IXYS IXZ4DF12N100 Rf power mosfet & driver Datasheet

IXZ4DF12N100
RF Power MOSFET & DRIVER
Driver / MOSFET Combination
DEIC-515 Driver combined with a DE375-102N12A MOSFET
Gate driver matched to MOSFET
Features
• Isolated Substrate
− high isolation voltage (>2500V)
− excellent thermal transfer
− Increased temperature and power cycling capability
• IXYS advanced Z-MOS process
• Low RDS(on)
• Very low insertion inductance (<2nH)
• No beryllium oxide (BeO) or other hazardous materials
• Built using the advantages and compatibility of CMOS and IXYS
HDMOS™ processes
• Latch-Up Protected
• Low Quiescent Supply Current
Advantages
• Optimized for RF and high speed
• Easy to mount—no insulators needed
• High power density
• Single package reduces size and heat sink area
1000 Volts
12 A
0.7 Ohms
Applications
• Class D or E Switching
Amplifier
• Multi MHz Switch Mode
Power Supplies (SMPS)
Description
The IXZ4DF12N100 is a CMOS high speed high current gate driver and a MOSFET combination specifically
designed Class D, E, HF, RF applications at up to 40MHz, as well as other applications. The IXZ4DF12N100 in
pulse mode can provide 72A of peak current while producing voltage rise and fall times of less than 5ns, and
minimum pulse widths of 8ns. The input of the driver is fully immune to latch up over the entire operating
range. Designed with small internal delays, the IXZ4DF12N100 is suitable for higher power operation where
combiners are used. Its features and wide safety margin in operating voltage and power make the
IXZ4DF12N100 unmatched in performance and value.
The IXZ4DF12N100 is packaged in DEIs low inductance RF package incorporating DEI's RF layout techniques
to minimize stray lead inductances for optimum switching performance. The IXZ4DF12N100 is a surfacemountable device.
Figure 1.
Functional Diagram
IXZ4DF12N100
RF Power MOSFET & DRIVER
Device Specifications
Parameter
Value
150°C
- 40°C to 85°C
5.5g
Maximum Junction Temperature
Operating Temperature Range
Weight
Symbol
fMAX
VDSS
VCC, VCCIN
IDSS
IDM25
IDM
IAR
Maximum
Ratings
40MHz
1000V
20V
50uA
1mA
12A
72A
12A
Test Conditions
ID = 0.5IDM25
VDS = 0.8VDSS
VGS = 0V
TJ = 25C
TJ = 125C
TC = 25°C
TC = 25°C, Pulse limited by TJM
TC = 25°C
PT (MOSFET and Driver)
TC
= 25°C
TBD 500W
0.25 °C/W
TBD °C/W
RthJC
RthJHS
Device Performance
Symbol
Test Condition
Rds(ON)
VCC = 15V, ID = 0.5IDM25
Pulse Test, t ≤ 300µS,
Duty Cycle ≤ 2%
Minimum
IN (Signal Input)
VIH (High Input Voltage)
15V
VCCIN+0.3V
VCCIN -2V
VCCIN+0.3V
f = 1MHz
7960 Ω
Cstray
f = 1MHz Any one pin to the
back plane metal
46pf
COSS
VGS = 0V,
VDS = 0.8VDSS(max) ,
f =1MHz
150pf
ZIN
tONDLY
tOFFDLY
tR
tF
TC = 25°C
VCC, VCCIN , VIN = 15V 1µS Pulse,
VDS= 50V, RL = 2.5Ω
TC = 25°C
VCC, VCCIN, VIN = 15V 1µS Pulse,
VDS = 50V, RL = 2.5Ω
20V
- 5V
0.8V
VIL (Low Input Voltage)
Maximum
0.7 Ω
8V
VCC, VCCIN
Typical
20nS
22.6nS
3nS
4.5nS
IXZ4DF12N100
RF Power MOSFET & DRIVER
Fig. 2
Fig. 3
R DS(ON) vs. Temperature
ID = 0.5IDM
Extended Output Characteristics @ 25°C
2.5
50
V GS = V CC = 15V and 20V
2
R DS(ON) (Ohms)
ID (A)
40
30
V GS = V CC = 8V
20
10
1.5
1
0.5
0
0
0
50
100
150
20
70
V DS (V)
Fig. 4
120
170
Temperature (C)
Fig. 5
Propagation Delay ON vs . Supply Voltage
ID = 0.5IDM
Propagation Delay OFF vs. Supply Voltage
28.5
25
Time (nS)
Time (nS)
23
21
19
28
17
27.5
15
5
10
15
