LIGITEK LA208B-SRG-1-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA208B/SRG-1-PF
DATA SHEET
DOC. NO :
QW0905-L A208B/SRG-1-PF
REV.
:
A
DATE
:
25 - Apr. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA208B/SRG-1-PF
Page 1/6
Package Dimensions
2.5±0.5
7.5
14.0
10.3
6.55
3.0
1.85
3.5± 0.5
2.54TYP
11.25± 0.5
2.54TYP
2
1
3
SR
G
1 2 3
1.CATHODE GREEN
2.COMMON ANODE
3.CATHODE RED
LSRG3392/R6-PF
5.0
5.9
7.6
8.6
10.5±0.5
1
1.5MAX
□0.5
TYP
18.0MIN
2.0MIN
1
2
3
2
3
1.CATHODE GREEN
2.COMMON ANODE
3.CATHODE RED
2.0MIN
2.54TYP
SR
G
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/6
PART NO. LA208B/SRG-1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SR
G
Forward Current
IF
30
15
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
100
80
mA
Power Dissipation
PD
100
50
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @ 20mA(V)
λPnm
Red Diffused
Red
GaP
Green Green Diffused
@10mA(mcd)
Min. Max. Min.
Lens
GaAlAs
Luminous
intensity
Viewing
angle
2θ 1/2
(deg)
Typ.
660
20
1.5
2.4
20
45
70
565
20
1.7
2.1
12
30
70
LA208B/SRG-1-PF
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA208B/SRG-1-PF
Page 3/6
Typical Electro-Optical Characteristics Current
SR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/6
PART NO. LA208B/SRG-1-PF
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature(℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
Fig.6 Directive Radiation
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA208B/SRG-1-PF
Page5/6
Recommended Soldering Conditions
1. Wave Solder
Soldering
Soldering Iron:30W Max
Temperature 300°C Max
Soldering Time:3 Seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(°C)
245°C 5sec Max
245°
120°
Preheat
2°/sec
max
2°/sec
max
2°/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120° C Max
Preheat time: 120 seconds Max
Ramp-up:2°C/sec(max)
Ramp-Down:2°C/sec(max)
Solder Bath:245°C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
2. PB-Free Wave Solder
Soldering
Soldering Iron:30W Max
Temperature:350 °CMax
Soldering Time:3seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(°C)
265°C 5sec Max
265°
120°
Preheat
2°/sec
max
2°/sec
max
2°/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120° C Max
Preheat time: 120seconds Max
Ramp-up:2°C/sec(max)
Ramp-Down:2°C/sec(max)
Solder Bath:265°C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/6
PART NO. LA208B/SRG-1
LA208B/SRG-1-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11