CLARE IXDN630YI 30-ampere low-side ultrafast mosfet driver Datasheet

IXD_630
30-Ampere Low-Side
Ultrafast MOSFET Drivers
Features
Description
• 30A Peak Source/Sink Drive Current
• High Operating Voltage Capability: 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Under-Voltage Lockout Protection
• Logic Input Withstands Negative Swing of up to 5V
• Fast Rise and Fall Times: < 20ns
• Low Propagation Delay Time
• Low 10A Supply Current
• Low Output Impedance
The IXDD630/IXDI630/IXDN630 high-speed gate
drivers are especially well suited for driving the latest
IXYS power MOSFETs and IGBTs. The IXD_630
output can source and sink 30A of peak current while
producing voltage rise and fall times of less than 20ns.
Internal circuitry eliminates cross conduction and
current "shoot-through," and the driver is virtually
immune to latch up. Under-voltage lockout (UVLO)
circuitry holds the output LOW until sufficient supply
voltage is applied (12.5V for the IXD_630 versions,
and 9V for the IXD_630M versions). Low propagation
delays and fast, matched rise and fall times make the
IXD_630 family ideal for very high frequency and
high-power applications.
Applications
•
•
•
•
•
•
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
Pb
RoHS
2002/95/EC
e3
The IXDD630 is configured as a non-inverting driver
with an enable. The IXDN630 is configured as a
non-inverting driver, and the IXDI630 is configured as
an inverting driver.
The IXD_630 family is available in a 5-pin TO-220 (CI),
and a 5-pin TO-263 (YI) package.
Ordering Information
Part Number
IXDD630CI
IXDD630MCI
IXDD630YI
IXDD630MYI
IXDI630CI
IXDI630MCI
IXDI630YI
IXDI630MYI
IXDN630CI
IXDN630MCI
IXDN630YI
IXDN630MYI
DS-IXD_630-R01
Logic
Configuration
IN
OUT
EN
IN
OUT
IN
OUT
UVLO
Package Type
Packing
Method
Quantity
12.5V
9V
12.5V
9V
12.5V
9V
12.5V
9V
12.5V
9V
12.5V
9V
5-Pin TO-220
5-Pin TO-220
5-Pin TO-263
5-Pin TO-263
5-Pin TO-220
5-Pin TO-220
5-Pin TO-263
5-Pin TO-263
5-Pin TO-220
5-Pin TO-220
5-Pin TO-263
5-Pin TO-263
Tube
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1
IXD_630
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Lead Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Lead Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
4
4
5
5
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 IXDD630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 IXDI630 Block Diagram & Truth Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 IXDN630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6
6
6
3. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
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R01
IXD_630
1 Specifications
1.1 Lead Configurations
1.2 Lead Definitions
IXDD630 CI / YI
Lead Name
VCC
1
OUT
2
GND
3
IN
4
EN
5
IN
Logic Input
EN
Output Enable - Drive lead low to disable
output, and force output to a high impedance
state
OUT
Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT
Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC
Supply Voltage - Provides power to the device
GND
Ground - Common ground reference for the
device
IXDI630 CI / YI
VCC
1
OUT
2
GND
3
IN
4
NC
5
Description
NC
Not connected
IXDN630 CI / YI
VCC
1
OUT
2
GND
3
IN
4
NC
5
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VCC
-0.3
40
V
VIN , VEN
-5
VCC+0.3
V
IOUT
-
±30
A
Junction Temperature
TJ
-55
+150
°C
Storage Temperature
TSTG
-65
+150
°C
Supply Voltage
Input Voltage Range
Output Current
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
R01
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3
IXD_630
1.4 Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temperature Range
Symbol
Minimum
Maximum
Units
VCC
UVLO
35
V
TA
-40
+125
°C
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: UVLO < VCC < 35V (unless otherwise noted).
