ISSI IS62C1024AL-35TI 128k x 8 low power cmos static ram Datasheet

IS62C1024AL
IS65C1024AL
ISSI
128K x 8 LOW POWER CMOS
STATIC RAM
®
JANUARY 2005
FEATURES
DESCRIPTION
• High-speed access time: 35, 45 ns
• Low active power: 100 mW (typical)
• Low standby power: 20 µW (typical) CMOS
standby
• Output Enable (OE) and two Chip Enable
(CE1 and CE2) inputs for ease in applications
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 5V (±10%) power supply
• Commercial, Industrial, and Automotive temperature ranges available
• Standard Pin Configuration:
— 32-pin SOP/ 32-pin TSOP (Type 1)
• Lead free available
The ISSI IS62C1024AL/IS65C1024AL is a low power, 131,072word by 8-bit CMOS static RAM. It is fabricated using highperformance CMOS technology. This highly reliable process coupled with innovative circuit design techniques,
yields higher performance and low power consumption
devices.
When CE1 is HIGH or CE2 is LOW (deselected), the device
assumes a standby mode at which the power dissipation
can be reduced by using CMOS input levels.
Easy memory expansion is provided by using two Chip
Enable inputs, CE1 and CE2. The active LOW Write Enable
(WE) controls both writing and reading of the memory.
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
128K x 8
MEMORY ARRAY
VDD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE1
CE2
OE
WE
CONTROL
CIRCUIT
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
01/24/05
1
ISSI
IS62C1024AL
IS65C1024AL
PIN CONFIGURATION
PIN CONFIGURATION
32-Pin SOP
32-Pin TSOP (Type 1)
NC
1
32
VDD
A16
2
31
A15
A14
3
30
CE2
A12
4
29
WE
A7
5
28
A13
A6
6
27
A8
A5
7
26
A9
A4
8
25
A11
A3
9
24
OE
A2
10
23
A10
A1
11
22
CE1
A0
12
21
I/O7
I/O0
13
20
I/O6
I/O1
14
19
I/O5
I/O2
15
18
I/O4
GND
16
17
I/O3
A11
A9
A8
A13
WE
CE2
A15
VDD
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
®
OE
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
PIN DESCRIPTIONS
A0-A16
Address Inputs
CE1
Chip Enable 1 Input
CE2
Chip Enable 2 Input
OE
Output Enable Input
WE
Write Enable Input
Range
Commercial
Ambient Temperature
0°C to +70°C
VDD
5V ± 10%
I/O0-I/O7
Input/Output
Industrial
-40°C to +85°C
5V ± 10%
VDD
Power
GND
Ground
OPERATING RANGE (IS62C1024AL)
OPERATING RANGE (IS65C1024AL)
Range
Automotive
Ambient Temperature
-40°C to +125°C
VDD
5V ± 10%
TRUTH TABLE
Mode
Not Selected
(Power-down)
Output Disabled
Read
Write
2
WE
CE1
CE2
OE
I/O Operation
X
X
H
H
L
H
X
L
L
L
X
L
H
H
H
X
X
H
L
X
High-Z
High-Z
High-Z
DOUT
DIN
VDD Current
ISB1, ISB2
ISB1, ISB2
ICC
ICC
ICC
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Rev. C
01/24/05
ISSI
IS62C1024AL
IS65C1024AL
®
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VTERM
TSTG
PT
IOUT
Parameter
Terminal Voltage with Respect to GND
Storage Temperature
Power Dissipation
DC Output Current (LOW)
Value
–0.5 to +7.0
–65 to +125
1.0
20
Unit
V
°C
W
mA
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
CAPACITANCE(1,2)
Symbol
Parameter
CIN
Input Capacitance
COUT
Output Capacitance
Conditions
Max.
Unit
VIN = 0V
6
pF
VOUT = 0V
8
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, VDD = 5.0V.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions
VOH
VOL
VIH
VIL
ILI
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage(1)
Input Leakage
VDD = Min., IOH = –1.0 mA
VDD = Min., IOL = 2.1 mA
ILO
Output Leakage
GND ≤ VOUT ≤ VDD
CE1 = VIH, or
CE2 = VIL, or OE = VIH or
WE = VIL
GND ≤ VIN ≤ VDD
Options
Min.
Max.
Unit
Com.
Ind.
Auto.
Com.
Ind.
Auto.
2.4
—
2.2
-0.5
-1
-2
-5
-1
-2
-5
—
0.4
VDD + 0.5
0.8
1
2
5
1
2
5
V
V
V
V
µA
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Rev. C
01/24/05
µA
3
ISSI
IS62C1024AL
IS65C1024AL
®
IS62C1024AL/IS65C1024AL
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-35 ns
Min. Max.
