Samsung K4D553235F-GC33 256m gddr sdram Datasheet

256M GDDR SDRAM
K4D553235F-GC
256Mbit GDDR SDRAM
Revision 1.6
March 2005
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
Samsung Electronics reserves the right to change products or specification without notice.
- 1 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
Revision History
Revision 1.6 (May 26, 2005)
• Added CL3 of MRS table
Revision 1.5 (March 16, 2005)
• Corrected the spec revision history from 1.1 ~ 1.4 as below.
Revision 1.4 (March 10, 2005)
• Added a tCK(min) value for -GC33@CL=3
Revision 1.3 (March 04, 2005)
• Removed K4D553235F-GC22 from the datasheet
Revision 1.2 (February 03, 2005)
• Removed -GJ from the spec which is no longer valid.
• Added a couple of note below AC timing table.
Revision 1.1 (December 14, 2004)
• Removed K4D553235F-GC20 from the specification.
• Dualized the 400MHz part’s part number by its operating voltage. Newly added -GJ25 operating voltage is equal to 2.0V(typical) which is in mass production now. The 400MHz part with VDD & VDDQ= 1.8V(typical) which represented as -GC25 will be available by the 2nd quarter of ’05
• Added a couple of note below AC timing table.
Revision 1.0 (September 21, 2004)
• Defined DC specification
Revision 0.1 (June 16, 2004) - Target Spec
• Defined target specification
Revision 0.0 (May 07, 2004) - Target Spec
• Defined target specification
- 2 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
2M x 32Bit x 4 Banks Graphic Double Data Rate Synchronous DRAM
with Bi-directional Data Strobe and DLL
FEATURES
• 1.8V ± 0.1V power supply for device operation
• No Wrtie-Interrupted by Read Function
• 1.8V ± 0.1V power supply for I/O interface
• 4 DQS’s ( 1DQS / Byte )
• SSTL_18 compatible inputs/outputs
• Data I/O transactions on both edges of Data strobe
• 4 banks operation
• DLL aligns DQ and DQS transitions with Clock transition
• MRS cycle with address key programs
• Edge aligned data & data strobe output
-. Read latency 4, 5 and 6 (clock)
• Center aligned data & data strobe input
-. Burst length (2, 4 and 8)
• DM for write masking only
-. Burst type (sequential & interleave)
• Auto & Self refresh
• All inputs except data & DM are sampled at the positive
going edge of the system clock
• 32ms refresh period (4K cycle)
• 144-Ball FBGA
• Differential clock input
• Maximum clock frequency up to 450MHz
• Maximum data rate up to 900Mbps/pin
ORDERING INFORMATION
Part NO.
Max Freq.
Max Data Rate
K4D553235F-GC25
400MHz
800Mbps/pin
K4D553235F-GC2A
350MHz
700Mbps/pin
K4D553235F-GC33
300MHz
600Mbps/pin
Interface
Package
SSTL_18
144-Ball FBGA
* K4D553235F-VC is the Lead Free package part number.
GENERAL DESCRIPTION
FOR 2M x 32Bit x 4 Bank DDR SDRAM
The K4D553235F is 268,435,456 bits of hyper synchronous data rate Dynamic RAM organized as 4 x 2,097,152 words by
32 bits, fabricated with SAMSUNG’s high performance CMOS technology. Synchronous features with Data Strobe allow
extremely high performance up to 3.6GB/s/chip. I/O transactions are possible on both edges of the clock cycle. Range of
operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety
of high performance memory system applications.
