Sanken LC5205S Hybrid integrated circuit Datasheet

LED Lighting IC
LC5205S
13 October 2011
◆Description
◆Package
LC5205S is non-isolated type driver IC for LED lighting
which can achieve high efficiency in simple circuitry. Its
compact package which includes output MOSFET and
controller, and low external components are suitable for
small lighting equipment which requires saving space, like
LED light bulb.
Its high voltage capability allows direct connection to
rectified AC supply.
Protection features ensure safety LED drive.
Package: SOP8
◆Applications
◆Main Specification
 LED Lighting equipment
 LED Light bulb
MOSFET
Output Current
Main Supply Voltage
450V (MIN), 6.0Ω (MAX)
0.5A (MAX)
450V (MAX)
◆Features
 SOP8Package
Output MOSFET and controller are included in
one package.
 High voltage supply input
Able to direct connection to rectified AC supply.
 Built-in constant current controller
- PWM mode current control circuitry.
- Adjustable output current by input voltage to Ref pin.
 External PWM
- PWM signal input to PWM pin enables dimming.
- Low signal shuts off output current.
 Under voltage lockout protection (UVLO)
Prevents malfunction when supply voltage is low.
 Over current protection (OCP)
Latched in response to the load short condition.
 Thermal Shutdown protection (TSD)
Protects IC from damage due to excess temperature,
auto-restart when temperature drops below threshold
Typical application circuit
FUSE
Input
Line
Filter
CO
Di
Reg
ROff
R1
C1
PWM
Ref
COff
R2
VBB
LC5205 OUT
GND
C2
SANKEN ELECTRIC CO.,LTD.
http://www.sanken-ele.co.jp
1/8
LED
L
Sen
RS
LED Lighting IC
LC5205S
13 October 2011
1 Scope
The present specifications shall apply to a LED driver IC for LED lighting, LC5205S.
2 Outline
Type
Structure
Applications
Hybrid Integrated Circuit
Plastic Molded (Transfer Mold)
LED Lighting
3 Absolute Maximum Ratings (Ta=25℃)
Parameter
Terminal
Symbol
Ratings
Units
Main Power Supply Voltage
6−8
VBB
450
V
Output MOSFET Breakdown Voltage
5−4
Vo
450
V
※1
Output Current
5−4
IO
Ref Input Voltage
3−8
VRef
−0.3~VReg+0.3
V
Sense Voltage
4−8
VSen
-0.3~4
V
Exclude tw<1µs
W
Mounted on PWB ※3
0.5
※2
A
Remarks
Allowable Power Dissipation
―
PD
Junction Temperature
―
Tj
150
℃
Operating Temperature Range
―
Ta
−40~105
℃
Storage Temperature Range
―
Tstg
−40~150
℃
0.85
Exclude tw<1µs
※1 Output current rating may be limited by duty cycle, ambient temperature, and heat sinking.
Under any set of conditions, do not exceed the specified junction temperature (Tj).
※2 Allowable Power Dissipation depends on PWB pattern layout.
※3 Mounted on Sanken evaluation board.
SANKEN ELECTRIC CO.,LTD.
2/8
LED Lighting IC
LC5205S
13 October 2011
4 Electrical Characteristic (Ta=25°C, VBB=140V, Unless Otherwise Noted.)
Ratings
Units
Remarks
―
mA
At enable
0.8
1.2
mA
At disable
450
―
―
V
ID=1mA
RDS(on)
―
3.5
6.0
Ω
ID=0.5A
4−5
VF
―
0.8
―
V
IF=0.5A
Reg Output Voltage
1−8
VReg
11.5
12
12.5
V
IReg=0.1mA
Reg Maximum Output Current
1−8
IReg
―
―
2
mA
Maximum PWM Frequency
2−8
fclk
200※4
―
―
kHz
Ref Input Voltage Range
3−8
VRef
0
―
1
V
Ref Input Current
3−8
IRef
―
±10
―
µA
Sense Input Voltage
4−8
VSen
VRef−30
VRef
VRef+30
mV
Sense Input Current
4−8
ISen
―
±10
―
µA
Over Current Protect Voltage
4−8
VOCP
―
3
―
V
Under Voltage Lock Out Threshold (Turn On)
6−8
VUVLOon
―
14
―
V
Under Voltage Lock Out Threshold (Turn Off)
6−8
VUVLOoff
―
13
―
V
Thermal Shutdown Threshold
―
TTSD
―
150
―
°C
Thermal Shutdown Hysteresis
―
TTSDhys
―
55
―
°C
Blanking Time
―
tBLK
―
400
―
ns
5−4
tr
―
20
―
ns
Io=0.4A
5−4
tf
―
50
―
ns
Io=0.4A
Parameter
Terminal
Symbol
6−8
MIN
TYP
MAX
IBB
―
2
6−8
IBBs
―
Drain-Source Breakdown Voltage
5−4
VDS(BR)
Output MOS-FET On Resistance
5−4
Body Diode Forward Voltage
Main Power Supply Current
Switching Time
※4 Operation at a PWM frequency greater than 200kHz is possible but not warranted.
SANKEN ELECTRIC CO.,LTD.
3/8
duty=50%
Temperature
of Control IC
LED Lighting IC
LC5205S
13 October 2011
Thermal Data
Temperature Rise ΔT[℃]
150
125
100
75
50
25
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Total Power Dissipation PD[W]
Allowable Package Power Dissipation
PD[W]
Power Dissipation versus Ambient Temperature
1
PD=0.85W
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
Ambient Temperature Ta[℃]
SANKEN ELECTRIC CO.,LTD.
4/8
LED Lighting IC
LC5205S
13 October 2011
5 Functional Block Diagram (Pin assignment)
VBB
OUT
MIC
Reg
Regulator
UVLO
TSD
PWM
Ref
Current
Control
Logic
Gate
Driver
OCP
GND
Sen
Pin Assignment
Number
Name
Function
1
Reg
12V Internal regulator output pin
2
PWM
Connect to PWM Off-Time Setting C&R
3
Ref
Reference Voltage for PWM Control
4
Sen
Output-current detection pin
5
OUT
Output pin
6
OUT
Output pin
7
VBB
Supply voltage pin
8
GND
Device ground pin.
SANKEN ELECTRIC CO.,LTD.
5/8
LED Lighting IC
LC5205S
13 October 2011
6 Package
6.1 Package Drawing and Material
 SOP8 Package
LC5205
Dimensions in mm
Material of terminal: Cu
Terminal treatment:
Sn-Ag planting (Pb Free)
Marking
Position
Contents
Indication
①
The last digit of the year
0 to 9
②
The Month
1 to 9,O,N,D
③
The week
1 to 3
Sanken Registration
Number
alphanumeric characters
④
⑤
⑥
⑦
6.2 Appearance
The body shall be clean and shall not bear any stain, rust or flaw.
6.3 Marking
The type number and lot number shall be clearly marked by laser so that cannot be erased easily.
SANKEN ELECTRIC CO.,LTD.
6/8
LED Lighting IC
LC5205S
13 October 2011
7 Cautions and warnings
Since reliability can be affected adversely by improper storage environment and handling methods during
Characteristic tests, please observe the following cautions.
7.1 Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35℃) and the standard relative
humidity (around 40 to 75%) and avoid storage locations that experience extreme changes in temperature or
humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust in leads and solderability that have been stored for a long time.
7.2 Cautions for characteristic Tests and Handling
 When characteristic tests are carried out during inspection testing and other standard tests periods, protect
the devices from surge of power from the testing device, shorts between the devices and the heatsink.
7.3 Considerations to protect the Products from Electrostatic Discharge
 When handling the devices, operator must be grounded. Grounded wrist straps be worn and should have at




