ISSI IS64WV102416BLL-10MA3 1m x 16 high-speed asynchronous cmos static ram with 3.3v supply Datasheet

IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
1M x 16 HIGH-SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH 3.3V SUPPLY
FEATURES
• High-speed access times:
8, 10, 20 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for greater
noise immunity
• Easy memory expansion with CE and OE options
• CE power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single power supply
Vdd 1.65V to 2.2V (IS61WV102416ALL)
speed = 20ns for Vdd 1.65V to 2.2V
Vdd 2.4V to 3.6V (IS61/64WV102416BLL)
speed = 10ns for Vdd 2.4V to 3.6V
speed = 8ns for Vdd 3.3V + 5%
• Packages available:
– 48-ball miniBGA (9mm x 11mm)
– 48-pin TSOP (Type I)
• Industrial and Automotive Temperature Support
• Lead-free available
• Data control for upper and lower bytes
MAY 2012
DESCRIPTION
The ISSI IS61WV102416ALL/BLL and IS64WV102416BLL
are high-speed, 16M-bit static RAMs organized as 1024K
words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process
coupled with innovative circuit design techniques, yields
high-performance and low power consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of the
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
The device is packaged in the JEDEC standard 48-pin
TSOP Type I and 48-pin Mini BGA (9mm x 11mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A19
DECODER
1024K x 16
MEMORY ARRAY
I/O
DATA
CIRCUIT
COLUMN I/O
VDD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
CE
OE
WE
UB
CONTROL
CIRCUIT
LB
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
1
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
48-pin mini BGA (9mmx11mm)
1
2
3
4
5
6
A
LB
OE
A0
A1
A2
NC
B
I/O8
UB
A3
A4
CE
I/O0
C
I/O9
I/O10
A5
A6
I/O1
I/O2
D
GND
I/O11
A17
A7
I/O3
VDD
E
VDD
I/O12
NC
A16
I/O4
GND
F
I/O14
I/O13
A14
A15
I/O5
I/O6
G
I/O15
A19
A12
A13
WE
I/O7
H
A18
A8
A9
A10
A11
NC
PIN DESCRIPTIONS
A0-A19
I/O0-I/O15
CE
OE
WE
LB
UB
NC
Vdd
GND
2
Address Inputs
Data Inputs/Outputs
Chip Enable Input
Output Enable Input
Write Enable Input
Lower-byte Control (I/O0-I/O7)
Upper-byte Control (I/O8-I/O15)
No Connection
Power
Ground
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
48-pin TSOP-I (12mm x 20mm)
A4
A3
A2
A1
A0
NC
CE
I/O0
I/O1
I/O2
I/O3
VDD
GND
I/O4
I/O5
I/O6
I/O7
WE
NC
A19
A18
A17
A16
A15
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A5
A6
A7
A8
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
VDD
I/O11
I/O10
I/O9
I/O8
NC
A9
A10
A11
A12
A13
A14
PIN DESCRIPTIONS
A0-A19
I/O0-I/O15
CE
OE
WE
LB
UB
NC
Vdd
GND
Address Inputs
Data Inputs/Outputs
Chip Enable Input
Output Enable Input
Write Enable Input
Lower-byte Control (I/O0-I/O7)
Upper-byte Control (I/O8-I/O15)
No Connection
Power
Ground
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
3
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
TRUTH TABLE
Mode
Not Selected
Output Disabled
Read
Write
WE
X
H
X
H
H
H
L
L
L
CE
H
L
L
L
L
L
L
L
L
OE
X
H
X
L
L
L
X
X
X
LB
X
X
H
L
H
L
L
H
L
UB
X
X
H
H
L
L
H
L
L
I/O PIN
I/O0-I/O7
I/O8-I/O15
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Dout
High-Z
High-Z
Dout
Dout
Dout
Din
High-Z
High-Z
Din
Din
Din
Vdd Current
Isb1, Isb2
Icc
Icc
Icc
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Vterm
Vdd
Tstg
Pt
Parameter
Terminal Voltage with Respect to GND
Vdd Relates to GND
Storage Temperature
Power Dissipation
Value
–0.5 to Vdd + 0.5
–0.3 to 4.0
–65 to +150
1.0
Unit
V
V
°C
W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
CAPACITANCE(1,2)
Symbol
Cin
CI/O
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
Vin = 0V
Vout = 0V
Max.
6
8
Unit
pF
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: Ta = 25°C, f = 1 MHz, Vdd = 3.3V.
