PROTEC LC0404FC Low capacitance flip chip array Datasheet

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LC0404FC3.3C
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Only One Name Means ProTek’Tion™
LC0404FC36C
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
0404
(Single Chip Shown)
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low Clamping Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 to 3 Lines
✔ LOW CAPACITANCE
✔ LOW LEAKAGE CURRENT
✔ RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0404
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Tin-Lead or Lead-Free Plating
✔ Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
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LC0404FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp = 8/20µs) - See Figure 1
PPP
200
Watts
Operating Temperature
TJ
-55°C to 150°C
°C
TSTG
-55°C to 150°C
°C
PARAMETER
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
LC0404FC3.3C
LC0404FC05C
LC0404FC08C
LC0404FC12C
LC0404FC15C
LC0404FC24C
LC0404FC36C
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
V WM
VOLTS
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@8/20µs
VC @ IPP
@VWM
ID
µA
@0V, 1 MHz
C
pF
3.3
5.9
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
11.0
13.2
19.8
25.4
37.2
70.0
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
75*
10**
1
1
1
1
1
70
35
32
30
25
20
18
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
IPP - Peak Pulse Current - % of IPP
PPP - Peak Pulse Current - Watts
10,000
1,000
200W, 8/20µs Waveform
100
10
0.01
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FIGURE 2
PULSE WAVE FORM
120
tf
100
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
Peak Value IPP
80
e-t
60
40
td = t I /2
PP
20
0
1
10
100
td - Pulse Duration - µs
1,000
10,000
2
0
5
10
15
t - Time - µs
20
25
30
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LC0404FC36C
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
Peak Pulse Power
8/20µs
% Of Rated Power
80
60
40
20
Average Power
0
0
25
50
75
100
125
TL - Lead Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR LC0404FC05C
5 Volts per Division
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0404FC05C
VC - Clamping Voltage - Volts
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
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LC0404FC36C
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-265°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Temperature - °C
Ramp-up
Ramp-down
TL
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
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Ramp-up
15 seconds
4
Solder Time
15-20 seconds
Ramp-down
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
SIDE
DIM
MILLIMETERS
INCHES
A
0.56 NOM
0.022 NOM
B
0.86 NOM
0.034 NOM
C
1.0 ± 0.02
0.039 ± 0.001
E
0.15 SQ
0.006 SQ
F
1.0 ± 0.0254
0.039 ± 0.001
G
0.15 NOM
0.006 NOM
H
0.127 MAX
0.005 MAX
G
B
TOP
C
A
PACKAGE OUTLINE
I
H
0.016 NOM
I
PAD DIMENSIONS
D
MOUNTING PAD LAYOUT - Option 1
A
C
E
DIE
SOLDER
BUMP
DIM
MILLIMETERS
INCHES
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTE:
G
H
0.003 MIN
0.406 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
E
F
END
0.076 MIN
1. Preferred: Using 0.1mm (0.004”) stencil.
F
I
SOLDER PADS
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER MASK
Outline & Dimensions: Rev4 - 9/04, 06022
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LC0404FC36C
PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
PACKAGE DIMENSIONS
DIM
A
COPPER
CONTACTS
0.009” [0.23] DIA.
G
H
DIE
SOLDER
BUMP
MILLIMETERS
INCHES
A
0.51
0.020
F
0.15 SQ
0.006 SQ
G
0.71
0.028
H
0.99
0.039
I
0.51
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev4 - 9/04, 06022
TAPE & REEL ORIENTATION
F
I
SOLDER PRINT
0.014” - [0.36] DIA.
Laser
Orientation
Line
SOLDER MASK
Dual Die - 0404
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., LC0404FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels - 10,000
pieces per reel. Ordering Suffix: -T710-2
(i.e., LC0404FC05C-T710-2).
4. Suffix - LF = Lead-Free,
i.e., LC0404FC05C-LF-T710-2.
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
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