least 1MΩ of resistance near operators to ground to prevent shock hazard.
Workbenches where the devices are handled should be grounded and be provided with conductive table and
floor mats.
When using measuring equipment such as a curve tracer, the equipment should also be grounded.
When soldering the devices, the head of a soldering iron or a solder bath must be grounded in other to
prevent leak voltage generated by them from being applied to the devices.
The devices should always be stored and transported in our shipping containers or conductive containers, or
be wrapped up in aluminum foil.
7.4 Insulation distance between pins
 The insulation distance between pins is not considered for this product. Therefore, please take measures for
the insulation distance to apply to user's design standard.
7.5 Flow soldering (Wave soldering)
 Wave soldering (immerse the IC bodies in molten solder) may cause package crack since thermal shock is
high, therefore wave soldering is not applicable.

SANKEN ELECTRIC CO.,LTD.
7/8
LED Lighting IC
LC5205S
13 October 2011
7.6 Others
 The contents in this document are subject to changes, for improvement and other purposes, without notice. Make
sure that this is the latest revision of the document before use.
 Application and operation examples described in this document are quoted for the sole purpose of reference for the
use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights,
intellectual property rights or any other rights of Sanken or any third party which may result from its use.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or
apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
 In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the
reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a
case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered
for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as
electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity
etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values,
maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value,
the degree of derating of junction temperature (Tj) affects the reliability significantly.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that
may result from all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.
SANKEN ELECTRIC CO.,LTD.
8/8
Similar pages