- 3 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
PIN CONFIGURATION (Top View)
2
3
4
5
6
7
8
9
10
11
12
13
B
DQS0
DM0
VSSQ
DQ3
DQ2
DQ0
DQ31
DQ29
DQ28
VSSQ
DM3
DQS3
C
DQ4
VDDQ
NC
VDDQ
DQ1
VDDQ
VDDQ
DQ30
VDDQ
NC
VDDQ
DQ27
D
DQ6
DQ5
VSSQ
VSSQ
VSSQ
VDD
VDD
VSSQ
VSSQ
VSSQ
DQ26
DQ25
E
DQ7
VDDQ
VDD
VSS
VSSQ
VSS
VSS
VSSQ
VSS
VDD
VDDQ
DQ24
F
DQ17
DQ16
VDDQ
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
VDDQ
DQ15
DQ14
G
DQ19
DQ18
VDDQ
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
VDDQ
DQ13
DQ12
H
DQS2
DM2
NC
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
NC
DM1
DQS1
J
DQ21
DQ20
VDDQ
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
VDDQ
DQ11
DQ10
K
DQ22
DQ23
VDDQ
VSSQ
VSS
VSS
VSS
VSS
VSSQ
VDDQ
DQ9
DQ8
L
CAS
WE
VDD
VSS
A10
VDD
VDD
RFU1
VSS
VDD
NC
NC
M
RAS
NC
NC
BA1
A2
A11
A9
A5
RFU2
CK
CK
MCL
N
CS
NC
BA0
A0
A1
A3
A4
A6
A7
A8/AP
CKE
VREF
NOTE:
1. RFU1 is reserved for A12
2. RFU2 is reserved for BA2
3. VSS Thermal balls are optional
PIN DESCRIPTION
CK,CK
Differential Clock Input
BA0, BA1
Bank Select Address
CKE
Clock Enable
A0 ~A11
Address Input
CS
Chip Select
DQ0 ~ DQ31
Data Input/Output
RAS
Row Address Strobe
VDD
Power
CAS
Column Address Strobe
VSS
Ground
WE
Write Enable
VDDQ
Power for DQ’s
DQS
Data Strobe
VSSQ
Ground for DQ’s
DM
Data Mask
NC
No Connection
RFU
Reserved for Future Use
MCL
Must Connect Low
- 4 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
INPUT/OUTPUT FUNCTIONAL DESCRIPTION
Symbol
Type
Function
CK, CK*1
Input
The differential system clock Input.
All of the inputs are sampled on the rising edge of the clock except
DQ’s and DM’s that are sampled on both edges of the DQS.
CKE
Input
Activates the CK signal when high and deactivates the CK signal
when low. By deactivating the clock, CKE low indicates the Power
down mode or Self refresh mode.
CS
Input
CS enables the command decoder when low and disabled the command decoder when high. When the command decoder is disabled,
new commands are ignored but previous operations continue.
RAS
Input
Latches row addresses on the positive going edge of the CK with
RAS low. Enables row access & precharge.
CAS
Input
Latches column addresses on the positive going edge of the CK with
CAS low. Enables column access.
WE
Input
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
Input/Output
Data input and output are synchronized with both edge of DQS.
DQS0 for DQ0 ~ DQ7, DQS1 for DQ8 ~ DQ15, DQS2 for DQ16 ~ DQ23,
DQS3 for DQ24 ~ DQ31.
DM0 ~ DM3
Input
Data In mask. Data In is masked by DM Latency=0 when DM is high
in burst write. DM0 for DQ0 ~ DQ7, DM1 for DQ8 ~ DQ15, DM2 for
DQ16 ~ DQ23, DM3 for DQ24 ~ DQ31.
DQ0 ~ DQ31
Input/Output
Data inputs/Outputs are multiplexed on the same pins.
BA0, BA1
Input
Selects which bank is to be active.
A0 ~ A11
Input
Row/Column addresses are multiplexed on the same pins.
Row addresses : RA0 ~ RA11, Column addresses : CA0 ~ CA7, CA9
Column address CA8 is used for auto precharge.
VDD/VSS
Power Supply
Power and ground for the input buffers and core logic.
VDDQ/VSSQ
Power Supply
Isolated power supply and ground for the output buffers to provide
improved noise immunity.
VREF
Power Supply
Reference voltage for inputs, used for SSTL interface.
No connection/
Reserved for future use
This pin is recommended to be left "No connection" on the device
Must Connect Low
Must connect low
DQS0 ~ DQS3
NC/RFU
MCL
*1 : The timing reference point for the differential clocking is the cross point of CK and CK.
For any applications using the single ended clocking, apply VREF to CK pin.
- 5 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
BLOCK DIAGRAM (1Mbit x 32I/O x 4 Bank)
32
Intput Buffer
I/O Control
CK, CK
Data Input Register
Serial to parallel
Bank Select
LWE
LDMi
64
2Mx32
32
Output Buffer
2-bit prefetch
Sense AMP
2Mx32
64
x32
DQi
2Mx32
Column Decoder
Col. Buffer
LCBR
LRAS
Latency & Burst Length
Programming Register
LRAS LCBR
DLL
Strobe
Gen.
