Lattice ISPPAC81-01PI In-system programmable analog circuit Datasheet

ispPAC81
In-System Programmable Analog Circuit
October 2001
Data Sheet
Functional Block Diagram
Features
■ In-System Programmable(ISP™) Analog
•
•
•
•
•
•
Instrument Amplifier Gain Stage
Precision Active Filtering (10kHz to 75kHz)
Continuous-Time Fifth Order Low Pass Topology
Dual, A/B Configuration Memory
Non-Volatile E2CMOS® Cells
IEEE 1149.1 JTAG Serial Port Programming
TMS
1
TCK
2
16 VS
15 TEST
IA
■ Unique Flexibility and Performance
• Programmable Gain Range (0dB to 20dB)
• Implements Multiple Filter Types: Elliptical,
Chebyshev, Butterworth
• Low Distortion (THD < -80dB at 10kHz)
• Auto-Calibrated Input Offset Voltage
TDI
3
TDO
4
CS
5
CAL
6
14 OUT+
5th Order LPF
E2CMOS Cfg A
E2CMOS Cfg B
Ref & Auto-Cal
ISP Control
ENSPI
7
10 IN–
GND
8
9 VREFOUT
Description
The ispPAC81 is a member of the Lattice family of In-System
Programmable analog circuits, digitally configured via nonvolatile E2CMOS technology.
■ Single Supply 5V Operation
• Power Dissipation of 133mW
• 16-Pin Plastic SOIC, PDIP Packages
Analog building blocks, called PACell™(s), replace traditional
analog components such as opamps, eliminating the need for
external resistors and capacitors. With no requirement for
external configuration components, ispPAC81 expedites the
design process, simplifying prototype circuit implementation
and change, while providing high-performance integrated
functionality. With all components on chip, there is no longer a
concern of performance degradation due to component mismatch or other external factors. The ispPAC81 provides reliable and repeatable performance, every time.
■ Applications Include Integrated
Single +5V Supply Signal Conditioning
Programmable Filters With Fully Differential I/O
Analog Front Ends, 12-Bit Data Acq. Systems
DSP System Front End Signal Conditioning
High-Performance Reconstruction Filters
Typical Application Diagram
Designers configure the ispPAC81 and verify its performance
using PAC-Designer®, an easy-to-use, Microsoft Windows®
compatible program. A filter configuration database is provided whereby thousands of different configurations can be
realized. No special understanding of filter synthesis is
required beyond that of general specifications such as corner
frequency and stopband attenuation, etc. The software lists
the possible choices that meet the designer’s specifications
which can then be loaded directly into either of two device (A/
B) configurations from the lookup table. Device programming
is supported using PC parallel port I/O operations.
5V
12-Bit Differential
Input ADC
ispPAC81
Ain+
Vin
AinA/B & Gain
SPI Control
VREFout
Reference
5V
The ispPAC81 is configured through its IEEE Standard 1149.1
compliant serial port. The flexible In-System Programming
capability enables programming, verification and reconfiguration, if desired, directly on the printed circuit board.
DSP
www.latticesemi.com
12 TEST
ispPAC81
• High CMR Instrument Amplifier Input
• 2.5V Common Mode Reference on Chip
• Rail-to-Rail Voltage Outputs
5V
13 OUT–
11 IN+
■ True Differential I/O
•
•
•
•
•
OA
1
pac81_01
Lattice Semiconductor
ispPAC81 Data Sheet
DC Electrical Characteristics
TA = 25°C; VS = 5.0V; 1V < VOUT < 4V; Gain = 1; Output load = 200pf, 1MΩ. Filter configuration = CC055042, FP = 17.62kHz;
Auto-Cal initiated immediately prior. (Unless otherwise specified).
Symbol
Parameter
Condition
Min.
Applied to either VIN+ or VIN-
1
2 |VIN+ - VIN-|
6
Typ.
Max.
Units
4
V
Analog Input
VIN± (1) Input Voltage Range
VIN-DIFF Differential Input Voltage Swing (2)
VOS (2)
Differential Offset Voltage (Input Referred)
∆VOS / ∆T Differential Offset Voltage Drift
RIN
Input Resistance
CIN
Input Capacitance
IB
Input Bias Current
eN
Input Noise Voltage Density
VP-P
G=10
G=1
250
2.5
-40 to +85°C
100
1,000
10
µV
mV
µV/°C
9
10
Ω
2
pF
at DC
1
pA
At 10kHz, referred to input, G=10
71
nV/ Hz
Analog Output
VOUT±
Output Voltage Range
Present at either VOUT+ or VOUT-
0.1
2 |VOUT+ - VOUT-|
9.6
VOUT-DIFF Differential Output Voltage Swing (2)
IOUT± Output Current
VCM
Source/Sink
10
(VOUT+ - VOUT-)/2
2.495
Individual gain amplifier (1, 2, 5, 10)
0
Common Mode Output Voltage
4.9
V
VP-P
mA
2.5
2.505
V
20
dB
2.5
%
Static Performance
G
Programmable Gain Range
Gain Error
∆G/∆T
PSR
RL = 300Ω differential
Gain Drift
Power Supply Rejection
0.5
-40 to +85°C
20
ppm/°C
Differential at 1kHz
Single-ended at 1kHz
80
67
dB
dB
Common Mode Reference Output (VREFOUT)
VREFOUT Reference Output Voltage Range
Nominally 2.500V
0.2
%
-40 to +85°C
50
ppm/°C
(VREFOUT = ±1%) source
(VREFOUT = ±1%) sink
50
-350
µA
µA
10MHz bandwidth
40
µVRMS
1kHz
80
dB
1M
cycles
Reference Output Voltage Drift
IREFOUT Reference Output Current
-0.2
Reference Output Noise Voltage
Reference Power Supply Rejection
Programming
Erase/Reprogram Cycles
10K
Digital I/O
VIL
Input Low Voltage
0
0.8
V
VIH
Input High Voltage
2
VS
V
-10/+40
-70/+10
µA
µA
IIL, IIH
Input Leakage Current
0V ≤ TCK, ENSPI, CAL input ≤ VS
0V ≤ TDI, MTS, CS inputs ≤ VS
VOL
Output Low Voltage (TDO)
IOL = 4.0mA
VOH
Output High Voltage (TDO)
IOH = -1.0mA
2
0.5
2.4
V
V
Lattice Semiconductor
ispPAC81 Data Sheet
AC Electrical Characteristics
