TI JM38510/30107SFA Hex/quadruple d-type flip-flops with clear Datasheet

SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54174, SN54175, SN74174, SN74175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS174, SN54LS175, SN74LS174, SN74LS175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54S174, SN54S175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
JM38510/01702BEA
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
JM38510/01702BFA
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
JM38510/07105BEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
JM38510/07105BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/07106BEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
JM38510/30106B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/30106BEA
ACTIVE
CDIP
J
16
1
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
JM38510/30106BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/30107B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/30107BEA
ACTIVE
CDIP
J
16
1
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
JM38510/30107BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/30107SEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
JM38510/30107SFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SN54175J
OBSOLETE
CDIP
J
16
TBD
Call TI
SN54LS174J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS175J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN54S174J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN54S175J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN74174N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74175N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74175N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74LS174D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174J
OBSOLETE
CDIP
J
16
SN74LS174N
ACTIVE
PDIP
N
16
Call TI
TBD
Call TI
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
SN74LS174N3
OBSOLETE
PDIP
N
16
SN74LS174NE4
ACTIVE
PDIP
N
16
SN74LS174NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS174NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS175D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS175DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS175DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS175DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS175DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS175DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS175J
OBSOLETE
CDIP
J
16
SN74LS175N
ACTIVE
PDIP
N
16
SN74LS175N3
OBSOLETE
PDIP
N
16
SN74LS175NE4
ACTIVE
PDIP
N
16
SN74LS175NSR
ACTIVE
SO
NS
16
SN74LS175NSRE4
ACTIVE
SO
NS
SN74LS175NSRG4
ACTIVE
SO
Lead/Ball Finish
MSL Peak Temp (3)
TBD
Call TI
Pb-Free
(RoHS)
CU NIPDAU
TBD
Call TI
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S174J
OBSOLETE
CDIP
J
16
SN74S174N
ACTIVE
PDIP
N
16
25
25
Call TI
N / A for Pkg Type
Call TI
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
Call TI
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
SN74S174N3
OBSOLETE
PDIP
N
16
SN74S174NE4
ACTIVE
PDIP
N
16
SN74S174NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S174NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S174NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S175D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S175DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S175DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S175DR
OBSOLETE
SOIC
D
16
TBD
Call TI
SN74S175N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CU NIPDAU
Level-1-260C-UNLIM
SN74S175N3
OBSOLETE
PDIP
N
16
SN74S175NE4
ACTIVE
PDIP
N
16
SN74S175NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
Addendum-Page 2
Call TI
Call TI
N / A for Pkg Type
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74S175NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S175NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
SNJ54175J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
SNJ54175W
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
SNJ54LS174FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LS174J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS174W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SNJ54LS175FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LS175J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS175W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SNJ54S174FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54S174J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54S174W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SNJ54S175FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54S175J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54S175W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
4-Jun-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS174DR
D
16
FMX
330
16
6.5
10.3
12.1
2
16
Q1
SN74LS174NSR
NS
16
MLA
330
16
8.2
10.5
2.5
12
16
Q1
SN74LS175DR
D
16
FMX
330
16
6.5
10.3
12.1
2
16
Q1
SN74LS175NSR
NS
16
MLA
330
16
8.2
10.5
2.5
12
16
Q1
SN74S174NSR
NS
16
MLA
330
16
8.2
10.5
2.5
12
16
Q1
SN74S175NSR
NS
16
MLA
330
16
8.2
10.5
2.5
12
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LS174DR
D
16
FMX
342.9
336.6
28.58
SN74LS174NSR
NS
16
MLA
342.9
336.6
28.58
SN74LS175DR
D
16
FMX
342.9
336.6
28.58
SN74LS175NSR
NS
16
MLA
342.9
336.6
28.58
SN74S174NSR
NS
16
MLA
342.9
336.6
28.58
SN74S175NSR
NS
16
MLA
342.9
336.6
28.58
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2007
Pack Materials-Page 3
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