Superworld L3-4R7 Ferrite chip inductor Datasheet

FERRITE CHIP INDUCTORS
L3 SERIES
1. PART NO. EXPRESSION :
L3-47NK-10
(a) Series code
(a)
(b) Inductance code : 47N = 0.047uH
(b)
(c)
(d)
(d) 10 : Lead Free
(c) Tolerance code : K = ±10%, M = ±20%
2. CONFIGURATION & DIMENSIONS :
A
D
L
H
G
B
C
PCB Pattern
Unit:m/m
A
B
C
D
2.00±0.20 1.25±0.20 0.85±0.20 1.25±0.20 0.50±0.30
G
H
L
1.00 Ref.
1.00 Ref.
3.00 Ref.
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
Sn(100%)-3.0um(min.)
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -40°C to +85°C
d) Operating temp. : -40°C to +85°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP INDUCTORS
L3 SERIES
6. ELECTRICAL CHARACTERISTICS :
Part Number
EIA
Size
Inductance
( µH )
Q
Min.
Test
Frequency
( MHz )
SRF
( MHz )
Min.
L3-47N -10
0805
0.047
15
50
320
0.20
300
L3-68N -10
0805
0.068
15
50
280
0.20
300
L3-82N -10
0805
0.082
15
50
255
0.20
300
L3-R10 -10
0805
0.100
20
25
235
0.30
250
L3-R12 -10
0805
0.120
20
25
220
0.30
250
L3-R15 -10
0805
0.150
20
25
200
0.40
250
L3-R18 -10
0805
0.180
20
25
185
0.40
250
L3-R22 -10
0805
0.220
20
25
170
0.50
250
L3-R27 -10
0805
0.270
20
25
150
0.50
250
L3-R33 -10
0805
0.330
20
25
145
0.55
250
L3-R39 -10
0805
0.390
25
25
135
0.65
200
L3-R47 -10
0805
0.470
25
25
125
0.65
200
L3-R56 -10
0805
0.560
25
25
115
0.75
150
L3-R68 -10
0805
0.680
25
25
105
0.80
150
L3-R82 -10
0805
0.820
25
25
100
1.00
150
L3-1R0 -10
0805
1.000
45
10
75
0.40
50
L3-1R2 -10
0805
1.200
45
10
65
0.50
50
L3-1R5 -10
0805
1.500
45
10
60
0.50
50
L3-1R8 -10
0805
1.800
45
10
55
0.60
50
L3-2R2 -10
0805
2.200
45
10
50
0.65
30
L3-2R7 -10
0805
2.700
45
10
45
0.75
30
L3-3R3 -10
0805
3.300
45
10
41
0.80
30
L3-3R9 -10
0805
3.900
45
10
38
0.90
30
L3-4R7 -10
0805
4.700
45
10
35
1.00
30
L3-5R6 -10
0805
5.600
45
4
32
0.90
15
L3-6R8 -10
0805
6.800
45
4
29
1.00
15
L3-8R2 -10
0805
8.200
45
4
26
1.10
15
L3-100 -10
0805
10.000
45
2
24
1.15
15
L3-120 -10
0805
12.000
45
2
22
1.25
15
L3-150 -10
0805
15.000
30
1
19
0.80
5
L3-180 -10
0805
18.000
30
1
18
0.90
5
L3-220 -10
0805
22.000
30
1
16
1.10
5
L3-270 -10
0805
27.000
30
1
14
1.15
5
L3-330 -10
0805
33.000
30
0.4
13
1.25
5
DC Resistance
(ȍ)
Max.
Rated Current
( mA )
Packaging : Paper Carrier Tape
Inductance tolerance :
: K : ±10%
M : ±20%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP INDUCTORS
L3 SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
Q vs. Frequency
FCI2012-Series
Q vs Freq.
120
100
Q
4R7
100
80
R10
60
1R0
40
330
20
0
1
10
100
FREQUENCY(MHz)
L vs. IDC
FCI2012-Series
L vs IDC.
100
Inductance(uH)
330
100
10
4R7
1R2
1
R12
0.1
1
10
100
1000
DC Current (mA)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP INDUCTORS
L3 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Impedance
HP4291A, HP4287A+16092A
Refer to standard electrical characteristics list
DC Resistance
HP4338B
Rated Current
Temperature Rise Test
30°C max. (ǻt)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Solder Heat Resistance
No mechanical damage
Remaining terminal electrode : 70% min.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Preheating Dipping
260°C
150°C
60
seconds
Natural
cooling
10±0.5
seconds
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
More than 90% of the terminal electrode
should be covered with solder.
Solderability
Preheating Dipping
245°C
150°C
Terminal Strength
60
seconds
Natural
cooling
4±1.0
seconds
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
W
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For Z / L Series :
Size
Force (Kfg)
1
0.2
2
0.5
3
0.6
4
1.0
5
1.0
6
1.0
7
1.5
8
2.0
Time (sec)
> 25
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
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PG. 4
FERRITE CHIP INDUCTORS
L3 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
Bending Strength
PERFORMANCE
TEST CONDITION
The ferrite should not be damaged by forces
applied on the right condition.
For Z / L Series :
Series name
mm (inches)
P-Kgf
2
0.80 (0.033)
0.3
3
1.40 (0.055)
1.0
2.00 (0.079)
2.5
2.70 (0.106)
2.5
1.0(0.039)
R0.5(0.02)
4
Chip
5
6
A
7
8
Random Vibration Test
Appearance : Cracking, shipping & any other
defects harmful to the characteristics should
not be allowed.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
No mechanical damage
Loading at High
Temperature
Appearance : No damage.
