IXYS IXFK420N10T Gigamos trench hiperfet power mosfet Datasheet

Advance Technical Information
IXFK420N10T
IXFX420N10T
GigaMOSTM Trench
HiperFETTM
Power MOSFET
VDSS
ID25
=
=
100V
420A
Ω
2.6mΩ
140ns
RDS(on) ≤
≤
trr
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
TO-264 (IXFK)
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGS = 1MΩ
100
100
V
V
VGSS
VGSM
Continuous
Transient
± 20
± 30
V
V
ID25
IL(RMS)
IDM
TC = 25°C (Chip Capability)
External Lead Current Limit
TC = 25°C, Pulse Width Limited by TJM
420
160
1000
A
A
A
IA
EAS
TC = 25°C
TC = 25°C
100
5
A
J
PD
TC = 25°C
1670
W
dV/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 175°C
20
V/ns
-55 ... +175
175
-55 ... +175
°C
°C
°C
300
260
°C
°C
1.13/10
Nm/lb.in.
20..120 /4.5..27
N/lb.
10
6
g
g
TJ
TJM
Tstg
TL
TSOLD
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
Md
Mounting Torque (TO-264)
FC
Mounting Force
Weight
TO-264
PLUS247
(PLUS247)
G
G
BVDSS
VGS = 0V, ID = 3mA
100
VGS(th)
VDS = VGS, ID = 8mA
2.5
IGSS
VGS = ± 20V, VDS = 0V
IDSS
VDS = VDSS, VGS= 0V
RDS(on)
VGS = 10V, ID = 60A, Note 1
5.0
± 200
TJ = 150°C
z
z
z
z
z
D = Drain
TAB = Drain
International Standard Packages
High Current Handling Capability
Fast Intrinsic Diode
Avalanche Rated
Low RDS(on)
Advantages
z
Easy to Mount
Space Savings
High Power Density
V
Applications
V
z
z
nA
TAB
S
Features
z
50 μA
5 mA
z
2.6 mΩ
z
z
z
z
© 2009 IXYS CORPORATION, All Rights Reserved
D
G = Gate
S = Source
z
Characteristic Values
Min.
Typ.
Max.
TAB
S
PLUS247 (IXFX)
z
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
D
Synchronous Recification
DC-DC Converters
Battery Chargers
Switch-Mode and Resonant-Mode
Power Supplies
DC Choppers
AC Motor Drives
Uninterruptible Power Supplies
High Speed Power Switching
Applications
DS100198(09/09)
IXFK420N10T
IXFX420N10T
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
110
VDS = 10V, ID = 60A, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Gate Input Resistance
td(on)
Resistive Switching Times
tr
td(off)
tf
S
47
nF
pF
530
pF
1.46
Ω
47
ns
155
ns
115
ns
255
ns
670
nC
170
nC
195
nC
VGS = 10V, VDS = 0.5 • VDSS, ID = 100A
RG = 1Ω (External)
Qg(on)
Qgs
185
4390
Crss
RGi
TO-264 (IXFK) Outline
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
0.09
RthJC
RthCS
°C/W
°C/W
0.15
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
ISM
Repetitive, Pulse Width Limited by TJM
VSD
IF = 60A, VGS = 0V, Note 1
trr
QRM
IRM
420
A
1680
A
1.2
V
140
IF = 150A, -di/dt = 100A/μs
VR = 60V, VGS = 0V
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
μC
7.00
A
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
5,049,961
5,063,307
5,187,117
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
PLUS 247TM (IXFX) Outline
Dim.
4,931,844
5,017,508
5,034,796
4.82
5.13
2.54
2.89
2.00
2.10
1.12
1.42
2.39
2.69
2.90
3.09
0.53
0.83
25.91 26.16
19.81 19.96
5.46 BSC
0.00
0.25
0.00
0.25
20.32 20.83
2.29
2.59
3.17
3.66
6.07
6.27
8.38
8.69
3.81
4.32
1.78
2.29
6.04
6.30
1.57
1.83
Inches
Min.
Max.
ns
0.38
Note 1. Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
Millimeter
Min.
Max.
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
A
A1
A2
b
b1
b2
C
D
E
e
L
L1
Q
R
Millimeter
Min. Max.
4.83
5.21
2.29
2.54
1.91
2.16
1.14
1.40
1.91
2.13
2.92
3.12
0.61
0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81
4.32
5.59
6.20
4.32
4.83
Inches
Min. Max.
