a
BW4-BW1 only are applied to first cycle of WR2
2a
2b
Burst Write
2c
2d
3a
Write
Unselected
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61SP25616
IS61SP25618
ISSI
®
SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
Symbol
tKC(3)
tKH(3)
tKL(3)
tKQ(3)
tKQX(1)
tKQLZ(1,2)
tKQHZ(1,2)
tOEQ(3)
tOEQX(1)
tOELZ(1,2)
tOEHZ(1,2)
tAS(3)
tSS(3)
tCES(3)
tAH(3)
tSH(3)
tCEH(3)
tZZS
tZZREC
Parameter
Cycle Time
Clock High Time
Clock Low Time
Clock Access Time
Clock High to Output Invalid
Clock High to Output Low-Z
Clock High to Output High-Z
Output Enable to Output Valid
Output Disable to Output Invalid
Output Enable to Output Low-Z
Output Disable to Output High-Z
Address Setup Time
Address Status Setup Time
Chip Enable Setup Time
Address Hold Time
Address Status Hold Time
Chip Enable Hold Time
ZZ Standby
ZZ Recovery
-166
Min.
6
2.4
2.4
—
1.5
0
1.5
—
0
0
2
2
2
2
0.5
0.5
0.5
2
2
Max.
—
—
—
3.5
—
—
3.5
3.5
—
—
3.5
—
—
—
—
—
—
—
—
-150
Min.
6.7
2.6
2.6
—
1.5
0
1.5
—
0
0
2
2
2
2
0.5
0.5
0.5
2
2
Max.
—
—
—
3.8
—
—
3.5
3.5
—
—
3.5
—
—
—
—
—
—
—
—
-133
Min.
7.5
2.8
2.8
—
1.5
0
1.5
—
0
0
2
2
2
2
0.5
0.5
0.5
2
2
-5
Max.
—
—
—
4
—
—
3.5
3.9
—
—
3.8
—
—
—
—
—
—
—
—
Min.
10
4
4
—
2.5
0
1.5
—
0
0
2
2
2
2
0.5
0.5
0.5
2
2
Max.
—
—
—
5
—
—
3.5
5
—
—
5
—
—
—
—
—
—
—
—
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
Notes:
1. Guaranteed but not 100% tested. This parameter is periodically sampled.
2. Tested with load in Figure 2.
3. Tested with load in Figure 1.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
13
IS61SP25616
IS61SP25618
ISSI
®
SNOOZE AND RECOVERY CYCLE TIMING
tKC
CLK
tSS
tSH
tAS
tAH
tKH
tKL
ADSP
ADSC
ADV
A17-A0
RD2
RD1
GW
BWE
BW2-BW1
tCES
tCEH
tCES
tCEH
tCES
tCEH
CE
CE2
CE2
tOEHZ
tOEQ
OE
tOEQX
tOELZ
DATAOUT
High-Z
1a
tKQLZ
tKQ
DATAIN
tKQX
tKQHZ
High-Z
tZZS
tZZREC
ZZ
Single Read
14
Snooze with Data Retention
Read
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61SP25616
IS61SP25618
ISSI
ORDERING INFORMATION
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Commercial Range: 0°C to +70°C
Speed
166 MHz
150 MHz
133 MHz
5 ns
Order Part Number
IS61SP25616-166TQ
IS61SP25616-166B
IS61SP25616-150TQ
IS61SP25616-150B
IS61SP25616-133TQ
IS61SP25616-133B
IS61SP25616-5TQ
IS61SP25616-5B
Package
TQFP
PBGA
TQFP
PBGA
TQFP
PBGA
TQFP
PBGA
Industrial Range: –40°C to +85°C
Speed
150 MHz
133 MHz
5 ns
Order Part Number
IS61SP25616-150TQI
IS61SP25616-133TQI
IS61SP25616-5TQI
Speed
166 MHz
150 MHz
133 MHz
5 ns
Order Part Number
IS61SP25618-166TQ
IS61SP25618-166B
IS61SP25618-150TQ
IS61SP25618-150B
IS61SP25618-133TQ
IS61SP25618-133B
IS61SP25618-5TQ
IS61SP25618-5B
®
Package
TQFP
PBGA
TQFP
PBGA
TQFP
PBGA
TQFP
PBGA
Industrial Range: –40°C to +85°C
Package
TQFP
TQFP
TQFP
Speed
150 MHz
133 MHz
5 ns
Order Part Number
IS61SP25618-150TQI
IS61SP25618-133TQI
IS61SP25618-5TQI
Package
TQFP
TQFP
TQFP
ISSI
®
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774
Fax: (408) 588-0806
E-mail: [email protected]
www.issi.com
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
15
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