IXYS LAA110_12

LAA110
Dual Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
350
120
35
Units
VP
mArms / mADC

Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Packages Available
Description
LAA110 is a dual 1-Form-A Solid State Relay that
has two independently controlled, optically coupled
MOSFET switches. The output MOSFET switches and
photovoltaic die employ optically coupled MOSFET
technology to provide 3750 Vrms of input-to-output
isolation.
The relay outputs, that use patented OptoMOS
architecture, are controlled by a highly efficient
GaAlAS infrared LED.
This dual pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-Pin
package.
Approvals
Applications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
LAA110
LAA110S
LAA110STR
LAA110P
LAA110PTR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1,000/Reel)
8-Pin Flat Pack (50/Tube)
8-Pin Flat Pack (1,000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
8
2
7
3
6
4
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
IF
90%
Pb
DS-LAA110-R11
10%
ILOAD
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1
INTEGRATED CIRCUITS DIVISION
LAA110
Absolute Maximum Ratings @ 25°C
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Derate linearly 1.33 mW / °C
Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current, Continuous 1
Peak Load Current
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
2
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=120mA
VL=350VP
IL
ILPK
RON
ILEAK
-
25
-
120
±350
35
1
mArms / mADC
mAP

VL=50V, f=1MHz
ton
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COUT
-
25
3
3
-
ms
ms
pF
IL=120mA
IF=5mA
VR=5V
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
5
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
A
If both poles operate the load current must be derated so as not to exceed the package power dissipation value.
Measurement taken within 1 second of on-time.
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INTEGRATED CIRCUITS DIVISION
LAA110
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
25
25
20
15
10
5
20
15
10
5
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.56
Typical IF for Switch Operation
(N=50, IL=120mADC)
25
Device Count (N)
15
10
5
0
0.65
0.74 0.83 0.92
Turn-On (ms)
1.01
0.65
0.91 1.17 1.43 1.69
LED Current (mA)
10
5
0.04
0.08
0.12 0.16 0.20
Turn-Off (ms)
0.24
0.28
Typical On-Resistance Distribution
(N=50, IL=120mADC)
35
30
20
15
10
5
25
20
15
10
5
0
0.39
15
1.1
Typical IF for Switch Dropout
(N=50, IL=120mADC)
25
20
20
0
0
0
Device Count (N)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0
1.95
0.39
0.65
0.91 1.17 1.43
LED Current (mA)
1.69
22.9
1.95
23.3
23.7 24.1 24.5 24.9
On-Resistance (:)
25.3
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
420
IF=50mA
1.2
IF=10mA
IF=5mA
1.0
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
450
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-Off vs. LED Forward Current
(IL=50mADC)
0.7
0.6
Turn-Off (ms)
1.6
1.4
430 435 440 445
Blocking Voltage (VP)
Typical Turn-On vs. LED Forward Current
(IL=50mADC)
1.8
Turn-On (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
425
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R11
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INTEGRATED CIRCUITS DIVISION
LAA110
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
I F =5mA
I F =10mA
50
40
I F =5mA
I F =10mA
Dual Pole
30
20
Single Pole
Turn-On (ms)
10
0
-40
0
20
40
60
Temperature (ºC)
80
100
Typical On-Resistance vs. Temperature
(IL=50mADC Instantaneous, IF=5mA)
3.0
0
20
40
60
80
50
40
30
20
0
-20
0
20
40
60
80
80
3.0
1.0
1.5
1.0
0.5
0
-20
0
20
40
60
80
-20
-40
100
0
20
40
60
Typical Load Current vs. Load Voltage
(IF=5mA)
Typical Blocking Voltage
vs. Temperature
40
20
0
Load Current (mA)
IF=10mA
IF=5mA
IF=10mA
IF=5mA
Dual Pole
20
40
60
80
100
120
50
0
-50
-100
-2
-1
0
1
Load Voltage (V)
Load Current (A)
Leakage (PA)
0.012
0.010
0.008
0.006
0.004
0.002
0
100
420
415
410
405
400
20
40
60
Temperature (ºC)
80
100
2
3
-20
-40
0
20
40
60
Temperature (ºC)
Energy Rating Curve
0.014
-20
80
425
395
-3
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
(VL=350V)
0
-40
100
430
Temperature (ºC)
0.016
80
435
100
-150
0
120
2.0
Maximum Load Current
vs. Temperature
80
100
2.5
Temperature (ºC)
100
-20
60
Temperature (ºC)
Single Pole
-40
40
Typical IF for Switch Dropout
vs. Temperature
(IL=50mADC)
1.5
150
60
20
Temperature (ºC)
160
120
0
Typical IF for Switch Operation
vs. Temperature
(IL=50mADC)
-40
180
140
-20
Temperature (ºC)
2.0
100
IF=5mA
-40
0
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
100
0.5
10
Typical Turn-Off vs. Temperature
(IL=50mADC)
Temperature (ºC)
2.5
LED Current (mA)
On-Resistance (:)
60
Load Current (mA)
-20
-40
LED Current (mA)
70
-20
IF=5mA
IF=10mA
IF=20mA
Blocking Voltage (VP)
On-Resistance (:)
60
Typical Turn-On vs. Temperature
(IL=50mADC)
Turn-Off (ms)
Typical On-Resistance vs. Temperature
(IL=120mADC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R11
INTEGRATED CIRCUITS DIVISION
LAA110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LAA110 / LAA110S / LAA110P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
LAA110 / LAA110S
250ºC for 30 seconds
LAA110P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R11
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5
INTEGRATED CIRCUITS DIVISION
LAA110
MECHANICAL DIMENSIONS
LAA110
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LAA110S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LAA110P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
6
PCB Land Pattern
Dimensions
mm
(inches)
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R11
INTEGRATED CIRCUITS DIVISION
LAA110
MECHANICAL DIMENSIONS
LAA110STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
LAA110PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-LAA110-R11
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012