LCKE
Row Decoder
Refresh Counter
Row Buffer
ADDR
Address Register
CK,CK
2Mx32
Data Strobe
(DQS0~DQS3)
LWE
LCAS
LWCBR
CK,CK
LDMi
Timing Register
CK,CK
CKE
CS
RAS
CAS
WE
- 6 -
DMi
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
FUNCTIONAL DESCRIPTION
• Power-Up Sequence
DDR SDRAMs must be powered up and initialized in a predefined manner to prevent undefined operations.
1. Apply power and keep CKE at low state (All other inputs may be undefined)
- Apply VDD before VDDQ .
- Apply VDDQ before VREF & VTT
2. Start clock and maintain stable condition for minimum 200us.
3. The minimum of 200us after stable power and clock(CK,CK ), apply NOP and take CKE to be high .
4. Issue precharge command for all banks of the device.
5. Issue a EMRS command to enable DLL
*1
6. Issue a MRS command to reset DLL. The additional 200 clock cycles are required to lock the DLL.
*1,2 7. Issue precharge command for all banks of the device.
8. Issue at least 2 or more auto-refresh commands.
9. Issue a mode register set command with A8 to low to initialize the mode register.
*1 The additional 200cycles of clock input is required to lock the DLL after enabling DLL.
*2 Sequence of 6&7 is regardless of the order
1st Auto
Refresh
200 Clock min.
Inputs must be
stable for 200us
~
~
tRFC
2nd Auto
Refresh
tMRD
Mode
Register Set
~
precharge
ALL Banks
tRFC
~
~
MRS
DLL Reset
~
~
tRP
~
~
tMRD
~
EMRS
tMRD.
~
precharge
ALL Banks
~
~
tRP
Command
~
~
CK,CK
~
Power up & Initialization Sequence
Any
Command
* When the operating frequency is changed, DLL reset should be required again.
After DLL reset again, the minimum 200 cycles of clock input is needed to lock the DLL.
- 7 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
MODE REGISTER SET(MRS)
The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs CAS latency,
addressing mode, burst length, test mode, DLL reset and various vendor specific options to make DDR SDRAM useful for
variety of different applications. The default value of the mode register is not defined, therefore the mode register must be
written after EMRS setting for proper operation. The mode register is written by asserting low on CS, RAS, CAS and
WE(The DDR SDRAM should be in active mode with CKE already high prior to writing into the mode register). The state of
address pins A0 ~ A11 and BA0, BA1 in the same cycle as CS, RAS, CAS and WE going low is written in the mode register.
Minimum two clock cycles are requested to complete the write operation in the mode register. The mode register contents
can be changed using the same command and clock cycle requirements during operation as long as all banks are in the
idle state. The mode register is divided into various fields depending on functionality. The burst length uses A0 ~ A2,
addressing mode uses A3, CAS latency(read latency from column address) uses A4 ~ A6. A7 is used for test mode. A8 is
used for DLL reset. A7,A8, BA0 and BA1 must be set to low for normal MRS operation. Refer to the table for specific codes
for various burst length, addressing modes and CAS latencies.
BA1
BA0
RFU
0
A11
A10
A9
RFU
DLL
A8
A8
A7
DLL
TM
A6
A5
A3
CAS Latency
A2
BT
A1
A0
Burst Length
Address Bus
Mode Register
Burst Type
Test Mode
DLL Reset
A4
A7
mode
A3
Type
0
No
0
Normal
0
Sequential
1
Yes
1
Test
1
Interleave
0
Burst Length
CAS Latency
BA0
A1
A0
Sequential
Interleave
Reserved
0
0
0
Reserved
Reserved
Reserved
0
0
1
2
2
1
0
4
4
A6
A5
A4
Latency
0
MRS
0
0
0
1
EMRS
0
0
1
* RFU(Reserved for future use)
should stay "0" during MRS
cycle.