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
Dynamic Performance (4)
SNR
Signal to Noise (G=1 to 10)
THD
Total Harmonic Distortion (Differential)
Single-Ended (FP = 50kHz)
CMR
Common Mode Rejection (VIN = 1V to 4V)
Note: VIN+ and VIN- connected together
0.1Hz to 75kHz, FC = 50kHz
86
FIN = 10kHz, VIN = 6VP-P
FIN = 10kHz, VIN = 6VP-P
-80
-80
10kHz, FC = 50kHz
48
dB
-72
-72
dB
dB
60
dB
Deviation from calculated -3db point
FC = 10kHz or 50kHz
0.8
%
Butterworth, 10kHz to 60kHz
0.6
Filter Characteristics (4)
|FC|
Absolute Corner Frequency Accuracy
∆FC
Max Delta Between Filters (Computed)
3.6
%
∆FC/∆T
Corner Frequency Delta vs. Temperature
FC = 10kHz
0.03
%/°C
∆FC/∆V
Corner Frequency Delta vs. Supply Voltage
FC = 10kHz
0.09
%/°V
FC = 10kHz
FC = 50kHz
1.4
1.5
dB
dB
Elliptic Filter Response (5)
Passband Ripple
Passband Ripple
Power Supplies
VS
Operating Supply Voltage
5
5.25
V
IS
Supply Current
VS = 5.0V
4.75
26.5
33
mA
PD
Power Dissipation
VS = 5.0V
133
165
mW
Temperature Range
Operation
-40
85
°C
Storage
-65
150
°C
Notes: (1) A wider input range of 0.7V to 4.3V is typical, but not guaranteed. Inputs larger than this will be clipped. Input signals are also subject
to common-mode voltage limitations. Refer to the table of conditions in this data sheet. (2) Refer to theory of operation section later in this data
sheet for explanation of differential voltage swing computation. (3) To insure full spec performance an additional auto-calibration should be performed after initial turn-on and the device reaches thermal stability. (4) Although many hundreds of thousands of filter configurations are available using ispPAC81, not every type will have corner frequencies available from exactly 10kHz to 75kHz, depending on the tables available
from within PAC-Designer filter design tools. The general specifications given under this heading are realized using the Elliptic filter types. For
more information on other types and/or frequencies not contained in the filter database, please contact Lattice Marketing. (5) A Cauer elliptic filter of type CC051042 (see data sheet text) is used to guarantee these specific filter accuracy specifications. It is assumed that all other configurations available in PAC-Designer will exhibit equivalent performance according to the applicability of the individual filter type. Necessary
limitations will apply, however, when specifications do not directly apply. See the data sheet text, application notes and guides in PAC-Designer
for specific filter type considerations.
3
Lattice Semiconductor
ispPAC81 Data Sheet
Pin Descriptions
Pin(s)
Symbol
Name
Description
Serial interface logic mode select pin (input). JTAG interface
mode only.
2
TCK
Test Clock
Serial interface logic clock pin (input). JTAG and SPI interface
modes.
3
Test Data In
TDI
Serial interface logic pin (input) for both JTAG and SPI operation modes.
4
TDO
Test Data Out
Serial interface logic pin (output) for both JTAG and SPI operation modes. Input data valid on falling edge of TCK (JTAG), or
on rising edge of CS (SPI).
Chip Select
Chip select logic input pin. SPI data latch.
5
CS
6
CAL
Auto-Calibrate
Digital pin (input). Commands an auto-calibration sequence on
a rising edge.
7
ENSPI
Enable SPI Mode
Enable SPI logic input pin. When high, causes serial port to run
in SPI mode.
GND
Ground
Ground pin. Should normally be connected to the analog
8
ground plane.
9
VREFOUT Common-Mode Reference Common-mode voltage reference output pin (+2.5V nominal).
Must be bypassed to GND with a 1µF capacitor.
10, 11
IN
Inputs (+ or -)
Differential input pins, using two pins (e.g., IN+ and IN-). Plus or
minus components of VIN, where differential VIN = VIN+ - VIN-.
12, 15
TEST
Test Pin
Test pin. Connect to GND for proper circuit operation.
OUT
Outputs (+ or -)
13, 14
Differential output pins, using two pins (e.g., OUT+ and OUT-).
Complementary with respect to VREFOUT.
Differential VOUT = VOUT+ - VOUT-.
16
VS
Supply Voltage
Analog supply voltage pin (5V nominal). Should be bypassed to
GND with 1µF and .01µF capacitors.
1
TMS
Test Mode Select
Connection Notes
1. All inputs and outputs are labeled with plus (+) and minus (-) signs. Polarity is labeled for reference and can be
selected externally by reversing pin connections.
2. All analog output pins are “hard-wired” to internal output devices and should be left open if not used. VOUT+ and
VOUT- should not be tied together as unnecessary power will be dissipated.
3. When the signal input is single-ended, the other half of the unused differential input must be connected to a DC
common-mode reference (usually VREFOUT, 2.5V).
Absolute Maximum Ratings
Supply Voltage VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to +7V
Logic and Analog Input Voltage Applied. . . . . . . . . . . . . . . 0 to VS
Logic and Analog Output Short Circuit Duration . . . . . . Indefinite
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . . . .260°C
Ambient Temperature with Power Applied . . . . . . . . -55 to 125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Note: Stresses above those listed may cause permanent damage to the device. These are stress only ratings and functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied.