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Input Voltage, High
UVLO < VCC < 18V
VIH
3.5
-
-
Input Voltage, Low
UVLO < VCC < 18V
VIL
-
-
0.8
Input Current
0V < VIN < VCC
IIN
-
-
±10
EN Input Voltage, High
IXDD630 only
VENH
2/3VCC
-
-
EN Input Voltage, Low
IXDD630 only
VENL
-
-
1/3VCC
Output Voltage, High
-
VOH
VCC-0.025
-
-
Output Voltage, Low
-
VOL
-
-
0.025
Output Resistance, High State
VCC=18V, IOUT= -100mA
ROH
-
0.17
0.4
Output Resistance, Low State
VCC=18V, IOUT=100mA
ROL
-
0.16
0.3
IDC
-
-
±8
tr
-
11
20
Units
V
A
V
V

Rise Time
Limited by package power
dissipation
CLOAD=5.6nF, VCC=18V
Fall Time
CLOAD=5.6nF, VCC=18V
tf
-
11
18
On-Time Propagation Delay
CLOAD=5.6nF, VCC=18V
tondly
-
46
65
Off-Time Propagation Delay
CLOAD=5.6nF, VCC=18V
toffdly
-
46
65
Output Enable Time
IXDD630 only
tPZL, tPZH
-
34
65
Output Disable Time
IXDD630 only
tPLZ, tPHZ
-
65
125
Enable Pull-Up Resistor
IXDD630 only
REN
-
400
-
k
-
2.5
4
mA
-
-
0.75
-
-
0.75
7
9
9.9
10
12.5
13.5
-
1
-
-
1.5
-
Output Current, Continuous
VCC=18V, VIN=3.5V
Power Supply Current
VCC=18V, VIN=0V
ICC
VCC=18V, VIN=VCC
Under-Voltage Lockout Threshold
Under-Voltage Lockout Hysteresis
4
VCC Rising, IXD_630M
VCC Rising, IXD_630
IXD_630M
IXD_630
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UVLO
-
A
ns
mA
V
V
R01
IXD_630
1.6 Electrical Characteristics: TA = - 40°C to +125°C
Test Conditions: UVLO < VCC < 35V, TJ<150°C.
Parameter
Conditions
Symbol
Minimum
Maximum
Input Voltage, High
UVLO < VCC < 18V
VIH
4
-
Input Voltage, Low
UVLO < VCC < 18V
VIL
-
0.8
Output Resistance, High State
VCC=18V, IOUT= -100mA
ROH
-
0.6
Output Resistance, Low State
VCC=18V, IOUT=100mA
ROL
-
0.45
Rise Time
CLOAD=5.6nF, VCC=18V
tr
-
35
Fall Time
CLOAD=5.6nF, VCC=18V
tf
-
35
On-Time Propagation Delay
CLOAD=5.6nF, VCC=18V
tondly
-
100
Off-Time Propagation Delay
CLOAD=5.6nF, VCC=18V
toffdly
-
100
Units
V

ns
1.7 Thermal Characteristics
Package
IXD_630CI (5-Lead TO-220)
IXD_630YI (5-Lead TO-263)
IXD_630CI (5-Lead TO-220)
IXD_630YI (5-Lead TO-263)
R01
Parameter
Symbol
Rating
Thermal Resistance, Junction-to-Ambient
JA
36
Thermal Resistance, Junction-to-Case
JC
3
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46
2
Units
°C/W
°C/W
5
IXD_630
2 Functional Description
2.1 IXDD630 Block Diagram & Truth Table
2.3 IXDN630 Block Diagram & Truth Table
IXDD630
IXDN630
VCC
VCC
IN
IN
OUT
UVLO
OUT
UVLO
GND
GND
EN
IN
EN
OUT
IN
OUT
0
1 or open
0
0
0
1
1
1
1 or open
1
0
0
Z
1
0
Z
2.2 IXDI630 Block Diagram & Truth Table
IXDI630
VCC
IN
OUT
UVLO
GND
6
IN
OUT
0
1
1
0
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R01
IXD_630
CLOAD=200nF
CLOAD=100nF
CLOAD=50nF
CLOAD=25nF
CLOAD=10nF
10
15
20
25
Supply Voltage (V)
30
110
100
90
80
70
60
50
40
30
20
10
0
27
26
CLOAD=50nF
CLOAD=25nF
15
Fall Time (ns)
Rise Time (ns)
60
40
60
70
tondly
toffdly
30
50
100
150
Load Capacitance (nF)
80
60
toffdly
40
tondly
20
5
10
15
20
Input Voltage (V)
25
70
60
Max VIL
2.6
2.4
2.2
toffdly
40
30
-50 -30 -10
Input Threshold
vs. Supply Voltage
10 30 50 70
Temperature (ºC)
90
110 130
Enable Thresholds
vs. Supply Voltage
4.0
22
Enable Threshold (V)
2.8
tondly
50
30
3.5
Min VIH
3.0
Max VIL
2.5
2.0
18
16
14
VENH
VENL
12
10
8
6
1.8
2.0
-50 -30 -10
R01
Propagation Delay
vs. Junction Temperature
(VIN=0-5V, CLOAD= 5.6nF, VCC=18V, f=1kHz)
20
Min VIH
3.0
200
20
0
35
Input Threshold vs. Temperature
(VCC=18V, CLOAD=5.6nF)
3.2
Input Threshold (V)
15
20
25
Supply Voltage (V)
Input Threshold (V)