Symbol Parameter
Test Conditions
ICC
CE1 = VIL, CE2 = VIH
VIN = VIH or VIL,
I I/O= 0 mA
Com.
Ind.
Auto.
—
—
VDD = Max., CE1 = VIL
IOUT = 0 mA, f = fMAX
VIN = VIH or VIL
CE2 = VIH
Com.
Ind.
Auto.
typ.(2)
—
—
30
35
—
20
VDD = Max.,
VIN = VIH or VIL, CE1 ≥ VIH,
or CE2 ≤ VIL, f = 0
Com.
Ind.
Auto.
—
—
1
1.5
VDD = Max.,
CE1 ≥ VDD – 0.2V, or
CE2 ≤ 0.2V, VIN ≥ VDD – 0.2V,
or VIN ≤ VSS + 0.2V, f = 0
Com.
Ind.
Auto.
typ.(2)
—
—
5
10
—
4
Average operating
Current
ICC1
VDD Dynamic Operating
Supply Current
TTL Standby Current
(TTL Inputs)
ISB1
ISB2
CMOS Standby
Current (CMOS Inputs)
-45 ns
Min. Max.
25
30
Unit
mA
—
35
mA
—
40
mA
—
2
µA
—
15
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical Values are measured at VDD = 5V, TA = 25oC and not 100% tested.
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
Symbol
-35 ns
Min.
Max.
Parameter
-45 ns
Min.
Max.
Unit
tRC
Read Cycle Time
35
—
45
—
ns
tAA
Address Access Time
—
35
—
45
ns
tOHA
Output Hold Time
3
—
3
—
ns
tACE1
CE1 Access Time
—
35
—
45
ns
tACE2
CE2 Access Time
—
35
—
45
ns
tDOE
OE Access Time
—
10
—
20
ns
tLZOE(2)
OE to Low-Z Output
3
—
5
—
ns
tHZOE
OE to High-Z Output
0
10
0
15
ns
(2)
tLZCE1
CE1 to Low-Z Output
3
—
5
—
ns
tLZCE2(2)
CE2 to Low-Z Output
3
—
5
—
ns
tHZCE(2)
CE1 or CE2 to High-Z Output
0
10
0
15
ns
(2)
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of
0.6 to 2.4V and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
01/24/05
ISSI
IS62C1024AL
IS65C1024AL
®
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0.6V to 2.4V
5 ns
1.5V
See Figures 1a and 1b
AC TEST LOADS
1838 Ω
1838 Ω
5V
5V
OUTPUT
OUTPUT
100 pF
Including
jig and
scope
993 Ω
5 pF
Including
jig and
scope
Figure 1a.
993 Ω
Figure 1b.
AC WAVEFORMS
READ CYCLE NO. 1(1,2)
tRC
ADDRESS
tAA
tOHA
DOUT
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Rev. C
01/24/05
tOHA
DATA VALID
5
ISSI
IS62C1024AL
IS65C1024AL
®
READ CYCLE NO. 2(1,3)
tRC
ADDRESS
tAA
tOHA
OE
tHZOE
tDOE
CE1
tLZOE
tACE1/tACE2
CE2
tLZCE1/
tLZCE2
tHZCE
HIGH-Z
DOUT
DATA VALID
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE1 = VIL, CE2 = VIH.
3. Address is valid prior to or coincident with CE1 LOW and CE2 HIGH transitions.
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range, Standard and Low Power)
Symbol
-35 ns
Min.
Max.
Parameter
-45 ns
Min. Max.
Unit
tWC
Write Cycle Time
35
—
45
—
ns
tSCE1
CE1 to Write End
25
—
35
—
ns
tSCE2
CE2 to Write End
25
—
35
—
ns
tAW
Address Setup Time to Write End
25
—
35
—
ns
tHA
Address Hold from Write End
0
—
0
—
ns
Address Setup Time
0
—
0
—
ns
tPWE
WE Pulse Width
25
—
35
—
ns
tSD
Data Setup to Write End
20
—
25
—
ns
tSA
(4)
tHD
Data Hold from Write End
0
—
0
—
ns
(2)
tHZWE
WE LOW to High-Z Output
—
10
—
15
ns
tLZWE
(2)
WE HIGH to Low-Z Output
3
—
5
—
ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0.6 to 2.4V
and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE1 LOW, CE2 HIGH and WE LOW. All signals must be in valid states to
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the
rising or falling edge of the signal that terminates the Write.