4
Lattice Semiconductor
ispPAC81 Data Sheet
Part Number Description
ispPAC81 – XX X X
Device Family
Grade
Blank = Commercial
I = Industrial
Device Number
Package
P = PDIP
S = SOIC
Performance Grade
01 = Standard
ispPAC81 Ordering Information
Part Number
Package
ispPAC81-01PI
16-pin PDIP
ispPAC81-01SI
16-pin SOIC
Package Options
1
ispPAC81
1
ispPAC 81
16-Pin PDIP
16-Pin SOIC
5
Lattice Semiconductor
ispPAC81 Data Sheet
Timing Specifications (JTAG Interface Mode)
TA = 25°C; VS = +5.0V (Unless otherwise specified)
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
Dynamic Performance
tckmin
Minimum clock period
200
ns
tckh
TCK high time
50
ns
tckl
TCK low time
50
ns
tmss
TMS setup time
15
ns
tmsh
TMS hold time
10
ns
tdis
TDI setup time
15
ns
tdih
TDI hold time
10
ns
tdozx
TDO float to valid delay
60
ns
tdov
TDO valid delay
60
ns
tdoxz
TDI valid to float delay
tpwp
Time for a programming operation
tpwe
Time for an erase operation
tpwcal1
Time for auto-cal operation on power-up
tcalmin
Minimum auto-cal pulse width
tpwcal2
Time for user-initiated auto-cal operation
tckh
tckl
60
ns
Executed in Run-Test/Idle
80
100
ms
Executed in Run-Test/Idle
80
100
ms
250
ms
100
ms
Automatically executed at power-up
40
Executed on rising edge of CAL
tckmin
ns
tpwp, tpwe
TCK
TCK
tmss
tmss
tmss
tmsh
TMS
*(PRGUSR/UBE executed in
Run-Test/Idle state)
TMS
tdis
tdih
(Note: CAL internally
initiated at device turn-on.)
CAL
TDI
tcalmin
tdozx
tdov
tdoxz
VOUT+ = VOUT– = 0
VOUT
TDO
tpwcal1, tpwcal2
*Note: During device JTAG programming, analog output response will deviate from expected behavior. This is
because all configuration information is erased and then re-written as part of a normal programming cycle, momentarily changing device filter and gain parameters. Behavior will deviate from that expected during both of these
steps since the analog outputs are not clamped during a programming cycle. During erase, a drop in the filter corner frequency and an automatic change to the 10X gain setting can be expected (80ms minimum by specification)
and will continue until bits go to their final state after a JTAG write command is issued (less than 2ms later, though
the write cycle must still be maintained for a full 80ms to achieve specified data retention).
6
Lattice Semiconductor
ispPAC81 Data Sheet
Timing Specifications (SPI Interface Mode)
TA = 25°C; VS = +5.0V (Unless otherwise specified)
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
Dynamic Performance
tckmin
Minimum clock period
200
ns
tckh
TCK high time
100
ns
tckl
TCK low time
100
ns
tcss
CS setup time
20
ns
tcsminhi
Minimum CS pulse widths
40
ns
tdis
TDI setup time
15
ns
tdih
TDI hold time
10
ns
tdozx
TDO float to valid delay
60
ns
tdov
TDO valid delay
60
ns
tdoxz
TDO valid to float delay
60
ns
tckmin
tckh
tckl
TCK
tcss
CS
tdis tdih
tcsminhi
TDI
tdozx
TDO
tdov
hi-z
tdoxz
hi-z
7
Lattice Semiconductor
ispPAC81 Data Sheet
Typical Performance Characteristics
CMR vs. Frequency
Input Noise Spectrum
100
G = 10
(Referred to Input)
10
1
1
10
Elliptical filter
cc055042
Fc = 50kHz
80
70
60
50
Elliptical filter
cc055042
Fc = 18kHz
40
30
100
1k
10k 100k 1M
Frequency (Hz)
90
10
1k
10k
100k
Frequency (Hz)
35
G=1
Elliptical filter
cc055042
Fc = 50kHz
30
Percentage of Devices (%)
Total Harmonic Distortion (dB)
100
80
70
60
50
40
1M
30
100
VOS Tempco
THD vs. Frequency
-70
-75
Power Supply Rejection (dB)
Common Mode Rejection (dB)
Noise Voltage (nV√Hz)
Butterworth
Fc = 50kHz
-80
-85
G = 10
-90
1k
10k
100k
Frequency (Hz)
Filter Variation (3 Sigma)
0 dB
Passband ripple
variation over
process < 0.20dB
PDIP Pkg
-40°C to +85°C
25
20
-40 dB
Stopband
attenuation
variation over
process < 1.5dB
15
10
-80 dB
-95
-100
PSR vs. Frequency
90
1K
Elliptical filter
cc055042
5
1k
10k
Frequency (Hz)
100k
0
-240
-120
0
120
240
Offset Tempco (µV/°C)
8
10kHz
100kHz
1MHz
1M
Lattice Semiconductor
ispPAC81 Data Sheet
Theory of Operation
Reference Configuration
In the specifications table, specific filter configurations are referred to, such as the CC055042 at 17.62kHz. This is
simply a shorthand notation for the classical filter type that includes all the characteristic parameters of the particular configuration. In this case, the CC refers to complete Chebyshev, or a Chebyshev ripple response in both the
pass and stopbands of the filter. Another common name for this type of filter is the Elliptic family of filters. The next
set of numbers, “05” refers to the order of the filter. In the case of ispPAC81 this will always be fifth order. The next
two digits signify the reflection coefficient (rf), in this case 10%, and has a direct mathematical relationship to the
passband ripple magnitude of the filter, where the passband ripple expressed in dB = 10*Log(1-rf2). The final two
digits are the passband to stopband attenuation ratio expressed as an angle, in this case 42 degrees or 1.49 (1/
sin((π/180)*42)). This configuration corresponds to the elliptical filter with the ID# 1088 (Fp=17.62kHz;
Fc=17.96kHz) in the filter configuration database utility of PAC-Designer. Because of the almost limitless number of
configurations realizable with ispPAC81, standard test configurations had to be chosen. The Elliptical family was
chosen since it has many parameters that can be easily and directly measured to insure that all the internal circuits
of ispPAC81 are operating correctly.