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
OPERATING RANGE (Vdd) (IS61WV102416ALL)
Range
Ambient Temperature
Commercial
0°C to +70°C
Industrial
–40°C to +85°C
Automotive
–40°C to +125°C
Vdd (20 ns)
1.65V-2.2V
1.65V-2.2V
1.65V-2.2V
OPERATING RANGE (Vdd) (IS61WV102416BLL)(1)
Range
Ambient Temperature
Commercial
0°C to +70°C
Industrial
–40°C to +85°C
Vdd (8 ns)
3.3V + 5%
3.3V + 5%
Vdd (10 ns)
2.4V-3.6V
2.4V-3.6V
Note:
1. When operated in the range of 2.4V-3.6V, the device meets 10ns. When operated in the range of
3.3V + 5%, the device meets 8ns.
OPERATING RANGE (Vdd) (IS64WV102416BLL)
Range
Automotive
Ambient Temperature
–40°C to +125°C
Vdd (10 ns)
2.4V-3.6V
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
5
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Vdd = 3.3V + 5%
Symbol
Voh
Vol
Vih
Vil
Ili
Ilo
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage(1)
Input Leakage
Output Leakage
Test Conditions
Vdd = Min., Ioh = –4.0 mA
Vdd = Min., Iol = 8.0 mA
GND ≤ Vin ≤ Vdd
GND ≤ Vout ≤ Vdd, Outputs Disabled
Min.
2.4
—
2
–0.3
–1
–1
Max.
—
0.4
Vdd + 0.3
0.8
1
1
Unit
V
V
V
V
µA
µA
Min.
1.8
—
2.0
–0.3
–1
–1
Max.
—
0.4
Vdd + 0.3
0.8
1
1
Unit
V
V
V
V
µA
µA
Note:
1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width ­ 2.0 ns). Not 100% tested.
Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width ­ 2.0 ns). Not 100% tested.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Vdd = 2.4V-3.6V
Symbol
Voh
Vol
Vih
Vil
Ili
Ilo
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage(1)
Input Leakage
Output Leakage
Test Conditions
Vdd = Min., Ioh = –1.0 mA
Vdd = Min., Iol = 1.0 mA
GND ≤ Vin ≤ Vdd
GND ≤ Vout ≤ Vdd, Outputs Disabled
Note:
1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width ­ 2.0 ns). Not 100% tested.
Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width ­ 2.0 ns). Not 100% tested.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Vdd = 1.65V-2.2V
Symbol
Voh
Vol
Vih
Vil(1)
Ili
Ilo
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage
Output Leakage
Test Conditions
Ioh = -0.1 mA
Iol = 0.1 mA
Vdd
1.65-2.2V
1.65-2.2V
1.65-2.2V
1.65-2.2V
GND ≤ Vin ≤ Vdd
GND ≤ Vout ≤ Vdd, Outputs Disabled
Min.
1.4
—
1.4
–0.2
–1
–1
Max.
—
0.2
Vdd + 0.2
0.4
1
1
Unit
V
V
V
V
µA
µA
Notes:
1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width -2.0ns). Not 100% tested.
Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width -2.0ns). Not 100% tested.
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
AC TEST CONDITIONS (HIGH SPEED)
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level (VRef)
Output Load
Unit
(2.4V-3.6V)
0.4V to Vdd-0.3V
1.5ns
Vdd/2
Unit
(3.3V + 5%)
0.4V to Vdd-0.3V
1.5ns
Vdd/2 + 0.05
Unit
(1.65V-2.2V)
0.4V to Vdd-0.2V
1.5ns
Vdd/2
See Figures 1 and 2
See Figures 1 and 2
See Figures 1 and 2
AC TEST LOADS
319 Ω
ZO = 50Ω
3.3V
50Ω
1.5V
OUTPUT
30 pF
Including
jig and
scope
Figure 1.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
OUTPUT
5 pF
Including
jig and
scope
353 Ω
Figure 2.
7
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-8
Symbol Parameter
Test Conditions Min. Max.
Icc
Vdd Dynamic Operating Vdd = Max.,
Com. —
110
Supply Current
Iout = 0 mA, f = fmax
Ind. —
115
Vin = 0.4V or Vdd –0.3V Auto. —
—
typ.(2)
Icc1
Operating
Vdd = Max.,
Com. —
85
Supply Current
Iout = 0 mA, f = 0
Ind. —
90
Vin = 0.4V or Vdd –0.3V Auto. —
—
Isb1
TTL Standby Current
Vdd = Max.,
Com. —
30
(TTL Inputs)
Vin = Vih or Vil
Ind. —
35
CE ≥ Vih, f = 0
Auto. —
—
Isb2
CMOS Standby
Vdd = Max.,
Com. —
20
Current (CMOS Inputs) CE ≥ Vdd – 0.2V,
Ind. —
25
Vin ≥ Vdd – 0.2V, or
Auto. —
—
Vin ≤ 0.2V, f = 0
typ.(2)
-10
Min. Max.