Burst Type
A2
An ~ A0
0
1
0
Reserved
0
0
1
1
3
0
1
1
8
8
1
0
0
4
1
0
0
Reserved
Reserved
1
0
1
5
1
0
1
Reserved
Reserved
1
1
0
6
1
1
0
Reserved
Reserved
Reserved
1
1
1
Reserved
Reserved
1
1
1
MRS Cycle
2
CK, CK
Command
NOP
Precharge
All Banks
NOP
NOP
6
MRS
10
~~
1
~~
0
NOP
Any
Command
11
12
NOP
NOP
tMRD=4 tCK
tRP
*1 : MRS can be issued only at all banks precharge state.
*2 : Minimum tRP is required to issue MRS command.
- 8 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
EXTENDED MODE REGISTER SET(EMRS)
The extended mode register stores the data for enabling or disabling DLL and selecting output driver
strength. The default value of the extended mode register is not defined, therefore the extened mode register
must be written after power up for enabling or disabling DLL. The extended mode register is written by asserting low on CS, RAS, CAS, WE and high on BA0(The DDR SDRAM should be in all bank precharge with CKE
already high prior to writing into the extended mode register). The state of address pins A0, A2 ~ A5, A7 ~ A11
and BA1 in the same cycle as CS, RAS, CAS and WE going low are written in the extended mode register. A1
and A6 are used for setting driver strength to normal, weak or matched impedance. Two clock cycles are
required to complete the write operation in the extended mode register. The mode register contents can be
changed using the same command and clock cycle requirements during operation as long as all banks are in
the idle state. A0 is used for DLL enable or disable. "High" on BA0 is used for EMRS. All the other address
pins except A0,A1,A6 and BA0 must be set to low for proper EMRS operation. Refer to the table for specific
codes.
BA1
BA0
RFU
1
BA0
A11
A10
A9
A8
A7
RFU
A6
D.I.C
An ~ A0
A6
A1
0
MRS
0
0
1
EMRS
A5
A4
A3
RFU
Output Driver Impedence Control
Full
A2
Address Bus
A1
A0
D.I.C
DLL
A0
Extended
Mode Register
DLL Enable
100%
0
Enable
1
Disable
0
1
Weak
60%
1
0
N/A
Do not use
1
1
Matched
30%
*1 : RFU(Reserved for future use) should stay "0" during EMRS cycle.
Figure 7. Extended Mode Register set
- 9 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
VIN, VOUT
-0.5 ~ 3.6
V
Voltage on VDD supply relative to Vss
VDD
-1.0 ~ 3.6
V
Voltage on VDD supply relative to Vss
VDDQ
-0.5 ~ 3.6
V
Storage temperature
TSTG
-55 ~ +150
°C
Power dissipation
PD
3.3
W
Short circuit current
IOS
50
mA
Voltage on any pin relative to Vss
Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
POWER & DC OPERATING CONDITIONS(SSTL In/Out)
Recommended operating conditions(Voltage referenced to VSS=0V, TA=0 to 65°C)
Symbol
Min
Typ
Max
Unit
Note
Device Supply voltage
Parameter
VDD
1.7
1.8
1.9
V
1
Output Supply voltage
VDDQ
1.7
1.8
1.9
V
1
VREF
0.49*VDDQ
-
0.51*VDDQ
V
2
Reference voltage
Vtt
VREF-0.04
VREF
VREF+0.04
V
3
Input logic high voltage
VIH(DC)
VREF+0.15
-
VDDQ+0.30
V
4
Input logic low voltage
VIL(DC)
-0.30
-
VREF-0.15
V
5
Output logic high voltage
VOH
Vtt+0.76
-
-
V
IOH=-15.2mA, 7
Output logic low voltage
VOL
-
-
Vtt-0.76
V
IOL=+15.2mA, 7
Input leakage current
IIL
-5
-
5
uA
6
Output leakage current
IOL
-5
-
5
uA
6
Termination voltage
Note : 1. Under all conditions VDDQ must be less than or equal to VDD.
2. VREF is expected to equal 0.50*VDDQ of the transmitting device and to track variations in the DC level of the same. Peak to
peak noise on the VREF may not exceed + 2% of the DC value.