Figure 1. Simplified ispPAC81 Filter Core Schematic
R21
20K
R32
-20K
R43
20K
R54
-40K
C231
R11 20K
C1
Rin
20K
VIN
V1
C3
L4
R23
20K
A2
R55
40K
C435
L2
R12
-20K
A1
C453
C213
V2
R34
-20K
A3
V3
R45
20K
A4
V4
C5
A5
VOUT
G = 1/20K; G/2 = 1/40K; C2 = C231 = C213; C4 = C435; C4/2 = C453
VOUT
=
VIN
-2G (L2 L4 C4 C2)s4 + ((L2 G2 C2) + (G 2 L4 C4) ) s 2 + G 4
-(L2 C4 2 L4 C1) + 2(L2 C1 C3 L4 C5) - 2(C22 L2 L4 C5) s 5
+ -(L2 G C4 2 L4) + (L2 C1 C3 L4 G) - (C22 L2 L4 G) + 2(L2 G C3 L4 C5) s 4
+ (L2 C1 C3 G2 ) + (L2 G2 C3 L4) - (G2 L4 C4 2 ) + 2(G2 L4 C5 C3) - 4(G2 L4 C5 C2)
-2(L2 C1 C4 G2 ) + 2(G2 C1 L4 C5) + 2(L2 C5 G2 C1) - (C2 2 L2 G 2) s 3
+ 2(L2 C5 G3 ) - 2(G3 L4 C2) + (G3 L4 C3) + (L2 G3 C1) + 2(G3 L4 C5) - 2( L2 C4 G3 ) + (G3 C1 L4) + (L2 C3 G3 ) s 2
+ 2(G4 C5) + (G4 C3) - 2(G4 C4) + (G4 L4) + (G4 C1) + (L2 G4 ) - 2(G4 C2) s + 2 G5
9
Lattice Semiconductor
ispPAC81 Data Sheet
SPI Power-On Condition
The SPI shift register is always reset to all zeroes when an ispPAC81 powers on. That means that if the ENSPI pin
is high at power on, the initial configuration will be set to a gain of 1X (0dB) and configuration “A” is selected as the
“wake-up” configuration. The only way to prevent this behavior would be to hold the ENSPI pin low while applying
power to the device. Because this is usually impractical, it is advised that if the ispPAC81 is used in SPI mode that
it be reloaded to the desired first configuration every time power is cycled to the device and/or that the “A” configuration memory hold the desired “wake up” filter response.
A/B Configuration
Two complete configurations can be stored in the E2 memory of the ispPAC81. Selection of either the “A” or “B”
configuration in real time is accomplished with the device in the SPI interface mode (ENSPI pin = logic high). An
eight-bit string is read into the ispPAC81 in the following order: four “don’t care” bits followed by a CAL command
bit, the A/B configuration setting and gain bits PG2 and PG1.
Table 1. SPI Control Bit Sequence
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
PG2
PG1
A/B
CAL
X
X
X
X
Table 2. Gain Bit Settings
Gain Setting
PG2
PG1
1X (0dB)
0
0
2X (6dB)
0
1
5X (14dB)
1
0
10X (20dB)
1
1
Table 3. JTAG User Configuration Bits
Symbol
FreqRange Bit
UES Bits
Cap Bits
A/B Bit
Name
Description
Hi/Lo Frequency Range Bit Depending on the corner frequency, the frequency range bit is automatically set
from within PAC-Designer to optimize the transfer function response of the
ispPAC81. Exists for both the A and B user strings. Can be overridden from
within PAC-Designer from the edit symbol dialog.
User Electronic Signature These are uncommitted E2 bits that can be used to store device information for
future reference. The ispPAC81 contains 21 UES bits. These bits are accessible
from within PAC-Designer by using the Edit Symbol, UES Bits command. Part
of user configuration string A only.
Capacitor Selection Bits
Varying length data words for each of the seven configuration capacitors of the
ispPAC81. There is a complete set of 70 bits total for each user configuration
string, A and B.
Initial Configuration Select With the A/B bit set to “A” (a logic 0), the device will power up in the configuration stored in user string A. The designations of A or B would have been determined initially in the design environment using PAC-Designer. It is also possible
to designate the B user string as the initial or “wake up” configuration, although
this is not recommended as it blocks the algorithm required to do a “blind” verification of the A configuration of a previously programmed device. This is determined from within PAC-Designer in the edit symbol dialog.
PG1 & PG2 Bits
Programmable Gain Bits
Contained only in the A configuration string. Can also be modified under SPI
control. Refer to Table 2 for bit setting specifics.
ESF
Electronic Security Fuse
Setting this bit causes all subsequent readouts of the device configuration to be
disabled (JTAG Verify commands). Can be reset by performing a JTAG user
(USRA) bulk erase commands and reprogramming the device. This feature is
used to prevent unauthorized readout of the device’s configuration.
10
Lattice Semiconductor
ispPAC81 Data Sheet
JTAG User Bits
There are a number of user-configured E2 bits that control various aspects of and can all be accessed in either the
pull-down menus or directly in the schematic design entry screen of the PAC-Designer software interface to the
ispPAC81. See the online help associated with the ispPAC81 in PAC-Designer for more details of how to set/program various operation modes. The list of control E2 bits available is listed in Table 3.
Differential I/O
Differential peak-peak voltage is determined by knowing the signal extremes on both differential input or output
pins. For example, if V(+) equals 4V and V(-) equals 1V, the differential voltage is defined as V(+) - V(-) = Vdiff, or
4V - 1V = +3V. Since either polarity can exist on differential I/O pins, it is also possible for the opposite extreme to
exist and would mean when V(+) equals 1V and V(-) equals 4V, the differential voltage is now 1V - 4V = -3V. To calculate the differential peak-peak voltage or full signal swing, the absolute difference between the two extreme
Vdiff’s is calculated. Using the previous examples would result in |(+3V) - (-3V)| = 6V. It can be immediately seen
that true differential signals result in a doubling of usable dynamic range. For more explanation of this and other differential circuit benefits, please refer to application note number AN6019, Differential Signaling.
