LIGITEK LDBK9653-50A-OD Square with 4leads type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SQUARE WITH 4LEADS TYPE LED LAMPS
Pb
Lead-Free Parts
LDBK9653-50A-OD
DATA SHEET
DOC. NO : QW0905-LDBK9653-50A-OD
REV.
:
A
DATE
: 15 - Aug. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LDBK9653-50A-OD
Package Dimensions
7.35
7.62± 0.5
3.5±0.5
4.8
ANODE
7.62±0.5
5.08±0.3
CATHODE
1.55
ψ5.0
0.8
2.55
2.5
0.4
5.08±0.3
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
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PART NO. LDBK9653-50A-OD
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
DBK
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
100
mA
Power Dissipation
PD
120
mW
Ir
50
μA
Electrostatic Discharge( * )
ESD
150
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
LDBK9653-50A-OD
InGaN/GaN Blue
Dominant
wave
length
λD nm
Forward
Spectral
voltage
halfwidth
△λnm @20mA(V)
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Typ. Max. Min. Typ.
Lens
Water Clear
Luminous
intensity
470
30
3.5
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
4.0
2700 5000
70
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PART NO. LDBK9653-50A-OD
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
350
4
Relative Intensity
Normalize @20mA
Forward Voltage(V)
4.5
3.5
3
2.5
2
1.5
1
0.5
300
250
200
150
100
50
0
0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
Forward Current(mA)
Forward Current(mA)
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1800
1600
1400
1200
1000
800
600
400
200
0
420
440
460
480
Wavelength (nm)
500
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
400
3.0
520
540
100
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PART NO. LDBK9653-50A-OD
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0°
2° /sec
max
0
Preheat
60 Seconds Max
50
100
150
Time(sec)
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PART NO. LDBK9653-50A-OD
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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