—
90
—
95
—
140
60
—
85
—
90
—
110
—
30
—
35
—
70
—
20
—
25
—
60
4
-20
Min. Max.
—
50
—
60
—
100
—
—
—
—
—
—
—
—
—
45
55
90
30
35
70
20
25
60
Unit
mA
mA
mA
mA
Note:
1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at Vdd = 3.0V, Ta = 25oC and not 100% tested.
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
Symbol
Parameter
trc
Read Cycle Time
taa
Address Access Time
toha
Output Hold Time
tace
CE Access Time
tdoe
OE Access Time
(2)
thzoe
OE to High-Z Output
tlzoe(2)
OE to Low-Z Output
thzce(2
CE to High-Z Output
(2)
tlzce
CE to Low-Z Output
tba
LB, UB Access Time
thzb(2)
LB, UB to High-Z Output
tlzb(2)
LB, UB to Low-Z Output
tpu
Power Up Time
tpd
Power Down Time
Min.
8
—
2.5
—
—
—
0
0
3
—
0
0
0
—
-8
Max.
—
8
—
8
5.5
3
—
3
—
5.5
3
—
—
8
-10
Min. Max.
10
—
—
10
2.5
—
—
10
—
6.5
—
4
0
—
0
4
3
—
—
6.5
0
3
0
—
0
—
—
10
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V
and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
9
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-20 ns
Symbol
Parameter Min. Max.
trc
Read Cycle Time
20
—
taa
Address Access Time
—
20
toha
Output Hold Time
2.5
—
tace
CE Access Time
—
20
tdoe
OE Access Time
—
8
(2)
thzoe
OE to High-Z Output
0
8
(2)
tlzoe
OE to Low-Z Output
0
—
thzce(2
CE to High-Z Output
0
8
(2)
tlzce
CE to Low-Z Output
3
—
tba
LB, UB Access Time
—
8
thzb
LB, UB to High-Z Output
0
8
tlzb
LB, UB to Low-Z Output
0
—
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Test conditions assume signal transition times of 1.5 ns or less, timing reference levels of 1.25V, input pulse levels of 0.4V to
Vdd-0.3V and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. Not 100% tested.
10
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = Vil)
t RC
ADDRESS
t OHA
DOUT
t AA
t OHA
DATA VALID
PREVIOUS DATA VALID
READ1.eps
READ CYCLE NO. 2(1,3) (CE and OE Controlled)
t RC
ADDRESS
t AA
t OHA
OE
t HZOE
t DOE
t LZOE
CE
t LZCE
DOUT
t ACE
HIGH-Z
t HZCE
DATA VALID
CE_RD2.eps
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = Vil.
3. Address is valid prior to or coincident with CE LOW transitions.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
11
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-8
Symbol
twc
tsce
taw
tha
tsa
tpwb
tpwe1
tpwe2
tsd
thd
thzwe(2)
tlzwe(2)
Parameter
Write Cycle Time
CE to Write End
Address Setup Time
to Write End
Address Hold from Write End
Address Setup Time
LB, UB Valid to End of Write
WE Pulse Width
WE Pulse Width (OE = LOW)
Data Setup to Write End
Data Hold from Write End
WE LOW to High-Z Output
WE HIGH to Low-Z Output
Min.
8
6.5
6.5
Max.
—
—
—
-10
Min.
10
8
8
Max.
—
—
—
Unit
ns
ns
ns
0
0
6.5
6.5
8.0
5
—
—
—
—
—
—
0
0
8
8
10
6
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
0
—
2
—
3.5
—
0
—
2
—
5
—
­s
n
ns
ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and
output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising
or falling edge of the signal that terminates the write. Shaded area product in development
12
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)
-20 ns
Symbol
Parameter
Min. Max.Unit
twc
Write Cycle Time
20
—
ns
tsce
CE to Write End
12
—
ns
taw
Address Setup Time
12
—
ns
to Write End
tha
Address Hold from Write End
0
—
ns
tsa
Address Setup Time
0
—
ns
tpwb
LB, UB Valid to End of Write
12
—
ns
tpwe1
WE Pulse Width (OE = HIGH)
12
—
ns
tpwe2
WE Pulse Width (OE = LOW)
17
—
ns
tsd
Data Setup to Write End
9
—
ns
thd
thzwe(3)
tlzwe(3)
Data Hold from Write End
WE LOW to High-Z Output
WE HIGH to Low-Z Output
0
—
3
—
9
—
­s
n
ns
ns
Notes:
1. Test conditions for IS61WV6416LL assume signal transition times of 1.5ns or less, timing reference
levels of 1.25V, input pulse levels of 0.4V to Vdd-0.3V and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not
100% tested.