Single-ended Input
To connect the ispPAC81 differential input to a single-ended signal, one of the differential inputs needs to be connected to a DC bias, preferably VREFOUT. The input signal must either be AC coupled or have a DC bias equal to
the DC level of the other input. Since the input voltage is defined as VIN+ - VIN-, the common mode level is ignored.
The signal information is only present on one input, the other being connected to a voltage reference.
Single-ended Output
Connecting the output to a single-ended circuit is simpler still. Simply connect one-half of the differential output, but
not the other. Either output conveys the signal information, just at half the magnitude of the differential output. The
DC level of the single-ended output will be VREFOUT. If the load is not AC coupled and is at a DC potential other
than VREFOUT, the load draws a constant current. Using one of the differential outputs halves the available output
voltage swing (3Vp-p versus 6Vp-p). If the load requires DC current, the available voltage swing is reduced. The
output is capable of 10mA, so any DC current raises the minimum allowable load impedance.
Input Common-Mode Voltage Range
For the ispPAC81, both maximum input signal range and corresponding common-mode voltage range are a function of the input gain setting. The maximum input voltage times the gain of an individual PACblock cannot exceed
the output range of that block or clipping will occur. The maximum guaranteed input range is 1V to 4V, with a typical
range of 0.7V to 4.3V for a 5V supply voltage.
The input common-mode voltage is VCM = (VCM+ + VCM-)/2. When the value of VCM is 2.5V, there are no further
input restrictions other than the previously mentioned clipping consideration. This is easily achieved when the input
signal is true differential and referenced to 2.5V.
When VCM is not 2.5V and the gain setting is greater than one, distortion will occur when the maximum input limit is
reached for a particular gain. The lowest VCM for a given gain setting is expressed by the formula, VCM– = 0.675V +
0.584G·VIN where G is the gain setting and VIN is the peak input voltage, expressed as |VIN+ - VIN–| and the highest
VCM is VCM+ = 5.0V - VCM– where 5V is the nominal supply voltage.
In Table 4, the maximum VIN for a given VCM– to VCM+ range is given. If the maximum VIN is known, find the equivalent or greater value under the appropriate gain column and the widest range for VCM will be found horizontally
across in the left-most two columns. Only a VCM range equal to or less than this will give distortion-free performance. Conversely, if the maximum VCM range is known, the largest acceptable peak value of VIN can be found in
the corresponding gain column. All values of VIN less than this will give full rated performance.
11
Lattice Semiconductor
ispPAC81 Data Sheet
Table 4. Input Common-Mode Voltage Range Limitations
Input Voltage Magnitude (Volts-Peak)
VCM-
VCM+
G=1
G=2
G=5
G=10
1.000
4.000
0.557
0.278
0.111
0.056
1.100
3.900
0.728
0.364
0.146
0.073
1.200
3.800
0.899
0.450
0.180
0.090
1.300
3.700
1.071
0.535
0.214
0.107
1.400
3.600
1.242
0.621
0.248
0.124
1.500
3.500
1.413
0.707
0.283
0.141
1.600
3.400
1.584
0.792
0.317
0.158
1.700
3.300
1.756
0.878
0.351
0.176
1.800
3.200
1.927
0.964
0.385
0.193
1.900
3.100
2.098
1.049
0.420
0.210
2.000
3.000
2.270
1.135
0.454
0.227
2.100
2.900
2.441
1.220
0.488
0.244
2.200
2.800
2.612
1.306
0.522
0.261
2.300
2.700
2.783
1.392
0.557
0.278
2.400
2.600
2.955
1.477
0.591
0.295
2.426
2.574
3.000*
1.500*
0.600*
0.300*
2.500
2.500
3.126
1.563
0.625
0.313
*Peak input voltage for guaranteed performance at a given gain setting.
Software-Based Design Environment
Design Entry Software
Designers configure the ispPAC81 and verify its performance using PAC-Designer, an easy-to-use, Microsoft Windows compatible program. Circuit designs are entered graphically and then verified, all within the PAC-Designer
environment. Full device programming is supported using PC parallel port I/O operations and a download cable
connected to the serial programming interface of the ispPAC81. A database of filter configurations is included with
thousands of possible implementations to choose from. In addition, comprehensive on-line and printed documentation is provided that covers all aspects of PAC-Designer operation.
The PAC-Designer schematic window, shown in Figure 2, provides access to all configurable ispPAC81 elements
via its graphical user interface. All analog input and output pins are represented. Static or non-configurable pins
such as power, ground, VREFOUT, and the serial digital interface are omitted for clarity. Any element in the schematic window can be accessed via mouse operations as well as menu commands. When completed, configurations can be saved, simulated, and downloaded to devices.
PAC-Designer operation can be automated and extended by using custom-designed Visual Basic™ programs that
set the interconnections and the parameters of ispPAC products. More information on this and other topics is
included in the on-line documentation as well as the PAC-Designer Getting Started Manual.
Design Simulation Capability
A powerful feature of PAC-Designer is its simulation capability, enabling quick and accurate verification of circuit
operation and performance. Once a circuit is configured via the interactive design process, gain and phase
response between any input and output can then be determined. This function is part of the simulator capability
which derives a transfer equation between the two points and then sweeps it over the user-specified frequency
range. Figure 3 shows a typical screen plot of the gain/phase simulator. In it are the input to output response
curves of an Elliptical and a Butterworth response stored in configuration A and B respectively. These are the two
options specified in the design screen window shown in Figure 2.
12
Lattice Semiconductor
ispPAC81 Data Sheet
The simulator is capable of displaying up to four separate input to output responses. This allows multiple signals to
be viewed as well as intermediate results of component changes so performance comparisons can be made.
There is also a user-positioned crosshair cursor that intersects the curves on the plot, and reads out the gain and
frequency in the lower right hand corner of the plot window when activated.