3.4
0
200
0
20
10
110 130
40
Propagation Delay vs. Input Voltage
(VCC=25V, CLOAD=5.6nF, f=1kHz)
100
Propagation Delay (ns)
Propagation Delay (ns)
80
5
90
0
50
100
150
Load Capacitance (nF)
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CLOAD=5.6nF, f=1KHz)
30
10 30 50 70
Temperature (ºC)
20
0
40
-50 -30 -10
35
VCC=10V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
80
0
50
30
Fall Time vs. Load Capacitance
20
60
tr
100
80
90
tf
23
20
20
25
Supply Voltage (V)
VCC=10V
VCC=12V,18V,25V,30V,35V
24
21
CLOAD=10nF
Rise Time vs. Load Capacitance
100
25
22
10
35
Rise & Fall Times vs. Temperature
(VIN=0-5V, VCC=18V, CLOAD=25nF)
28
CLOAD=200nF
CLOAD=100nF
Propagation Delay (ns)
110
100
90
80
70
60
50
40
30
20
10
0
Fall Time vs. Supply Voltage
(VIN=0-5V, f=10kHz, TA=25ºC)
Time (ns)
Rise Time vs. Supply Voltage
(VIN=0-5V, f=10kHz, TA=25ºC)
Fall Time (ns)
Rise Time (ns)
3 Typical Performance Characteristics
10 30 50 70
Temperature (ºC)
90
110 130
4
10
15
20
25
Supply Voltage (V)
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30
35
10 12 14 16 18 20 22 24 26 28 30 32 34 36
Supply Voltage (V)
7
IXD_630
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
1
Supply Current vs. Load Capacitance
(VCC=10V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
100
10
f=10kHz
1
5000
1
0.1
1
0.1
10
100
Frequency (kHz)
Output Source Current (A)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -30 -10
10 30 50 70
Temperature (ºC)
90
110 130
1
0.1
10
1
0.1
10
100
Frequency (kHz)
1000
Quiesent Supply Current
vs. Temperature
(VCC=18V)
3.0
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
VIN=3.5V
VIN=5V
VIN=10V
VIN=0V & 18V
2.5
2.0
1.5
1.0
0.5
0.0
1
Dynamic Supply Current
vs. Temperature
(VCC=18V, VIN=0-5V, f =1kHz, CLOAD=5.6nF)
10
Supply Current vs. Frequency
(VCC=10V)
100
1000
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
1
10
100
Frequency (kHz)
1000
-50 -30 -10
Output Source Current
vs. Supply Voltage
(VIN=7V, CLOAD=1μF)
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
Output Sink Current (A)
10
100
Frequency (kHz)
25000
Supply Current vs. Frequency
(VCC=18V)
100
1000
0.01
1
10000
15000
20000
Load Capacitance (pF)
0.01
1
1000
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
10
Supply Current (mA)
10
25000
0.01
8
1
5000
1000
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
100
f=100kHz
f=50kHz
f=10kHz
10
7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5
Load Capacitance (nF)
Supply Current vs. Frequency
(VCC=35V)
1000
Supply Current (mA)
Supply Current (mA)
100
5.0
0.01
10000
15000
20000
Load Capacitance (pF)
Supply Current vs. Frequency
(VCC=12V)
1000
f=100kHz
f=50kHz
f=10kHz
1
7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5
Load Capacitance (nF)
Supply Current (mA)
Supply Current (mA)
1000
10
100
Supply Current (mA)
5.0
f=1MHz
f=500kHz
100
Supply Current vs. Load Capacitance
(VCC=12V)
f=1MHz
f=500kHz
Supply Current (mA)
10
1000
Supply Current (mA)
100
Supply Current vs. Load Capacitance
(VCC=18V)
1000
Supply Current (mA)
Supply Current (mA)
1000
Supply Current vs. Load Capacitance
(VCC=35V)
10
15
20
25
Supply Voltage (V)
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30
35
10 30 50 70
Temperature (ºC)
90
110 130
Output Sink Current
vs. Supply Voltage
(VIN=7V, CLOAD=1μF)
65
60
55
50
45
40
35
30
25
20
15
10
10
15
20
25
Supply Voltage (V)
30
35
R01
IXD_630
Output Source Current
vs. Temperature
(VCC=18V, CLOAD=1μF)
-26
-28