20
5
25
15
20
25
VCC / VCCIN / IN (V)
V CC / V CCIN / IN (V)
Fig. 6
10
Fig. 7
Propagation Delay ON vs.Temperature
ID = 0.5 IDM, V CC / V CCIN / IN = 15V
Propagation Delay OFF vs. Temperature
ID = 0.5 IDM , VCC / VCCIN / IN = 15V
33
19
32
18.5
Time (nS)
Time (nS)
31
18
17.5
17
30
29
28
27
16.5
26
16
25
20
70
120
Temperature (°C)
170
20
70
120
Temperature °C
170
IXZ4DF12N100
RF Power MOSFET & DRIVER
Fig. 9
Rise Time vs. Supply Voltage
ID = 0.5 IDM
Fall Time vs. Supply Voltage
ID = 0.5 IDM
4.5
8
4
7
3.5
6
Time (nS)
Time (nS)
Fig. 8
3
2.5
5
4
2
3
1.5
2
5
10
15
20
5
25
10
25
Fall Time vs. Temperature
ID = 0.5 IDM , VCC / VCCIN / IN = 15V
Fig. 11
Rise Time vs. Temperature
ID = 0.5 IDM , VCC / VCCIN / IN = 15V
2.5
3
2.4
2.5
Time (nS)
Time (nS)
20
VCC / VCCIN / IN (V)
VCC / VCCIN / IN (V)
Fig. 10
15
2.3
2.2
2
1.5
2.1
1
2
20
70
120
20
170
70
VCC Supply Current vs. Frequency
Driver Section
Fig. 13
Output Capacitance vs. V DS Voltage
10
VCC Current (A)
10,000
C a p a c ita n c e (p F )
170
Temperature (°C)
Temperature (°C)
Fig. 12
120
1,000
100
10
0
100
200
300
400
500
600
V DS (V)
700
800
900
1000
20V
15V
8
V
1
0.1
0.01
0
10
20
30
Frequency (MHz)
40
50
IXZ4DF12N100
RF Power MOSFET & DRIVER
Fig. 14
V CCIN Supply Current vs. Frequency
Driver Section
VCCIN Current (A)
10
20V
15V
1
8V
0.1
0.01
0.001
0
10
20
30
40
50
Frequency (MHz)
Test Circuit
Fig. 15
VDD
4.7UF
0.01u 0.01u 0.01u 0.01u
0.47u
0.47u
+
VCC
+
+
4.7UF
10UF 100V
VCC
Source
DGND
INVCC
IN
IN
Drain
INGND
L1
5 ohm 20W
CM Choke
VCC
+
4.7UF
VCC
0.01u 0.01u 0.01u 0.01u
.01uF
Source
2
4.7UF
1
DGND
+
0.47u
0.47u
Place all capacitors on VCC as
close to the VCC lead as possible
IXZ4DF12N100
RF Power MOSFET & DRIVER
Lead Description
SYMBOL
Drain
Source
FUNCTION
MOSFET Drain Drain of Power MOSFET.
MOSFET Source
DESCRIPTION
Source of Power MOSFET. This connection is common to DGND.
VCC
Power supply input for the driver output section. These leads provide power to the output
Driver Section
section of the DEIC515 driver. Both leads must be connected.
Supply Voltage
VCCIN
Input for the positive input section power-supply voltage. This lead provides power to the
Input Section
input section of the DEIC515 driver. This lead should not be directly connected to VCC.
Supply Voltage
Input signal.
IN
Input
DGND
Power Driver
Ground
The system ground leads. Internally connected to all circuitry, these leads provide ground
reference for the entire chip. These leads should be connected to a low noise analog
ground plane for optimum performance.
INGND
Input Section
Ground
The input section ground lead. This lead is a Kelvin connection internally connected to
DGND. This lead must not be connected to DGND as excessive current can damage this
lead.
IXYS RF reserves the right to change limits, test conditions and dimensions without notice.
IXYS RF MOSFETS are covered by one or more of the following U.S. patents:
4,835,592
4,860,072
4,881,106
4,891,686
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,486,715
5,381,025
5,640,045
6,404,065
6,583,505
6,710,463
6,727,585
6,731,002
IXZ4DF12N100
RF Power MOSFET & DRIVER
Fig. 16 IXZ4DF12N100 Package Outline
IXYS RF
An IXYS Company
2401 Research Blvd. Ste. 108, Ft. Collins, CO 80526
Tel: 970-493-1901; Fax: 970-493-1903
e-mail: [email protected]
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