3. Vtt of the transmitting device must track VREF of the receiving device.
4. VIH(max.)= VDDQ +1.5V for a pulse width and it can not be greater than 1/3 of the cycle rate.
5. VIL(mim.)= -1.5V for a pulse width and it can not be greater than 1/3 of the cycle rate.
6. For any pin under test input of 0V < VIN < VDD is acceptable. For all other pins that are not under test VIN=0V.
7. Output logic high voltage and low voltage is depend on output channel condition.
- 10 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
DC CHARACTERISTICS
Recommended operating conditions Unless Otherwise Noted, TA=0 to 65°C)
Parameter
Symbol
Version
Test Condition
-25
-2A
-33
Unit
Operating Current
(One Bank Active)
ICC1
Burst Lenth=2 tRC ≥ tRC(min)
IOL=0mA, tCC= tCC(min)
270
242
238
mA
Precharge Standby Current
in Power-down mode
ICC2P
CKE ≤ VIL(max), tCC= tCC(min)
10
10
10
mA
Precharge Standby Current
in Non Power-down mode
ICC2N
CKE ≥ VIH(min), CS ≥ VIH(min),
tCC= tCC(min)
57
52
47
mA
Active Standby Current
power-down mode
ICC3P
CKE ≤ VIL(max), tCC= tCC(min)
60
55
48
mA
Active Standby Current
in Non Power-down mode
ICC3N
CKE ≥ VIH(min), CS ≥ VIH(min),
tCC= tCC(min)
201
183
164
mA
Operating Current
( Burst Mode)
ICC4
IOL=0mA ,tCC= tCC(min),
Page Burst, All Banks activated.
368
342
314
mA
Refresh Current
ICC5
tRC ≥ tRFC(min)
314
286
274
mA
Self Refresh Current
ICC6
CKE ≤ 0.2V
7
7
7
mA
Operating Current
(4Bank interleaving)
ICC7
Burst Length=4 tRC ≥ tRC(min)
IOL=0mA, tCC= tCC(min)
615
533
479
mA
Note
1
Note : 1 Refresh period is 32ms
AC INPUT OPERATING CONDITIONS
Recommended operating conditions(Voltage referenced to VSS=0V, TA=0 to 65°C)
Symbol
Min
Typ
Max
Unit
Input High (Logic 1) Voltage ;DQ
Parameter
VIH
VREF+0.35
-
-
V
Note
Input Low (Logic 0) Voltage; DQ
VIL
-
-
VREF-0.35
V
Clock Input Differential Voltage; CK and CK
VID
0.7
-
VDDQ+0.6
V
1
Clock Input Crossing Point Voltage; CK and CK
VIX
0.5*VDDQ-0.2
-
0.5*VDDQ+0.2
V
2
Note : 1. VID is the magnitude of the difference between the input level on CK and the input level on CK
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same
- 11 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
AC OPERATING TEST CONDITIONS (TA= 0 to 65°C)
Parameter
Value
Unit
Note
Input reference voltage for CK(for single ended)
0.50*VDDQ
V
1
1.5
V
CK and CK signal maximum peak swing
CK signal minimum slew rate
Input Levels(VIH/VIL)
1.0
V/ns
VREF+0.4/VREF-0.4
V
VREF
V
Vtt
V
Input timing measurement reference level
Output timing measurement reference level
Output load condition
See Fig.1
Note 1 : In case of differential clocks(CK and CK ), input reference voltage for clock is a CK and CK’s crossing point.
Vtt=0.5*VDDQ
RT=50Ω
Output
Z0=50Ω
VREF
=0.5*VDDQ
CLOAD=30pF
(Fig. 1) Output Load Circuit
CAPACITANCE (TA= 25°C, f=1MHz)
Symbol
Min
Max
Unit
Input capacitance( CK, CK )
Parameter
CIN1
1.0
5.0
pF
Input capacitance(A0~A11, BA0~BA1)
CIN2
1.0
4.0
pF
Input capacitance
( CKE, CS, RAS,CAS, WE )
CIN3
1.0
4.0
pF
Data & DQS input/output capacitance(DQ0~DQ31)
COUT
1.0
6.5
pF
Input capacitance(DM0 ~ DM3)
CIN4
1.0
6.5
pF
DECOUPLING CAPACITANCE GUIDE LINE
Recommended decoupling capacitance added to power line at board.
Symbol
Value
Unit
Decoupling Capacitance between VDD and VSS
Parameter
CDC1
0.1 + 0.01
uF
Decoupling Capacitance between VDDQ and VSSQ
CDC2
0.1 + 0.01
uF
Note : 1. VDD and VDDQ pins are separated each other.