-30
-32
-34
-36
10 30 50 70
Temperature (ºC)
90
110 130
34
32
30
28
10 30 50 70
Temperature (ºC)
90
0.16
0.14
ROL @ +100mA
35
10
15
20
25
Supply Voltage (V)
30
35
13.0
8.5
8.0
VCC Falling
7.5
7.0
0.10
30
0.12
Under-Voltage Lockout Threshold
vs. Temperature - IXD_630
UVLO Threshold (V)
UVLO Threshold (V)
0.18
15
20
25
Supply Voltage (V)
0.14
5
9.0
0.20
10
ROH @ -100mA
0.16
110 130
VCC Rising
5
0.18
Under Voltage Lockout Threshold
vs. Temperature - IXD_630M
0.22
0.12
0.20
0.10
-50 -30 -10
Low-State Output Resistance
vs. Supply Voltage
Output Resistance (Ω)
0.22
26
-50 -30 -10
R01
High-State Output Resistance
vs. Supply Voltage
Output Resistance (Ω)
36
Output Sink Current (A)
Output Source Current (A)
-24
Output Sink Current
vs. Temperature
(VCC=18V, CLOAD=1μF)
12.5
VCC Rising
12.0
11.5
11.0
VCC Falling
10.5
10.0
-50 -30 -10
10 30 50 70
Temperature (ºC)
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90
110 130
-50 -30 -10
10 30 50 70
Temperature (ºC)
90
110 130
9
IXD_630
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IXD_630YI / IXD_630MYI / IXD_630CI / IXD_630MCI
MSL1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
IXD_630YI / IXD_630MYI / IXD_630CI / IXD_630MCI
245°C for 30 seconds
4.4 Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or
fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
Pb
10
RoHS
2002/95/EC
e3
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IXD_630
4.5 Mechanical Dimensions
4.5.1 IXD_630YI (5-Lead TO-263)
1.00 / 1.40
(0.039 / 0.055)
1.20 / 1.40
(0.047 / 0.055)
9.65 / 10.30
(0.380 / 0.406)
4.20 / 4.80
(0.165 / 0.189)
8.80 / 9.50
(0.346 / 0.374)
1 2 3 4 5
Recommended PCB Pattern
10.40
(0.409)
9.15
(0.360)
3.65
(0.144)
14.80 / 15.80
(0.583 / 0.622)
6.35
(0.250)
0.40 / 0.70
(0.016 / 0.028)
1.70 BSC
(0.067 BSC)
0.60 / 0.99
(0.024 / 0.039)
3.85
(0.152)
1.70
(0.067)
1.05
(0.041)
2.24 / 2.84
(0.088 / 0.112)
7.50 / 8.20
(0.295 / 0.323)
Optional
0º - 3º
6.60 / 7.20
(0.260 / 0.283)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
2.10 / 2.70
(0.083 / 0.106)
6
NOTES:
1. All metal surfaces are solder-plated except trimmed area.
2. Short lead of No. 3 is optional to IXYS.
3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
1.20 / 1.70
(0.047 / 0.067)
4.5.2 IXD_630CI (5-Lead TO-220)
1.14 / 1.40
(0.045 / 0.055)
4.32 / 4.83
(0.170 / 0.190)
9.91 / 10.54
(0.390 / 0.415)
14.73 / 15.75
(0.580 / 0.620)
11.94 / 12.95
(0.470 / 0.510)
7.823
(0.308)
12.387
(0.487)
8.64 / 9.40
(0.340 / 0.370)
6.299
(0.248)
3
1 2 3 4 5
6.502
(0.256)
25.27 / 26.54
(0.995 / 1.045)
0.64 / 1.02
(0.025 / 0.040)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
1.70 BSC
(0.067 BSC)
0.38 / 0.64
(0.015 / 0.025)
2.29 / 2.92
(0.090 / 0.115)
NOTES:
1. This drawing will meet all dimensions requirement of
JEDEC outlines TS-001AA and 5-lead version TO-220AB.
2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)
3. The metal tab is connected to pin 3 (GND).
R01
7.620
(0.300)
12.70 / 14.73
(0.50 / 0.58)
Recommended Hole Pattern
Finished Hole Diameter = 1.45mm (0.057 in.)
1.70mm (0.067 in.)
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11
IXD_630
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death
to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at
Specification: DS-IXD_630-R01
any time without notice.
©Copyright 2011, Clare, Inc.
All rights reserved. Printed in USA.
9/29/2011
12
www.clare.com
R01
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