4. Tested with OE HIGH.
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
01/24/05
ISSI
IS62C1024AL
IS65C1024AL
®
AC WAVEFORMS
WE Controlled)(1,2)
WRITE CYCLE NO. 1 (WE
tWC
ADDRESS
tHA
tSCE1
CE1
tSCE2
CE2
tAW
tPWE(4)
WE
tSA
DOUT
tHZWE
tLZWE
HIGH-Z
DATA UNDEFINED
tSD
DIN
tHD
DATA-IN VALID
CE1
WRITE CYCLE NO. 2 (CE1
CE1, CE2 Controlled)(1,2)
tWC
ADDRESS
tSA
tHA
tSCE1
CE1
tSCE2
CE2
tAW
tPWE(4)
WE
tHZWE
DOUT
DATA UNDEFINED
tLZWE
HIGH-Z
tSD
DIN
tHD
DATA-IN VALID
Notes:
1. The internal write time is defined by the overlap of CE1 LOW, CE2 HIGH and WE LOW. All signals must be in valid states to
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the
rising or falling edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE = VIH.
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Rev. C
01/24/05
7
ISSI
IS62C1024AL
IS65C1024AL
®
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol
Parameter
Test Condition
Min.
VDR
VDD for Data Retention
See Data Retention Waveform
2.0
IDR
Data Retention Current
VDD = 2.0V, CE1 ≥ VDD – 0.2V
or CE2 ≤ 0.2V
VIN ≥ VDD – 0.2V, or VIN ≤ VSS + 0.2V
tSDR
Data Retention Setup Time
See Data Retention Waveform
tRDR
Recovery Time
See Data Retention Waveform
Com.
Ind.
Auto.
Max.
Unit
5.5
V
5
10
15
µA
0
—
ns
tRC
—
ns
—
—
—
Typ.
—
—
—
Note:
1. Typical Values are measured at VDD = 5V, TA = 25oC and not 100% tested.
DATA RETENTION WAVEFORM (CE1
CE1 Controlled)
Data Retention Mode
tSDR
tRDR
VDD
4.5V
2.2V
VDR
CE1 ≥ VDD - 0.2V
CE1
GND
DATA RETENTION WAVEFORM (CE2 Controlled)
Data Retention Mode
VDD
4.5V
CE2
2.2V
tSDR
tRDR
VDR
0.4V
CE2 ≤ 0.2V
GND
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
01/24/05
ISSI
IS62C1024AL
IS65C1024AL
®
ORDERING INFORMATION: IS62C1024AL
Commercial Range: 0°C to +70°C
Speed (ns)
35
35
Order Part No.
Package
IS62C1024AL-35Q
IS62C1024AL-35T
Plastic SOP
TSOP, Type 1
Industrial Range: –40°C to +85°C
Speed (ns)
35
35
35
35
Order Part No.
Package
IS62C1024AL-35QI
IS62C1024AL-35QLI
IS62C1024AL-35TI
IS62C1024AL-35TLI
Plastic SOP
Plastic SOP, Lead-free
TSOP, Type 1
TSOP, Type 1, Lead-free
ORDERING INFORMATION: IS65C1024AL
Automotive Range: -40°C to +125°C
Speed (ns)
45
45
Order Part No.
Package
IS65C1024AL-45QA3
IS65C1024AL-45TA3
Plastic SOP
TSOP, Type 1
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Rev. C
01/24/05
9
ISSI
®
PACKAGING INFORMATION
450-mil Plastic SOP
Package Code: Q (32-pin)
N
E1
E
1
D
SEATING PLANE
A
S
MILLIMETERS
Symbol
No. Leads
A
A1
B
C
D
E
E1
e
L
α
S
Min.
L
B
e
A1
INCHES
Max.
Min.
Max.
32
—
3.00
0.10
—
0.36
0.51
0.15
0.30
20.14
20.75
13.87
14.38
11.18
11.43
1.27 BSC
0.58
0.99
0°
10°
—
0.86
—
0.118
0.004
—
0.014
0.020
0.006
0.012
0.793
0.817
0.546
0.566
0.440
0.450
0.050 BSC
0.023
0.039
0°
10°
—
0.034
α
C
Notes:
1. Controlling dimension: inches, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect to
one another within 0.004 inches at the
seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
06/13/03
ISSI
PACKAGING INFORMATION
®
Plastic TSOP-Type I
Package Code: T (32-pin)
1
E
H
N
D
SEATING PLANE
A
S
MILLIMETERS
Symbol
No. Leads
A
A1
B
C
D
E
H
e
L
α
S
Min.
L
B
e
A1
INCHES
Max.
Min.
Max.
32
—
1.20
0.05
0.25
0.17
0.23
0.12
0.17
7.90
8.10
18.30
18.50
19.80
20.20
0.50 BSC
0.40
0.60
0°
8°
0.25 REF
—
0.047
0.002
0.010
0.007
0.009
0.005
0.007
0.311
0.319
0.720
0.728
0.780
0.795
0.020 BSC
0.016
0.024
0°
8°
0.010 REF
α
C
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect
to one another within 0.004 inches at the
seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
06/13/03
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