TI JM38510/65003BCA Dual 4-input positive-nand gate Datasheet

 SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003
D Wide Operating Voltage Range of 2 V to 6 V
D Outputs Can Drive Up To 10 LSTTL Loads
D Low Power Consumption, 20-µA Max ICC
SN54HC20 . . . FK PACKAGE
(TOP VIEW)
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
2D
2C
NC
2B
2A
2Y
NC
NC
1C
NC
1D
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2C
NC
NC
NC
2B
1Y
GND
NC
2Y
2A
1
1B
1A
NC
VCC
2D
SN54HC20 . . . J OR W PACKAGE
SN74HC20 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
1A
1B
NC
1C
1D
1Y
GND
D Typical tpd = 11 ns
D ±4-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
NC − No internal connection
description/ordering information
The ’HC20 devices contain two independent 4-input NAND gates. They perform the Boolean function
Y = A • B • C • D or Y = A + B + C + D in positive logic.
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SN74HC20N
Tube of 50
SN74HC20D
Reel of 2500
SN74HC20DR
Reel of 250
SN74HC20DT
SOP − NS
Reel of 2000
SN74HC20NSR
HC20
SSOP − DB
Reel of 2000
SN74HC20DBR
HC20
Tube of 90
SN74HC20PW
Reel of 2000
SN74HC20PWR
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 25
SOIC − D
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
SN74HC20N
HC20
HC20
Reel of 250
SN74HC20PWT
CDIP − J
Tube of 25
SNJ54HC20J
SNJ54HC20J
CFP − W
Tube of 150
SNJ54HC20W
SNJ54HC20W
LCCC − FK
Tube of 55
SNJ54HC20FK
SNJ54HC20FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
%(#"! "%' /0121 '' %$$! $ $!$(
#'$!! *$,!$ $() '' *$ %(#"! %(#"
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1
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003
FUNCTION TABLE
(each gate)
INPUTS
A
B
C
D
OUTPUT
Y
H
H
H
H
L
L
X
X
X
H
X
L
X
X
H
X
X
L
X
H
X
X
X
L
H
logic diagram (positive logic)
1A
1B
1C
1D
1
2
4
5
6
2A
2B
2C
2D
1Y
9
10
12
13
8
2Y
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HC20
VCC
Supply voltage
VIH
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VCC = 6 V
VCC = 2 V
VIL
VI
VO
Input voltage
NOM
MAX
2
5
6
NOM
MAX
2
5
6
1.5
3.15
3.15
4.2
4.2
0
VCC = 6 V
UNIT
V
V
0.5
0.5
1.35
1.35
1.8
1.8
VCC
VCC
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
MIN
1.5
0
Output voltage
∆t/∆v
MIN
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
SN74HC20
0
VCC
VCC
0
1000
1000
500
500
400
400
V
V
V
ns
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
Ci
SN54HC20
SN74HC20
MIN
MIN
MAX
MAX
UNIT
2V
1.9
1.998
1.9
1.9
IOH = −20 µA
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = −4 mA
IOH = −5.2 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
2
40
20
µA
10
10
10
pF
VI = VIH or VIL
VI = VIH or VIL
VI = VCC or 0
VI = VCC or 0,
TA = 25°C
MIN
TYP
MAX
4.5 V
IOL = 4 mA
IOL = 5.2 mA
II
ICC
VCC
IO = 0
6V
2 V to 6 V
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V
V
3
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°C
TYP
MAX
SN54HC20
SN74HC20
MIN
MIN
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
45
110
165
140
tpd
A, B, C, or D
Y
4.5 V
14
22
33
28
6V
11
19
28
24
tt
Y
MIN
MAX
MAX
2V
27
75
110
95
4.5 V
9
15
22
19
6V
7
13
19
16
UNIT
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
No load
POST OFFICE BOX 655303
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TYP
25
UNIT
pF
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
Input
VCC
50%
50%
0V
CL = 50 pF
(see Note A)
tPLH
In-Phase
Output
LOAD CIRCUIT
50%
10%
tPHL
90%
90%
tr
Input
50%
10%
90%
90%
tr
VCC
50%
10% 0 V
tPHL
Out-of-Phase
Output
90%
tf
VOH
50%
10%
VOL
tf
tPLH
50%
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
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5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
5962-8403901VCA
ACTIVE
CDIP
J
14
1
TBD
Call TI
Call TI
5962-8403901VDA
ACTIVE
CFP
W
14
1
TBD
Call TI
Call TI
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
84039012A
ACTIVE
LCCC
FK
20
1
TBD
8403901CA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
8403901DA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
JM38510/65003BCA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN54HC20J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN74HC20D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DE4
ACTIVE
SOIC
D
14
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20DTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
50
POST-PLATE N / A for Pkg Type
SN74HC20N3
OBSOLETE
PDIP
N
14
SN74HC20NE4
ACTIVE
PDIP
N
14
SN74HC20NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC20PWT
ACTIVE
TSSOP
PW
14
250
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74HC20PWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
SNJ54HC20FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54HC20J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54HC20W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
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www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated
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