Figure 2. Initial PAC-Designer Schematic Design Entry Screen
PAC Designer - [ispPAC81.PAC: Plot]
File
Edit
View
Tools
Options
Window
Help
ispPAC81
IN
OUT
2
5th order
Low-pass Filter
PACell
IA
OA
Wakeup = Cfg A
CfgA
Type = Elliptical
Fc = 17.96kHz
Fs = 26.35kHz
PB Ripple = -1.26dB
SB Atten = -54.78dB
Filter ID = 1088
C1
C2
CfgB
Type = Butterworth
Fc = 60.02kHz
Fs =
PB Ripple =
SB Atten =
Filter ID = 282
L2
C3
C4
L4
C5
Cfg A
42.553 pF
3.623 pF
16.732 pF
61.759 pF
9.974 pF
13.564 pF
21.941 pF
Cfg B
3.306 pF
0.000 pF
8.548 pF
10.595 pF
0.000 pF
8.663 pF
1.655 pF
UES Bits = 000000000000000000000
Ready
Figure 3. PAC-Designer Simulation Plot Screen
PAC Designer - [ispPAC81.PAC: Schematic]
File
Edit
View
Tools
Options
Window
Help
Gain Plot
0
-20
-40
-60
-80
-100
-120
10
100
1K
10K
100K
1M
10M
Phase Plot
38.1
0
-50
-100
-150
-200
-250
-300
10
100
1K
10K
Ready
13
100K
1M
10M
Lattice Semiconductor
ispPAC81 Data Sheet
In-System Programmability
In-System Programming
The ispPAC81 is an in-system programmable device. This is accomplished by integrating all high voltage programming circuitry on-chip. Programming is performed through a 5-wire, IEEE 1149.1 compliant serial port interface at
normal logic levels. Once a device is programmed, all configuration information is stored on-chip, in non-volatile
E2CMOS memory cells. The specifics of the IEEE 1149.1 serial interface are described in the interface section of
this data sheet.
User Electronic Signature
A user electronic signature (UES) feature is included in the E2 memory of the ispPAC81. It contains 21 bits that can
be configured by the user to store unique data such as ID codes, revision numbers or inventory control data.
Electronic Security
An electronic security “fuse” (ESF) bit is provided in every ispPAC81 device to prevent unauthorized readout of the
E2CMOS user bit patterns. Once programmed, this cell prevents further access to the functional user bits in the
device. This cell can only be erased by reprogramming the device, so the original configuration can not be examined once programmed. Usage of this feature is optional.
Production Programming Support
Once a final configuration is determined, an ASCII format JEDEC file is created using the PAC-Designer software.
Devices can then be ordered through the usual supply channels with the user’s specific configuration already preloaded into the devices. By virtue of its standard interface, compatibility is maintained with existing production programming equipment, giving customers a wide degree of freedom and flexibility in production planning.
Evaluation Fixture
Included in the basic ispPAC81 Design Kit is an engineering prototype board that can be connected to the parallel
port of a PC. It demonstrates proper layout techniques for the ispPAC81 and can be used in real time to check circuit operation as part of the design process. Input and output connections as well as a “breadboard” circuit area
are provided to speed debugging of the circuit.
Figure 4. Configuring the ispPAC81 “In-System” from a PC Parallel Port
PAC-Designer
Software
Other
System
Circuitry
ispDownload
Cable (6')
4
14
ispPAC81
Device
Lattice Semiconductor
ispPAC81 Data Sheet
IEEE Standard 1149.1 Interface
Serial Port Programming Interface
Communication with the ispPAC81 is facilitated via an IEEE 1149.1 test access port (TAP). It is used by the
ispPAC81 as a serial programming interface, and not for boundary scan test purposes. There are no boundary
scan logic cells in the ispPAC81 architecture. This does not prevent the ispPAC81 from functioning correctly, however, when placed in a valid serial chain with other IEEE 1149.1 compliant devices.
A brief description of the ispPAC81 serial interface follows. For complete details of the reference specification, refer
to the publication, Standard Test Access Port and Boundary-Scan Architecture, IEEE Std 1149.1-1990 (which now
includes IEEE Std 1149.1a-1993).
Overview
An IEEE 1149.1 test access port (TAP) provides the control interface for serially accessing the digital I/O of the
ispPAC81. The TAP controller is a state machine driven with mode and clock inputs. Under the correct protocol,
instructions are shifted into an instruction register which then determines subsequent data input, data output, and
related operations. Device programming is performed by addressing the user register, shifting data in, and then
executing a program user instruction, after which the data is transferred to internal E2CMOS cells. It is these nonvolatile cells that determine the configuration of the ispPAC81. By cycling the TAP controller through the necessary
states, data can also be shifted out of the user register to verify the current ispPAC81 configuration. Instructions
exist to access all data registers and perform internal control operations.
For compatibility between compliant devices, two data registers are mandated by the IEEE 1149.1 specification.
Others are functionally specified, but inclusion is strictly optional. Finally, there are provisions for optional data registers defined by the manufacturer. The two required registers are the bypass and boundary-scan registers. For
ispPAC81, the bypass register is a one-bit shift register that provides a short path through the device when boundary testing or other operations are not being performed. The ispPAC81, as mentioned, has no boundary scan logic
and therefore no boundary scan register. All instructions relating to boundary scan operations place the ispPAC81
in the BYPASS mode to maintain compliance with the specification. The optional identification register described in
IEEE 1149.1 is also included in the ispPAC81. One additional data register included in the TAP of the ispPAC81 is
the Lattice defined user register. Figure 5 shows how the instruction and various data registers are placed in an
ispPAC81.
