LIGITEK L9SEF2641-PF Tape and box type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
L9SEF2641-PF/TBF-X
DATA SHEET
DOC. NO :
QW0905-L9SEF2641-PF/TBF-X
REV.
A
DATE
:
:
14 - Dec. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/7
PART NO. L9SEF2641-PF/TBF-X
Package Dimensions
ΔH
P2
H2
H1
W2
H
L
W1 W3
D
P1
-
F
+
P
T
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
L9SEF2641-PF
2.9
3.1
3.3
4.3
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
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Property of Ligitek Only
Page 2/7
PART NO. L9SEF2641-PF/TBF-X
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
9SEF
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
60
mA
Power Dissipation
PD
75
mW
Ir
10
μA
Electrostatic Discharge( * )
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
L9SEF2641-PF/TBF-X
AlGaInP
Forward
Dominant Spectral
voltage
wave halfwidth
length △λ nm @20mA(V)
λDnm
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Max. Min. Typ.
Lens
Orange Orange Transparent
Luminous
intensity
605
17
1.7
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
2.6
700 1400
40
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. L9SEF2641-PF/TBF-X
Page 3/7
•Dimension Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
4.8
0.19
5.8
0.23
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
-------
H
Height Of Seating Plane
Feed Hole To Bottom Of Component
15.5
0.61
16.5
0.65
TBF-1
17.5
0.69
19.5
0.77
TBF-2
19.0
0.75
21.0
0.83
TBF-3
22.5
0.89
24.5
0.96
TBF-4
25.5
1.0
26.5
1.04
TBF-5
21.5
0.85
22.5
0.89
20.2
0.8
21.2
0.83
17.125
0.67
21.125
0.83
TBF-8
20.0
0.79
22.5
0.89
TBF-10
18.8
0.74
19.8
0.78
TBF-11
24.0
0.94
26.0
1.02
TBF-12
21.0
0.83
23.0
0.91
-------
36
1.42
11
0.43
TBF-6
H1
TBF-7
Feed Hole To Overall Component Height
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13
0.51
Lead Location
-------
P1
3.15
0.12
4.55
0.18
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19
0.75
-------
W0
REMARK:TBF = Tape And Box Forming Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Part No.
Quantity/Box
L9SEF2641-PF/TBF-X
2500PCS
W
L
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L9SEF2641-PF/TBF-X
Page 4/7
•Dimension Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
4.8
0.19
5.8
0.23
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
Height Of Seating Plane
-------
H
15.5
0.61
16.5
0.65
TBF-13
19.0
0.75
20
0.79
TBF-14
21.7
0.85
23.7
0.93
TBF-15
22.5
0.89
23.5
0.93
TBF-16
17.5
0.69
18
0.71
TBF-17
18.5
0.73
19.5
0.77
20.5
0.81
21.5
0.85
25.5
1.00
27.5
1.08
TBF-20
20.5
0.81
22.5
0.89
TBF-21
25.0
0.98
27.0
1.06
TBF-22
22.0
0.87
23.0
0.91
TBF-23
25.0
0.98
26.0
1.02
-------
36
1.42
11
0.43
Feed Hole To Bottom Of Component
TBF-18
H1
TBF-19
Feed Hole To Overall Component Height
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13
0.51
Lead Location
-------
P1
3.15
0.12
4.55
0.18
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19
0.75
-------
W0
REMARK:TBF = Tape And Box Forming Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Part No.
L9SEF2641-PF/TBF-X
Quantity/Box
2500PCS
W
L
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L9SEF2641-PF/TBF-X
Page5/7
Typical Electro-Optical Characteristics Curve
9SEF CHIP
Fig.2 Relative Intensity vs. Forward Current
Fig.1 Forward current vs. Forward Voltage
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize @25℃
1.2
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
2.5
2.0
1.5
1.0
0.5
0.0
100
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
100
Fig.6 Directive Radiation
0°
1.0
-30°
30°
-60°
0.5
0.0
100% 75% 50%
500
550
600
Wavelength (nm)
650
60°
25%
0
25%
50% 75% 100%
100
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PART NO. L9SEF2641-PF/TBF-X
Page 6/7
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 ° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 120seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
120 Seconds Max
100
200
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
250
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. L9SEF2641-PF/TBF-X
Page 7/7
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of hogh temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
Thermal Shock Test
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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