3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals
must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data
Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates
the write.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
13
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)
t WC
VALID ADDRESS
ADDRESS
t SA
t SCE
t HA
CE
t AW
t PWE1
t PWE2
WE
t HZWE
DOUT
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
CE_WR1.eps
14
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
AC WAVEFORMS
WRITE CYCLE NO. 2 (WE Controlled. OE is HIGH During Write Cycle) (1,2)
t WC
ADDRESS
VALID ADDRESS
t HA
OE
CE
LOW
t AW
t PWE1
WE
t SA
t PBW
UB, LB
t HZWE
DOUT
t LZWE
HIGH-Z
DATA UNDEFINED
t SD
t HD
DATAIN VALID
DIN
UB_CEWR2.eps
WRITE CYCLE NO. 3 (WE Controlled. OE is LOW During Write Cycle) (1)
t WC
ADDRESS
VALID ADDRESS
OE
LOW
CE
LOW
t HA
t AW
t PWE2
WE
t SA
t PBW
UB, LB
t HZWE
DOUT
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
UB_CEWR3.eps
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
15
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
AC WAVEFORMS
WRITE CYCLE NO. 4 (LB, UB Controlled, Back-to-Back Write) (1,3)
t WC
ADDRESS
t WC
ADDRESS 1
ADDRESS 2
OE
t SA
CE
LOW
t HA
t SA
WE
UB, LB
t HA
t PBW
t PBW
WORD 1
WORD 2
t HZWE
DOUT
t LZWE
HIGH-Z
DATA UNDEFINED
t HD
t SD
DIN
DATAIN
VALID
t HD
t SD
DATAIN
VALID
UB_CEWR4.eps
Notes:
1. The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be in valid states to
initiate a Write, but any can be deasserted to terminate the Write. The t sa, t ha, t sd, and t hd timing is referenced to the rising or falling edge
of the signal that terminates the Write.
2. Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state.
3. WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function.
16
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol
Idr
Parameter
Vdd for Data Retention
Data Retention Current
tsdr
trdr
Data Retention Setup Time
Recovery Time
Vdr
Test Condition
See Data Retention Waveform
Vdd = 1.2V, CE ≥ Vdd – 0.2V
Ind.
Auto.
See Data Retention Waveform
See Data Retention Waveform
Min.
1.2
—
—
0
trc
Max.
3.6
20
50
—
—
Unit
V
mA
ns
ns
DATA RETENTION WAVEFORM (CE Controlled)
tSDR
Data Retention Mode
tRDR
VDD
1.65V
1.4V
VDR
CE
GND
CE ≥ VDD - 0.2V
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
17
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
ORDERING INFORMATION
Industrial Range: -40°C to +85°C
Voltage Range: 2.4V to 3.6V
Speed (ns)
10 (81)
Order Part No.
IS61WV102416BLL-10MI
IS61WV102416BLL-10MLI
IS61WV102416BLL-10TLI
Package
48 mini BGA (9mm x 11mm)
48 mini BGA (9mm x 11mm), Lead-free
TSOP (Type I), Lead-free
Note:
1. Speed = 8ns for Vdd = 3.3V + 5%. Speed = 10ns for Vdd = 2.4V - 3.6V
Industrial Range: -40°C to +85°C
Voltage Range: 1.65V to 2.2V
Speed (ns)
20
Order Part No.
IS61WV102416ALL-20MI
IS61WV102416ALL-20TLI
Package
48 mini BGA (9mm x 11mm)
TSOP (Type I), Lead-free
Automotive Range: -40°C to +125°C
Voltage Range: 2.4V to 3.6V
Speed (ns)
10
18
Order Part No.
IS64WV102416BLL-10MA3
IS64WV102416BLL-10MLA3
IS64WV102416BLL-10CTLA3
Package
48 mini BGA (9mm x 11mm)
48 mini BGA (9mm x 11mm), Lead-free
TSOP (Type I), Copper Leadframe, Lead-free
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
1. CONTROLLING DIMENSION : MM .
2. Reference document : JEDEC MO-207
NOTE :
08/21/2008
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
19
20
Θ
NOTE :
07/06/2006
4. Formed leads shall be planar with respect to one another within 0.1mm
at the seating plane after final test.
3. Dimension b does not include dambar protrusion/intrusion.
2. Dimension D1 adn E do not include mold protrusion .
1. Controlling dimension : mm
Θ
IS61WV102416ALL
IS61WV102416BLL
IS64WV102416BLL
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
05/09/12
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