LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA193B/DBKP DATA SHEET DOC. NO : QW0905-LA193B/DBKP REV. : A DATE : 01 - Mar - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA193B/DBKP Page 1/5 Package Dimensions 2.5±0.3 4.5 6.0 3.0 8.84 6.3 3.2± 0.3 □0.5 TYP 4.0±0.3 2.54TYP + - LDBK2340-PF 3.0 5.0 1.5MAX 25.0MIN □0.5 TYP 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without not ice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA193B/DBKP Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT DBK Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 150 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LA193B/DBKP InGaN/GaN Blue Dominant wave length λDnm Forward Luminous Viewing Spectral voltage intensity angle halfwidth @20mA(V) @20mA(mcd) 2θ 1/2 △λ nm (deg) Typ. Max. Min. Lens Blue Diffused 470 30 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 3.5 Typ. 4.0 350 700 36 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 PART NO. LA193B/DBKP Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 400 450 500 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature(℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 10 550 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA193B/DBKP Page 4/5 Recommended Soldering Conditions 1. Wave Solder Soldering Soldering Iron:30W Max Temperature 300¢XC Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Temp(¢XC) 245¢XC 5sec Max 245 ¢X 120¢X Preheat 2¢X/sec max 2¢X/sec max 2¢X/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120¢XC Max Preheat time: 120 seconds Max Ramp-up:2¢XC/sec(max) Ramp-Down:2¢XC/sec(max) Solder Bath:245¢XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) 2. PB-Free Wave Solder Soldering Soldering Iron:30W Max Temperature:350 ¢XCMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) Temp(¢XC) 265¢XC 5sec Max 265¢X 120¢X Preheat 2¢X/sec max 2¢X/sec max 2¢X/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120¢XC Max Preheat time: 120seconds Max Ramp-up:2¢XC/sec(max) Ramp-Down:2¢XC/sec(max) Solder Bath:265¢XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5 PART NO. LA193B/DBKP Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 PACKING SPECIFICATION PART NO. L A193B/DBKP 1.500 PCS / BAG 2. 8 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W : N, , W G, S PC s kg s kg H