Figure 5. ispPAC81 TAP Registers
USER REGISTER
MUX
ID REGISTER
BYPASS REGISTER
INSTRUCTION REGISTER
TEST ACCESS PORT
(TAP) LOGIC
TDI
TCK
TMS
OUTPUT
LATCH
TDO
15
Lattice Semiconductor
ispPAC81 Data Sheet
TAP Controller Specifics
The TAP is controlled by the Test Clock (TCK) and Test Mode Select (TMS) inputs. These inputs determine whether
an Instruction Register or Data Register operation is performed. Driven by the TCK input, the TAP consists of a
small 16-state controller design. In a given state, the controller responds according to the level on the TMS input as
shown in Figure 6. Test Data In (TDI) and TMS are latched on the rising edge of TCK, with Test Data Out (TDO)
becoming valid on the falling edge of TCK. There are six steady states within the controller: Test-Logic-Reset, RunTest/Idle, Shift-Data-Register, Pause-Data-Register, Shift-Instruction-Register and Pause-Instruction-Register. But
there is only one steady state for the condition when TMS is set high: the Test-Logic-Reset state. This allows a
reset of the test logic within five TCKs or less by keeping the TMS input high. Test-Logic-Reset is the power-on
default state.
Figure 6. Test Access Port (TAP) Controller State Diagram
1
Test-Logic-Rst
0
Run-Test/Idle
0
1
Select-DR-Scan
1
1
0
Capture-DR
Select-IR-Scan
1
0
Capture-IR
0
0
0
Shift-DR
1
1
1
Exit1-IR
0
0
Pause-DR
1
Pause-IR
0
Exit2-IR
1
Update-DR
0
0
1
0
Exit2-DR
1
0
Shift-IR
1
Exit1-DR
0
1
1
Update-IR
1
0
Note: The value shown adjacent to each state transition in this figure
represents the signal present at TMS at the time of a rising edge at TCK.
When the correct logic sequence is applied to the TMS and TCK inputs, the TAP will exit the Test-Logic-Reset state
and move to the desired state. The next state after Test-Logic-Reset is Run-Test/Idle. Until a data or instruction
scan is performed, no action will occur in Run-Test/Idle (steady state = idle). After Run-Test/Idle, either a data or
instruction scan is performed. The states of the Data and Instruction Register blocks are identical to each other differing only in their entry points. When either block is entered, the first action is a capture operation. For the Data
Registers, the Capture-DR state is very simple: it captures (parallel loads) data onto the selected serial data path
(previously chosen with the appropriate instruction). For the Instruction Register, the Capture-IR state will always
load the IDCODE instruction. It will always enable the ID Register for readout if no other instruction is loaded prior
to a Shift-DR operation. This, in conjunction with mandated bit codes, allows a “blind” interrogation of any device in
a compliant IEEE 1149.1 serial chain.
From the Capture state, the TAP transitions to either the Shift or Exit1 state. Normally the Shift state follows the
Capture state so that test data or status information can be shifted out or new data shifted in. Following the Shift
state, the TAP either returns to the Run-Test/Idle state via the Exit1 and Update states or enters the Pause state via
Exit1. The Pause state is used to temporarily suspend the shifting of data through either the Data or Instruction
Register while an external operation is performed. From the Pause state, shifting can resume by reentering the
16
Lattice Semiconductor
ispPAC81 Data Sheet
Shift state via the Exit2 state or be terminated by entering the Run-Test/Idle state via the Exit2 and Update states.
If the proper instruction is shifted in during a Shift-IR operation, the next entry into Run-Test/Idle initiates the test
mode (steady state = test). This is when the device is actually programmed, erased or verified. All other instructions
are executed in the Update state.
Test Instructions
Like data registers, the IEEE 1149.1 standard also mandates the inclusion of certain instructions. It outlines the
function of three required and six optional instructions. Any additional instructions are left exclusively for the manufacturer to determine. The instruction word length is not mandated other than to be a minimum of two bits, with only
the BYPASS and EXTEST instruction code patterns being specifically called out (all ones and all zeroes respectively). The ispPAC81 contains the required minimum instruction set as well as one from the optional instruction set.
In addition, there are several proprietary instructions that allow the device to be configured and verified. For
ispPAC81, the instruction word length is five bits. All ispPAC81 instructions available to users are shown in Table 5.
Table 5. ispPAC81 TAP Instructions
Instruction
Code
Description
EXTEST
00000
External Test. Default to BYPASS.
ADDUSR
00001
Address User Data Register (A or B).
ABE
00010
User A Bulk Erase.
BBE
00011
User B Bulk Erase.
VERA
00100
Verify User A Data Register.
VERB
00101
Verify User B Data Register.
PRGA
00110
Program User A Data Register.
PRGB
00111
Program User B Data Register.
ENCAL
01100
Enable Calibration Sequence.
IDCODE
01101
Read Identification Data Register.
SAMPLE
11110
Sample/Preload. Default to BYPASS.
BYPASS
11111
Bypass (Connect TDI to TDO).
BYPASS is one of the three required instructions. It selects the Bypass Register to be connected between TDI and
TDO and allows serial data to be transferred through the device without affecting the operation of the ispPAC81.
The bit code of this instruction is defined to be all ones by the IEEE 1149.1 standard.
The required SAMPLE/PRELOAD instruction dictates the Boundary-Scan Register be connected between TDI
and TDO. The ispPAC81 has no boundary-scan register, so for compatibility it defaults to the BYPASS mode whenever this instruction is received. The bit code for this instruction is defined by Lattice as shown in Table 5.
The EXTEST (External Test) instruction is required and would normally place the device into an external boundary
test mode while also enabling the Boundary-Scan Register to be connected between TDI and TDO. Again, since
the ispPAC81 has no boundary-scan logic, the device is put in the BYPASS mode to ensure specification compatibility. The bit code of this instruction is defined by the 1149.1 standard to be all zeros.
The optional IDCODE (Identification Code) instruction is incorporated in the ispPAC81 and leaves it in its functional
mode when executed. It selects the Device Identification Register to be connected between TDI and TDO. The
Identification Register is a 32-bit shift register containing information regarding the IC manufacturer, device type
and version code (see Figure 7). Access to the Identification Register is immediately available, via a TAP data scan
operation, after power-up of the device, or by issuing a Test-Logic-Reset instruction. The bit code for this instruction
is defined by Lattice as shown in Table 5.