Inductance : Within ±10% of initial value.
Q : Within ±30% of initial value.
Temperature : 85±5°C
Applied Current : rated current
Duration : 1008±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity
Humidity : 90~95% RH.
Temperature : 40±2°C
Duration : 1008±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Appearance : No damage.
Inductance : Within ±10% of initial value.
Q : Within ±30% of initial value.
Thermal Shock
Low temperature storage test
Phase
Temperature (°C)
Times (min.)
1
-40±2°C
30±3
2
+85±5°C
30±3
Measured : 100 times
Drop 10 times on a concrete floor from a
height of 75cm.
Drop
For L Series :
Condition for 1 cycle
Step1 : -40±2°C 30±3 min.
Step2 : +85±5°C 30±3 min.
Number of cycles : 100
Measured at room temperature after placing for 2 to 3hrs.
Temperature : -55±2°C
Duration : 1008±12hrs
Measured at room temperature after placing for 2 to 3hrs.
No mechanical damage
Derating
Derating Curve
6
Derated Current(A)
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85°C, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
85
125
OperatingTemperature(¢X
Tem perature(°C)
Operating
C)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 5
FERRITE CHIP INDUCTORS
L3 SERIES
9. SOLDERIND AND MOUNTING :
9-1. Recommended PC Board Pattern
2.60
0.80
0.60
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
is shown in Fig. 2
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150°C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350°C tip temperature (max)
f) Limit soldering time to 3 secs.
c) Never contact the ceramic with the iron tip
Soldering
Natural
cooling
Preheating
TEMPERATURE °C
TEMPERATURE °C
Preheating
10s max.
250 ~ 260
230
180
150
60~120s
30~60s
Time(sec.)
Soldering
Natural
cooling
260
245
150
Gradual
Cooling
Over 2min.
Figure 1. Re-flow Soldering
Within 3s
TEMPERATURE °C
Preheating
Soldering
3s
(max.)
350
Natural
cooling
Figure 2. Wave Soldering
10s
(max.)
330
150
Over 1min.
Gradual
Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP INDUCTORS
L3 SERIES
9-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit
t
Recommendable
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 7
FERRITE CHIP INDUCTORS
L3 SERIES
10. PACKAGING INFORMATION :
10-1. Reel Dimension
Type
A(mm)
B(mm)
C(mm)
D(mm)
7" x 8mm
9.0±0.5
60.0±2.0
13.5±0.5 178.0±2.0
7" x 12mm 13.5±0.5
60.0±2.0
13.5±0.5 178.0±2.0
C
D
B
A
2±0.5
7" x 8mm
13.5±0.5
7" x 12mm
R10.5
R1.9
R0.5
120°
10-2 Tape Dimension / 8mm
Material : Paper
t
D:1.5 +0.1
-0.05
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
1
1.12±0.05
0.67±0.05
0.54±0.05
2.0±0.1
0.23±0.05
none
2
1.80±0.05
1.05±0.05
0.95±0.05
4.0±0.1
0.95±0.05
none
3(09)
2.30±0.05
1.50±0.05
0.95±0.05
4.0±0.1
0.95±0.05
none
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
2
1.80±0.10
1.01±0.10
1.02±0.10
4.0±0.1
0.22±0.05
none
3(09)
2.25±0.10
1.42±0.10
1.04±0.10
4.0±0.1
0.22±0.05
1.0±0.1
3(12)
2.35±0.10
1.50±0.10
1.45±0.10
4.0±0.1
0.22±0.05
1.0±0.1
Ko
4
3.50±0.10
1.88±0.10
1.27±0.10
4.0±0.1
0.22±0.05
1.0±0.1
Section A-A
5
3.42±0.10
2.77±0.10
1.55±0.10
4.0±0.1
0.22±0.05
1.0±0.1
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
6
4.95±0.1
1.93±0.1
1.93±0.1
4.0±0.1
0.24±0.05
1.5±0.1
7
4.95±0.1
3.66±0.1
1.85±0.1
8.0±0.1
0.24±0.05
1.5±0.1
8
6.10±0.1
5.40±0.1
2.00±0.1
8.0±0.1
0.30±0.05
1.5±0.1
Bo
Z/L
Ko
Ao
P
Size
Series
W:8.0±0.1
E:1.75±0.1
Po:4±0.1
F:3.5±0.05
P2:2±0.1
Material : Plastic
D:1.5+0.1
Po:4±0.1
t
Series
P
Ao
A
D1:1±0.1
Bo
W:8.0±0.1
A
F:3.5±0.05
E:1.75±0.1
P2:2±0.05
Z/L
10-2.1 Tape Dimension / 12mm
Po:4±0.1
P2:2±0.05
t
A
A
D1:1.5±0.1
P
Ao
Bo
W:12.0±0.1
Series
F:5.5±0.05
E:1.75±0.1
D:1.5+0.1
Z/L
Ko
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 8
FERRITE CHIP INDUCTORS
L3 SERIES
10-3. Packaging Quantity
Chip Size
8
7
6
5
4
3 (12)
3 (09)
2
1
Chip / Reel
1000
1000
2000
2500
3000
2000
4000
4000
10000
Inner Box
4000
4000
8000
12500
15000
10000
20000
20000
50000
Middle Box
20000
20000
40000
62500
75000
50000
100000
100000
250000
Carton
40000
40000
80000
125000
150000
100000
200000
200000
500000
Bulk (Bags)
7000
12000
20000
30000
50000
100000
150000
200000
300000
10-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Top cover tape
Room Temp.
(°C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : 10 ~ 40°C and 30 ~ 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 9
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