All VDD pins are connected in chip. All VDDQ pins are connected in chip.
2. VSS and VSSQ pins are separated each other
All VSS pins are connected in chip. All VSSQ pins are connected in chip.
- 12 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
AC CHARACTERISTICS (I)
Parameter
-25
Symbol
CL=3
CL=4
CL=5
CL=6
CK cycle time
Min
2.5
0.45
0.45
-0.45
-0.45
0.9
0.4
0.85
0
0.35
0.4
0.45
0.45
0.6
0.6
0.3
0.3
tCLmin
or
tCHmin
tHPtQHS
tCK
CK high level width
CK low level width
DQS out access time from CK
Output access time from CK
Data strobe edge to Dout edge
Read preamble
Read postamble
CK to valid DQS-in
DQS-In setup time
DQS-in hold time
DQS write postamble
DQS-In high level width
DQS-In low level width
Address and Control input setup
Address and Control input hold
DQ and DM setup time to DQS
DQ and DM hold time to DQS
tCH
tCL
tDQSCK
tAC
tDQSQ
tRPRE
tRPST
tDQSS
tWPRES
tWPREH
tWPST
tDQSH
tDQSL
tIS
tIH
tDS
tDH
Clock half period
tHP
Data Hold skew factor
tQHS
Data output hold time from DQS
tQH
-2A
Max
Min
2.86
0.45
0.45
-0.55
-0.55
0.9
0.4
0.85
0
0.35
0.4
0.45
0.45
0.8
0.8
0.35
0.35
tCLmin
or
tCHmin
tHPtQHS
10.0
0.55
0.55
0.45
0.45
0.28
1.1
0.6
1.15
0.6
0.55
0.55
0.4
-
-33
Max
Min
5
3.3
0.45
0.45
-0.55
-0.55
0.9
0.4
0.85
0
0.35
0.4
0.45
0.45
0.8
0.8
0.35
0.35
tCLmin
or
tCHmin
tHPtQHS
10.0
0.55
0.55
0.55
0.55
0.35
1.1
0.6
1.15
0.6
0.55
0.55
0.4
-
Unit
Max
0.55
0.55
0.55
0.55
0.35
1.1
0.6
1.15
0.6
0.55
0.55
-
ns
ns
ns
ns
tCK
tCK
ns
ns
ns
tCK
tCK
tCK
ns
tCK
tCK
tCK
tCK
ns
ns
ns
ns
-
ns
10.0
0.4
ns
-
ns
Note
1
1
1
Simplified Timing @ BL=2, CL=4
tCH
0
1
2
tCL
tCK
3
5
4
6
8
7
CK, CK
tIS
CS
tIH
tDQSCK
tDQSS
DQS
tRPST
tRPRE
tWPRES
tDQSQ
tAC
DQ
Qa1
tDQSH
tDQSL
tWPREH
tDS tDH
Db0
Qa2
Db1
DM
WRITEB
COMMAND READA
- 13 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
Note 1 :
- The JEDEC DDR specification currently defines the output data valid window(tDV) as the time period when the data
strobe and all data associated with that data strobe are coincidentally valid.
