LIGITEK L8Y5730 Rectangle type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
RECTANGLE TYPE LED LAMPS
Pb
Lead-Free Parts
L8Y5730
DATA SHEET
DOC. NO :
QW0905-L8Y5730
REV.
:
A
DATE
:
19 - Jul. - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L8Y5730
Page 1/5
Package Dimensions
7.1
2.4
7.8
2.5
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
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PART NO. L8Y5730
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
Yellow
Forward Current
IF
15
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
50
mA
Power Dissipation
PD
50
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
L8Y5730
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @ 10mA(V)
λPnm
@10mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Typ. Min. Typ.
Lens
GaAsP/GaP Yellow Yellow Diffused
Luminous
intensity
585
35
1.7
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.1
8.0
12
144
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PART NO. L8Y5730
Page3/5
Typical Electro-Optical Characteristics Curve
8Y CHIP
Fig.2 Relative Intensity vs. Forward Current
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
Forward Current(mA)
Forward Voltage(V)
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.0
0.5
0.0
500
550
600
650
Wavelength (nm)
700
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PART NO. L8Y5730
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Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
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PART NO. L8Y5730
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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