TI JM38510/07901BEA Data selectors/multiplexer Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS151DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
SN74LS151J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
SN74LS151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
SN74LS151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
SN74LS151NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74S151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74S151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74S151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74S151NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54150J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54150J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
5962-9558001QJA
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
5962-9558001QKA
ACTIVE
CFP
W
24
1
TBD
Call TI
Level-NC-NC-NC
1
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9558001QKA
ACTIVE
CFP
W
24
TBD
Call TI
Level-NC-NC-NC
5962-9751601Q2A
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
5962-9751601QCA
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
5962-9751601QDA
OBSOLETE
CFP
W
14
TBD
Call TI
Call TI
76010012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
76010012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
7601001EA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
7601001EA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
7601001FA
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
7601001FA
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/01401BKA
ACTIVE
CFP
W
24
1
TBD
Call TI
Level-NC-NC-NC
JM38510/01401BKA
ACTIVE
CFP
W
24
1
TBD
Call TI
Level-NC-NC-NC
JM38510/07901BEA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/07901BFA
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30901B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30901B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30901BEA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30901BEA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30901BFA
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30901BFA
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SN54150J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SN54150J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS151J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN54LS151J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN54S151J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
Call TI
SN54S15J
OBSOLETE
CDIP
J
14
TBD
Call TI
SN74150N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74150N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74150NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74150NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74151AN
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
Call TI
SN74151AN
OBSOLETE
PDIP
N
16
TBD
Call TI
SN74LS151D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS151DE4
ACTIVE
SOIC
D
16
SN74LS151DR
ACTIVE
SOIC
D
SN74LS151DR
ACTIVE
SOIC
SN74LS151DRE4
ACTIVE
SN74LS151DRE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
SN74LS151J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
SN74LS151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74LS151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74LS151NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS151NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74S151N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74S151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74S151N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74S151NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74S151NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74S151NSR
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74S151NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S151NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54150J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54150J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54150W
ACTIVE
CFP
W
24
1
TBD
Call TI
Level-NC-NC-NC
Lead/Ball Finish
MSL Peak Temp (3)
SNJ54150W
ACTIVE
CFP
W
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS151FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS151FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS151J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS151J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS151W
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS151W
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S151FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S151J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S151W
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S15FK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
SNJ54S15J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SNJ54S15W
OBSOLETE
CFP
W
14
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
1
12
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.175 (4,45)
0.140 (3,56)
0.090 (2,29)
0.060 (1,53)
A
Seating Plane
0.018 (0,46) MIN
24
PINS **
DIM
”A”
”B”
”C”
NARR
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
28
WIDE
NARR
40
32
WIDE
NARR
WIDE
NARR
WIDE
MAX
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
MIN
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
MAX
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
MIN
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
MAX
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
MIN
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
4040084/C 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.425 (10,80) MAX
0.020 (0,51) MIN
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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