17
Lattice Semiconductor
ispPAC81 Data Sheet
Figure 7. Identification Code (IDCODE) 32-Bit Binary Word for Lattice ispPAC81
MSB
LSB
XXXX / 0000 0001 0010 0001 / 0000 0100 001 / 1
Part Number JEDEC Manfacturer
(16 bits)
Identity Code for
0121h = PAC81 Lattice Semiconductor
(11 bits)
Constant 1
Version
(1 bit)
(4 bits)
2
per 1149.1-1990
E Configured
ADDUSR (Address User Register) instruction is a Lattice-defined instruction that selects the user register to be
shifted during a Shift-DR operation. Normal operation of a device is not interrupted by this instruction. It precedes a
PRGA or PRGB (Program User A or B) instruction to shift in a new configuration from the user register into either
the A or B configuration memory, and follows a VERA or VERB (Verify User A or B) instruction to shift out the current configuration of either A or B configuration memory into the user register. The bit code for this instruction is
shown in Table 5.
The PRGA and PRGB (Program User A or B) are Lattice instructions that enable the data shifted into the user register to be programmed into the non-volatile E2CMOS memory of the ispPAC81 and thereby alter either or both of
its two user configurations. The user register is a 96-bit shift register that contains all the user-controlled parametric
data pertaining to the configuration of the ispPAC81. NOTE: Although the user register length is 96 bits, only the “A”
configuration is that long. The device gain setting bits, UES bits, and security fuse bit are all part of the “A” configuration memory and are not stored at all in “B” memory, which only contains the unique capacitor settings of that
configuration. When initially programming or reprogramming the ispPAC81 with software other than PAC-Designer,
or an authorized third-party programmer (e.g., via microcontroller, refer to the Lattice application note covering the
required algorithms necessary for complete JTAG device programming control of the ispPAC81, specific bit assignments, word lengths, etc.). Normal operation of the device is interrupted during the actual programming time. A
programming operation does not begin until entry of the Run-Test/Idle state. The time required to insure data retention is given in the TAP signal specifications table. The user must ensure that the recommended programming
times are observed. The bit code for these instructions is shown in Table 5.
VERA and VERB (Verify User A or B) are the next Lattice instructions and cause the current A or B configurations
of the ispPAC81 to be loaded into the user register. This operation doesn’t interrupt operation of the device. The
current configuration of either the A or B configuration memory can then be shifted out of the user register immediately after an ADDUSR instruction is executed. NOTE: The verification of memory configuration “A” is possible only
when the A/B bit is set to a logic 0. This must be taken into account if verify will be performed at a later time on
parts with unknown configurations (refer to the Lattice application note covering the required algorithms necessary
for complete JTAG device programming control of the ispPAC81, specific bit assignments, word lengths, etc.). If the
A/B bit has been set to a logic 1, it will not be possible to do a VERA command properly. The bit code for this
instruction is shown in Table 5.
ENCAL (Enable Calibration) is a Lattice instruction that enables the start of an auto-calibration sequence. This
operation causes all outputs of the device to go to 2.5V until the calibration sequence is completed (see Timing
Specifications). As with the programming instructions above, calibration does not begin until entry of the Run-Test/
Idle state. The completion of the calibration is not dependent, however, on any further TAP control. This means the
state of the TAP can be returned immediately to the Test-Logic-Reset state. The only consideration would be to not
clock the TAP during critical analog operations. The first several milliseconds of the calibration routine are consumed waiting for configurations to settle, though, leaving more than enough time to clock the TAP back to the TestLogic-Reset state. The bit code for this instruction is shown in Table 5.
The last Lattice instructions are ABE and BBE (User A or B Bulk Erase). Operation of the device is interrupted during an ABE or BBE, during which all inputs are disconnected and all outputs driven to VREFOUT (2.5V). To economize internal circuitry, programming can only be selectively done in one direction (from zeroes to ones). The ABE
18
Lattice Semiconductor
ispPAC81 Data Sheet
and BBE are used to return all user bits to a zero state at the same time. An ABE or BBE usually proceeds a PRGA
or PRGB operation, otherwise one to zero changes would not be implemented. It can also be used to erase all configuration information from a device and is the default condition of parts shipped from the factory. The same programming time constraints apply to ABE and BBE as for PRGA and PRGB. The bit code for this instruction is
shown in Table 5.
The ADDUSR, BYPASS, EXTEST, IDCODE and SAMPLE/PRELOAD instructions are all executed in the UpdateIR state. Other instructions: PRGUSR, VERUSR and UBE are executed upon entry of the Run-Test/Idle state.
It is recommended that when all serial interface operations are completed, the TAP controller be reset and left in
the Test-Logic-Reset state (the power-up default) and the TCK and TMS inputs idled. This will insure the best analog performance possible by minimizing the effects of digital logic “feed-through.”
19
Lattice Semiconductor
ispPAC81 Data Sheet
Package Diagrams
16-Pin Plastic PDIP
Dimensions in Inches MIN./MAX. Dimensions in millimeters, shown in parenthesis, are for reference only.
.300 / .325
(7.61 / 8.25)
.240 / .260
(6.10 / 6.60)
.745 / .755
(18.92 / 19.18)
.008 / .012
(.20 / .31)
0-15
.195 (4.95) MAX
.015 (.38) MIN
.125 / .135
(3.17 / 3.43)
.055 /.065
(1.40 / 1.65)
.015 /.022
(.38 / .56)
.100 (2.54) BSC
16-Pin Plastic SOIC
Dimensions in Inches MIN./MAX. Dimensions in millimeters, shown in parenthesis, are for reference only.
.292 (7.42)
.400 (10.16)
.299 (7.59)
.410 (10.41)
.050 (1.27) BSC
.014 (.35)
.019 (.48)
.097 (2.46)
.104 (2.64)
.0091 (.23)
.0125 (.32)
.402 (10.21)
.412 (10.46)
.0050 (.127)
.0115 (.292)
0
8
.024 (.61)
.040 (1.02)
20
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