LIGITEK LDUV2043

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LDUV2043
DATA SHEET
DOC. NO :
QW0905-LDUV2043
REV.
C
DATE
:
:
18- Nov. - 2008
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LDUV2043
Package Dimensions
3.0
4.0
4.2
5.2
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30 °
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
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Property of Ligitek Only
PART NO. LDUV2043
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
DUV
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
100
mA
Power Dissipation
PD
120
mW
Ir
50
μA
Electrostatic Discharge( * )
ESD
500
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Reverse Current @5V
Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* Static
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
MATERIAL
COLOR
Emitted
LDUV2043
InGaN
Peak
wave
length
λPnm
Forward
Spectral
voltage
halfwidth
@20mA(V)
△λ nm
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Max. Min. Typ.
Lens
Purple Water Clear
Luminous
intensity
400
20
3.0
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
4.0
90
160
30
LIGITEK ELECTRONICS CO.,LTD.
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Page 3/5
PART NO. LDUV2043
Typical Electro-Optical Characteristics Curve
DUV CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vsForward Current
3.9
2.5
3.8
2.0
Relative Intensity
Normalize @20mA
Forward Voltage(V)
3.7
3.6
3.5
3.4
3.3
3.2
1.5
1.0
0.5
0
3.1
20
30
40
50
60
70
80
90
100
20
30
40
50
60
70
80
90
100
Forward Current(mA)
Forward Current(mA)
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Wavelength
Relative Intensity@20mA
1.0
Wavelength(nm)WLP
420
410
400
390
380
20
40
60
80
Forward Current(mA)
100
0.5
0.0
350
400
450
Wavelength (nm)
550
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LDUV2043
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 °C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
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PART NO. LDUV2043
Page 5/5
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11