OSRAM LD263 Gaas infrared emitter array Datasheet

GaAs-IR-Lumineszenzdioden-Zeilen
GaAs Infrared Emitter Arrays
Lead (Pb) Free Product - RoHS Compliant
LD 260
LD 262 … LD 269
Wesentliche Merkmale
Features
• GaAs-IR-Lumineszenzdiode
• Zeilenbauform, lieferbar von 2 bis 10 Emitter
pro Zeile
• Farbe: transparent
• Hohe Zuverlässigkeit
• Gruppiert lieferbar
• Gehäusegleich mit BPX 80-Serie
• Miniatur-Gehäuse
• GaAs infrared emitting diode
• Leadframe arrays, available from 2 to 10
Emitters per array
• Colour: transparent
• High reliability
• Available in bins
• Same package as BPX 80 series
• Miniature package
Anwendungen
Applications
• Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb
• Barcodeleser
• Industrieelektronik
• „Messen/Steuern/Regeln“
• Sensorik
• Drehzahlsteuerung
•
•
•
•
•
•
2007-04-03
1
Miniature photointerrupters
Barcode readers
Industrial electronics
For control and drive circuits
Sensor technology
Speed controller
LD 260, LD 262 … LD 269
Typ
Bestellnummer
Type
IRED
pro Zeile
per Row
LD 262
2
Q62703Q0070
LD 263
3
Q62703Q0071
LD 264
4
Q62703Q0072
LD 265
5
Q62703Q0073
LD 266
6
Q62703Q0074
LD 267
7
Q62703Q0075
LD 268
8
Q62703Q0076
LD 269
9
Q62703Q0077
LD 260
10
Q62703Q0078
1)
Ordering Code
Strahlstärkegruppierung 1) (IF = 50 mA, tp = 20 ms)
Radiant intensity grouping 1)
Ie (mW/sr)
> 2.5 (typ. 5)
gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
2007-04-03
2
LD 260, LD 262 … LD 269
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top; Tstg
– 40 … + 80
°C
Sperrschichttemperatur
Junction temperature
Tj
80
°C
Sperrspannung
Reverse voltage
VR
5
V
Durchlassstrom
Forward current
IF
50
mA
Stoßstrom, τ ≤ 10 μs, D = 0
Surge current
IFSM
1.6
A
Verlustleistung
Power dissipation
Ptot
70
mW
Wärmewiderstand
Thermal resistance
RthJA
RthJL
750
650
K/W
K/W
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 50 mA, tp = 20 ms
λpeak
950
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 50 mA, tp = 20 ms
Δλ
55
nm
Abstrahlwinkel
Half angle
ϕ
± 15
Grad
deg.
Aktive Chipfläche
Active chip area
A
0.25
mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L×B
L×W
0.5 × 0.5
mm²
Abstand Chipoberfläche bis Linsenscheitel
Distance chip surface to lens top
H
1.3 … 1.9
mm
Kennwerte (TA = 25 °C)
Characteristics
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3
LD 260, LD 262 … LD 269
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 50 mA, RL = 50 Ω
Switching times, Ie from 10% to 90% and from
90% to 10%, IF = 50 mA, RL = 50 Ω
tr , tf
1
μs
Kapazität, VR = 0 V
Capacitance
Co
40
pF
Durchlassspannung, IF = 50 mA, tp = 20 μs
Forward voltage
VF
1.25 (≤ 1.4)
V
Sperrstrom, VR = 5 V
Reverse current
IR
0.01 (≤ 1)
μA
Gesamtstrahlungsfluss, IF = 50 mA, tp = 20 ms
Total radiant flux
Φe
9
mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 50 mA
Temperature coefficient of Ie or Φe,
IF = 50 mA
TCI
– 0.55
%/K
Temperaturkoeffizient von VF, IF = 50 mA
Temperature coefficient of VF, IF = 50 mA
TCV
– 1.5
mV/K
Temperaturkoeffizient von λpeak, IF = 50 mA
Temperature coefficient of λpeak, IF = 50 mA
TCλ
0.3
nm/K
Strahlstärke, IF = 50 mA, tp = 20 ms
Radiant intensity
Ιe
typ. 5 (≥ 2)
mW/sr
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LD 260, LD 262 … LD 269
Relative Spectral Emission
Irel = f (λ)
Radiant Intensity
Single pulse, tp = 20 μs
OHRD1938
100
OHR01039
10 2
Ιe
Ι e (100 mA)
%
Ι rel
Ιe
= f (IF)
Ιe 100 mA
Max. Permissible Forward Current
IF = f (TA)
OHR01124
80
Ι F mA
70
80
60
10 1
50
60
40
R thJL = 650 K/W
40
30
10 0
R thJA = 750 K/W
20
20
10
0
880
920
960
1000
nm
10 -1
10 -2
1060
λ
Forward Current
IF = f (VE), single pulse,
tp = 20 μs
ΙF
OHR01042
10 1
A
ΙF
OHR02182
10 4
Ι F mA
10 0
10 0
Permissible Pulse Handling
Capability IF = f (τ), TC = 25 °C,
duty cycle D = parameter
10 1
A
typ.
0
10 -1
max.
D= τ
T
τ
D=0
0,005
0,01
0,02
ΙF
T
10 3
0,05
0,1
0,2
10 -1
10 2
0,5
DC
10 -2
1
1.5
2
2.5
3
3.5
10 1 -5
10
4 V 4.5
VF
10 -4
10 -3
10 -2
10 -1 s 10 0
τ
Radiation Characteristics Irel = f (ϕ)
40
30
20
10
0
ϕ
OHR01878
1.0
50
0.8
60
0.6
70
0.4
0.2
80
0
90
100
1.0
2007-04-03
0.8
0.6
0.4
0
20
40
60
80
5
100
120
0
20
40
60
80 C 100
TA , TL
LD 260, LD 262 … LD 269
0.5 (0.020)
0.4 (0.016)
2.54 (0.100)
spacing
0.7 (0.028) 0 ... 5˚
0.6 (0.024)
0.25 (0.010)
0.15 (0.006)
2.1 (0.083)
1.5 (0.059)
3.0 (0.118)
7.0 (0.276)
3.5 (0.138)
7.4 (0.291)
2.7 (0.106)
2.5 (0.098)
1.9 (0.075)
1.7 (0.067)
Chip
position
3.6 (0.142)
3.2 (0.126)
Maßzeichnung
Package Outlines
A
0.4 A
1.4 (0.055)
1.0 (0.039)
Collector (BPX 83)
Cathode (LD 263)
GEOY6367
Maße in mm (inch) / Dimensions in mm (inch).
.
Typ
IRED pro Zeile
Maß „A“
Type
IRED per Row
Dimension “A”
LD 262
2
4.5 ... 4.9
LD 263
3
7.0 ... 7.4
LD 264
4
9.6 ... 10.0
LD 265
5
12.1 ... 12.5
LD 266
6
14.6 ... 16.0
LD 267
7
17.2 ... 17.6
LD 268
8
19.7 ... 20.1
LD 269
9
22.3 ... 22.7
LD 270
10
24.8 ... 25.2
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LD 260, LD 262 … LD 269
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
T
10 s
250
Normalkurve
standard curve
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
200
1. Welle
1. wave
150
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
100
2 K/s
50
Zwangskühlung
forced cooling
0
0
50
100
150
200
s
250
t
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2007-04-03
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