LIGITEK LA62B-3-YG-3P

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA62B-3/YG-3P
DATA SHEET
DOC. NO :
QW0905-LA62B-3/YG-3P
REV.
:
A
DATE
:
01 - Mar - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LA62B-3/YG-3P
Package Dimensions
1.3±0.5
7.0
6.35
2.9
7.37
5.08
□0.5
TYP
3.5±0.5
2.54TYP
5.4±0.5
2.54TYP
2
1
G
3
Y
1.ANODE GREEN
2.COMMON CATHODE
3.ANODE YELLOW
1
2
3
+
-
+
LYG2692
2.9 3.1
3.3 4.3
6.45±0.5
1.5
MAX
□0.5
TYP
G Y
18.0MIN
1
2
1
2
3
3
1.ANODE GREEN
2.COMMON CATHODE
3.ANODE YELLOW
2.0MIN
2.0MIN
2.54TYP
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/6
PART NO. LA62B-3/YG-3P
Absolute Maximum Ratings at Ta=25 ℃
Absolute Maximum Ratings
Symbol
Parameter
UNIT
Y
G
Forward Current
IF
20
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
80
120
mA
Power Dissipation
PD
60
100
mW
Reverse Current @5V
Ir
10
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from Body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Lens
GaAsP/GaP Yellow
LA62B-3/YG-3P
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @20mA(V)
λPnm
Luminous
intensity
@10mA(mcd)
Min. Max. Min.
Typ.
Viewing
angle
2θ 1/2
(deg)
585
35
1.7
2.6
8.0
17
50
565
30
1.7
2.6
12
26
50
White Diffused
GaP
Green
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/6
PART NO. LA62B-3/YG-3P
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.2 Relative Intensity vs. Forward Current
Fig.1 Forward current vs. Forward Voltage
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
500
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
700
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/6
PART NO. LA62B-3/YG-3P
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25℃
1.2
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature(℃)
Ambient Temperature(℃)
Relative Intensity@20mA
1000
100
650
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA62B-3/YG-3P
Page 5/6
Recommended Soldering Conditions
1. Wave Solder
Soldering
Soldering Iron:30W Max
Temperature 300¢XC Max
Soldering Time:3 Seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(¢XC)
245¢XC 5sec
Max
245
¢X
120¢X
Preheat
2¢X/sec
max
2¢X/sec
max
2¢X/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120¢XC Max
Preheat time: 120 seconds Max
Ramp-up:2¢XC/sec(max)
Ramp-Down:2¢XC/sec(max)
Solder Bath:245¢XC Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
2. PB-Free Wave Solder
Soldering
Soldering Iron:30W Max
Temperature:350 ¢XCMax
Soldering Time:3seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(¢XC)
265¢XC 5sec
Max
265¢X
120¢X
Preheat
2¢X/sec
max
2¢X/sec
max
2¢X/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120¢XC Max
Preheat time: 120seconds Max
Ramp-up:2¢XC/sec(max)
Ramp-Down:2¢XC/sec(max)
Solder Bath:265¢XC Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA62B-3/YG-3P
Page 6/6
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
PACKING SPECIFICATION
PART NO. LA62B-3/YG-3P
1.500 PCS / BAG
2. 10 BAG / INNER BOX
SIZE : L X W X H 33.5cm X 19cm X 7.5cm
L
W
H
3. 12 INNER BOXES / CARTON
SIZE : L X W X H 58.5cm X 34cm X 34cm
L
W
C/NO:
MADE IN CHINA
.
NO
M
IT E Y :
Q'T ,:
W :
N,
,
W
G,
S
PC
s
g
k
s
kg
H