.190 .205
.090 .100
.075 .085
.045 .055
.075 .084
.115 .123
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFK420N10T
IXFX420N10T
Fig. 1. Output Characteristics
Fig. 2. Extended Output Characteristics
@ T J = 25ºC
350
@ T J = 25ºC
400
VGS = 15V
10V
8V
7V
300
6V
300
ID - Amperes
250
ID - Amperes
VGS = 15V
10V
7V
350
6V
200
150
5.5V
250
200
150
5V
100
5V
100
50
50
4V
4V
0
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.0
0.8
0.5
1.0
1.5
VDS - Volts
2.0
2.5
3.0
3.5
VDS - Volts
Fig. 3. Output Characteristics
Fig. 4. Normalized RDS(on) vs. Junction Temperature
@ T J = 150ºC
2.6
320
VGS = 15V
10V
8V
7V
ID - Amperes
240
6V
200
R DS(on) - Normalized
280
5V
160
120
4.5V
80
2.4
VGS = 10V
2.2
I D < 420A
2.0
1.8
1.6
1.4
1.2
1.0
0.8
40
4V
0.6
0.4
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-50
1.6
-25
0
25
VDS - Volts
Fig. 5. Normalized RDS(on) vs. Drain Current
75
100
125
150
175
Fig. 6. Drain Current vs. Case Temperature
180
2.8
VGS = 10V
2.6
160
External Lead Current Limit
2.4
140
TJ = 175ºC
2.2
120
ID - Amperes
R DS(on) - Normalized
50
TJ - Degrees Centigrade
2.0
1.8
1.6
100
80
60
1.4
40
1.2
TJ = 25ºC
20
1.0
0.8
0
0
50
100
150
200
ID - Amperes
© 2009 IXYS CORPORATION, All Rights Reserved
250
300
350
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
175
IXFK420N10T
IXFX420N10T
Fig. 7. Input Admittance
Fig. 8. Transconductance
180
350
TJ = - 40ºC
160
300
140
250
100
g f s - Siemens
ID - Amperes
120
TJ = 150ºC
80
25ºC
60
200
150ºC
150
100
- 40ºC
40
25ºC
50
20
0
0
3.0
3.5
4.0
4.5
5.0
5.5
0
20
40
60
VGS - Volts
Fig. 9. Forward Voltage Drop of
Intrinsic Diode
100
120
140
160
180
Fig. 10. Gate Charge
10
350
VDS = 50V
9
300
I D = 210A
8
250
I G = 10mA
7
VGS - Volts
IS - Amperes
80
ID - Amperes
200
150
TJ = 150ºC
6
5
4
3
100
TJ = 25ºC
2
50
1
0
0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0
100
200
300
VSD - Volts
400
500
600
700
QG - NanoCoulombs
Fig. 11. Capacitance
Fig. 12. Forward-Bias Safe Operating Area
10,000
100.0
Ciss
TC = 25ºC
Single Pulse
1,000
25µs
10.0
ID - Amperes
Capacitance - NanoFarads
TJ = 175ºC
RDS(on) Limit
Coss
100µs
External Lead Limit
100
1.0
1ms
10
Crss
f = 1 MHz
10ms
DC
100ms
1
0.1
0
5
10
15
20
25
30
35
40
VDS - Volts
1
10
100
1,000
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF:F_420N10T(9V)9-22-09
IXFK420N10T
IXFX420N10T
Fig. 13. Resistive Turn-on Rise Time
vs. Junction Temperature
Fig. 14. Resistive Turn-on Rise Time
vs. Drain Current
320
340
RG = 1Ω , VGS = 10V
RG = 1Ω , VGS = 10V
280
VDS = 50V
300
VDS = 50V
t r - Nanoseconds
t r - Nanoseconds
240
260
I
= 200A
D
220
180
200
160
TJ = 125ºC
120
TJ = 25ºC
80
I
140
= 100A
D
40
0
100
25
35
45
55
65
75
85
95
105
115
40
125
60
80
100
TJ - Degrees Centigrade
700
td(on) - - - -
TJ = 125ºC, VGS = 10V
200
RG = 1Ω, VGS = 10V
80
I D = 100A
t f - Nanoseconds
300
500
40
100
4
5
6
7
8
9
180
400
160
I D = 200A
300
140
I D = 100A
200
120
100
100
0
0
3
25
10
35
45
55
65
75
85
95
105
115
RG - Ohms
TJ - Degrees Centigrade
Fig. 17. Resistive Turn-off Switching Times
vs. Drain Current
Fig. 18. Resistive Turn-off Switching Times
vs. Gate Resistance
500
tf
td(off) - - - -
400
tf
140
100
700
VDS = 50V
600
600
I D = 200A
500
500
I D = 100A
400
400
300
300
200
200
100
0
40
60
80
100
120
140
160
ID - Amperes
© 2009 IXYS CORPORATION, All Rights Reserved
180
60
200
100
100
1
2
3
4
5
6
RG - Ohms
7
8
9
10
t d(off) - Nanoseconds
TJ = 25ºC
t d(off) - Nanoseconds
180
TJ = 125ºC
td(off) - - - -
TJ = 125ºC, VGS = 10V
220
VDS = 50V
200
800
700
RG = 1Ω, VGS = 10V
80
125
800
260
t f - Nanoseconds
t r - Nanoseconds
120
200
t f - Nanoseconds
td(off) - - - -
t d(off) - Nanoseconds
400
t d(on) - Nanoseconds
160
I D = 200A
300
200
VDS = 50V
VDS = 50V
2
180
220
tf
600
200
500
1
160
700
240
600
140
Fig. 16. Resistive Turn-off Switching Times
vs. Junction Temperature
Fig. 15. Resistive Turn-on Switching Times
vs. Gate Resistance
tr
120
ID - Amperes
IXFK420N10T
IXFX420N10T
Fig. 19. Maximum Transient Thermal Impedance
1.000
Fig. 19. Maximium Transient Thermal Impedance
.sadgsfgsf
0.200
Z (th )JC - ºC / W
0.100
0.010
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF:F_420N10T(9V)9-22-09
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