LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA140B/SBI-PF DATA SHEET DOC. NO : QW0905-LA140B/SBI-PF REV. : B DATE : 24 - May.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/SBI-PF Page 1/5 Package Dimensions 2.3±0.5 4.5 ψ3.2 6.0 6.0 3.5 3.5±0.5 □0.5 TYP 4.25±0.5 2.54TYP + - LSBI2640-1 2.9 3.3 3.1 4.3 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LA140B/SBI-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SBI Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 70 mA Power Dissipation PD 120 mW Ir 50 μA Electrostatic Discharge( * ) ESD 500 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted LA140B/SBI-PF InGaN/SiC Blue Forward Peak Dominant Spectral voltage wave wave halfwidth @ 20mA(V) length length △λ nm λPnm λDnm Viewing angle 2 θ 1/2 (deg) Typ. Max. Min. Typ. Lens Blue Diffused Luminous intensity @20mA(mcd) 430 465 65 3.8 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.7 28 50 40 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/SBI-PF Page 3/5 Typical Electro-Optical Characteristics Curve SBI CHIP Fig.2 Relative Intensity vs. Wavelength 30 1.0 Relative Intensity(%) Forward Current(mA DC) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 1 2 3 4 0.5 0 380 5 Forward Voltage(V) Relative Intensity Relative Intensity(%) 580 630 680 10 100 75 50 25 0 5 10 15 20 25 30 35 40 45 Fig.5 Forward Current vs. Ambient Temperature 40 30 20 10 0 25 50 75 Ambient Temperature ( ℃) 1 0 0 25 50 75 Lead Temperature ( ℃) Forward Current (mA DC) Forward Current (mA DC) 530 Fig.4 Relative Intensity vs. Lead Temperature 125 0 480 Wavelength (nm) Fig.3 Relative Intensity vs. Forward Current 0 430 100 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/SBI-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/SBI-PF Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11