LIGITEK LEG3392-R1-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DUAL COLOR LED LAMPS
Pb
Lead-Free Parts
LEG3392/R1-PF
DATA SHEET
DOC. NO :
QW0905- LEG3392/R1-PF
REV.
:
A
DATE
:
25 - Apr. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LEG3392/R1-PF
Package Dimensions
5.0
5.9
7.6
8.6
10.5± 0.5
1.5MAX
□0.5
TYP
G
18.0MIN
1
2
3
2.0MIN
2.0MIN
2.54TYP
E
1
2
3
- + 1.CATHODE GREEN
2.COMMON ANODE
3.CATHODE ORANGE
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/6
PART NO. LEG3392/R1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
E
G
Forward Current
IF
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
120
120
mA
Power Dissipation
PD
100
100
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Peak
wave
length
λPnm
Spectral
halfwidth
Δλ nm
Lens
GaAsP/GaP Orange
Forward
voltage
@20mA(V)
Luminous
intensity
@ 10mA(mcd)
Min.
Max.
Min.
Typ.
Viewing
angle
2θ 1/2
(deg)
635
45
1.7
2.6
0.5
1.2
76
565
30
1.7
2.6
1.2
1.8
76
White Diffused
LEG3392/R1-PF
GaP
Green
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/6
PART NO. LEG3392/R1-PF
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/6
PART NO. LEG3392/R1-PF
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature(℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LEG3392/R1-PF
Page 5/6
Recommended Soldering Conditions
1. Wave Solder
Soldering
Soldering Iron:30W Max
Temperature 300¢XC Max
Soldering Time:3 Seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(¢XC)
245¢XC 5sec
Max
245
¢X
120¢X
Preheat
2¢X/sec
max
2¢X/sec
max
2¢X/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120¢XC Max
Preheat time: 120 seconds Max
Ramp-up:2¢XC/sec(max)
Ramp-Down:2¢XC/sec(max)
Solder Bath:245¢XC Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
2. PB-Free Wave Solder
Soldering
Soldering Iron:30W Max
Temperature:350 ¢XCMax
Soldering Time:3seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(¢XC)
265¢XC 5sec
Max
265¢X
120¢X
Preheat
2¢X/sec
max
2¢X/sec
max
2¢X/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120¢XC Max
Preheat time: 120seconds Max
Ramp-up:2¢XC/sec(max)
Ramp-Down:2¢XC/sec(max)
Solder Bath:265¢XC Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/6
PART NO. LEG3392/R1-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11