- The previously used definition of tDV(=0.35tCK) artificially penalizes system timing budgets by assuming the worst case
output vaild window even then the clock duty cycle applied to the device is better than 45/55%
- A new AC timing term, tQH which stands for data output hold time from DQS is difined to account for clock duty cycle
variation and replaces tDV
- tQHmin = tHP-X where
. tHP=Minimum half clock period for any given cycle and is defined by clock high or clock low time(tCH,tCL)
. X=A frequency dependent timing allowance account for tDQSQmax
tQH Timing (CL4, BL2)
tHP
3
2
1
0
4
5
CK, CK
CS
DQS
tDQSQ(max)
tQH
tDQSQ(max)
COMMAND
Qa1
Qa0
DQ
READA
Power Down Timing
CK, CK
tIS
CKE
3tCK
tIS
Command
VALID
NOP
NOP
Enter Power Down mode
(Read or Write operation
must not be in progress)
NOP
NOP
NOP
NOP
VALID
Exit Powr Down mode
- 14 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
AC CHARACTERISTICS (II)
Parameter
Symbol
-25
-2A
-33
Unit
Note
ns
ns
ns
ns
ns
ns
2,5
5
5
5
4,5
5
-
ns
1,5
5
-
tCK
1,3
33
3
2
1
3
200
3tCK+
tIS
7.8
-
ns
tCK
tCK
tCK
tCK
tCK
3,5
-
ns
-
us
Min
45
50
28.6
15
10
15
Max
100K
-
Min
45.8
51.5
28.6
16.5
11.4
16.5
Max
100K
-
Min
49.5
56.1
33
16.5
11.4
16.5
Max
100K
-
tWR
15
-
16.5
-
16.5
Row cycle time
Refresh row cycle time
Row active time
RAS to CAS delay for Read
RAS to CAS delay for Write
Row precharge time
Last data in to Row precharge @Normal
Precharge
Last data in to Row precharge @Auto Precharge
Auto precharge write recovery + Precharge
Row active to Row active
Last data in to Read command
Col. address to Col. address
Mode register set cycle time
Exit self refresh to read command
tRC
tRFC
tRAS
tRCDRD
tRCDWR
tRP
tWR_A
6
-
6
-
tDAL
tRRD
tCDLR
tCCD
tMRD
tXSR
-
Power down exit time
tPDEX
tREF
33
4
2
1
3
200
3tCK+
tIS
7.8
-
Refresh interval time
30
4
2
1
4
200
3tCK+
tIS
7.8
-
-
1
Note : 1. For normal write operation, even numbers of Din are to be written inside DRAM
2. The number of clock of tRC is restricted by the number of clock of tRAS and tRP
3. The number of clock of tWR_A is fixed. It can’t be changed by tCK. tWR_A is related with CL. It is equal to CL+1tCK.
4. tRCDWR is equal to tRCDRD-2tCK and the number of clock can not be lower than 2tCK.
5. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then
rounding off to the next higher integer unconditionally.
- 15 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
AC CHARACTERISTICS (II)
(Unit : Number of Clock)
K4D553235F-GC25
Frequency
Cas Latency
400MHz ( 2.5ns )
5
tRC
18
tRFC
20
tRAS
12
tRCDRD tRCDWR
6
4
tRP
6
tRRD
4
tDAL
12
Unit
K4D553235F-GC2A
Frequency
Cas Latency
350MHz ( 2.86ns )
5
300MHz ( 3.3ns )
4
tRC
16
15
tRFC
18
17
tRAS
10
10
tRCDRD tRCDWR
6
4
5
3
tRP
6
5
tRRD
4
3
tDAL
12
10
Unit
K4D553235F-GC33
Frequency
Cas Latency
300MHz ( 3.3ns )
4
tRC
15
tRFC
17
tRAS
10
tRCDRD tRCDWR
5
3
tRP
5
tRRD
3
tDAL
10
Unit
- 16 -
tCK
tCK
tCK
tCK
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
Simplified Timing(2) @ BL=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
BAa
BAb
BAa
BAb
Ra
Rb
Ra
Rb
Ca
Cb
17
18
19
20
21
22
CK, CK
BA[1:0] BAa
BAa
BAa
Ra
A8/AP Ra
ADDR
(A0~A7, Ra
A9,A10)
Ca
WE
DQS
DQ
Da0 Da1 Da2 Da3 Db0 Db1 Db2 Db3
Da0 Da1 Da2 Da3
DM
COMMAND
ACTIVEA
PRECH
WRITEA
ACTIVEA
ACTIVEB WRITEA
WRITEB
tRCD
tRAS
tRP
tRC
Normal Write Burst
(@ BL=4)
tRRD
Multi Bank Interleaving Write Burst
(@ BL=4)
- 17 -
Rev 1.6 (May 2005)
256M GDDR SDRAM
K4D553235F-GC
PACKAGE DIMENSIONS (144-Ball FBGA)
A1 INDEX MARK
12.0
12.0
<Top View>
0.8x11=8.8
0.10 Max
0.8
0.8
0.40
0.8x11=8.8
0.45 ± 0.05
B
C
D
E
F
G
H
J
K
L
M
N
A1 INDEX MARK
13 12 11 10 9 8 7 6 5 4 3 2
0.35 ± 0.05
0.40
1.40 Max
<Bottom View>
Unit : mm
- 18 -
Rev 1.6 (May 2005)
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