TI1 LM137H/NOPB 3-terminal adjustable negative regulator Datasheet

LM137, LM337-N
www.ti.com
SNVS778D – MAY 1999 – REVISED APRIL 2013
LM137/LM337-N 3-Terminal Adjustable Negative Regulators
Check for Samples: LM137, LM337-N
FEATURES
1
•
•
2
•
•
•
•
•
•
•
•
•
•
•
Output Voltage Adjustable from −1.2V to −37V
1.5A Output Current Specified, −55°C to
+150°C
Line Regulation Typically 0.01%/V
Load Regulation Typically 0.3%
Excellent Thermal Regulation, 0.002%/W
77 dB Ripple Rejection
Excellent Rejection of Thermal Transients
50 ppm/°C Temperature Coefficient
Temperature-independent Current Limit
Internal Thermal Overload Protection
P+ Product Enhancement Tested
Standard 3-lead Transistor Package
Output is Short Circuit Protected
DESCRIPTION
The LM137/LM337-N are adjustable 3-terminal
negative voltage regulators capable of supplying in
excess of −1.5A over an output voltage range of
−1.2V to −37V. These regulators are exceptionally
easy to apply, requiring only 2 external resistors to
set the output voltage and 1 output capacitor for
frequency compensation. The circuit design has been
optimized for excellent regulation and low thermal
transients. Further, the LM137 series features internal
current limiting, thermal shutdown and safe-area
compensation, making them virtually blowout-proof
against overloads.
The LM137/LM337-N serve a wide variety of
applications including local on-card regulation,
programmable-output voltage regulation or precision
current regulation. The LM137/LM337-N are ideal
complements to the LM117/LM317 adjustable
positive regulators.
Table 1. LM137 Series Packages and Power
Capability
Device
LM137/337-N
Package
TO-3 (K)
Rated Power
Dissipation
Design
Load
Current
20W
1.5A
TO (NDT)
2W
0.5A
LM337-N
TO-220 (NDE)
15W
1.5A
LM337-N
SOT-223 (DCY)
2W
1A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM137, LM337-N
SNVS778D – MAY 1999 – REVISED APRIL 2013
www.ti.com
Typical Applications
Full output current not available at high input-output voltages
†C1 = 1 μF solid tantalum or 10 μF aluminum electrolytic required for stability
*C2 = 1 μF solid tantalum is required only if regulator is more than 4″ from power-supply filter capacitor
Output capacitors in the range of 1 μF to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide
improved output impedance and rejection of transients
Figure 1. Adjustable Negative Voltage Regulator
Comparison between SOT-223 and D-Pak (TO-252) Packages
Figure 2. Scale 1:1
2
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
LM137, LM337-N
www.ti.com
SNVS778D – MAY 1999 – REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2)
Power Dissipation
Internally Limited
Input-Output Voltage Differential
40V
Operating Junction Temperature Range
LM137
−55°C to +150°C
LM337-N
0°C to +125°C
−40°C to +125°C
LM337I
−65°C to +150°C
Storage Temperature
Lead Temperature (Soldering, 10 sec.)
300°C
Plastic Package (Soldering, 4 sec.)
260°C
ESD Rating
(1)
(2)
2k Volts
Refer to RETS137H drawing for LM137H or RETS137K drawing for LM137K military specifications.
Unless otherwise specified, these specifications apply −55°C ≤ Tj ≤ +150°C for the LM137, 0°C ≤ Tj ≤ +125°C for the LM337-N; VIN −
VOUT = 5V; and IOUT = 0.1A for the TO package and IOUT = 0.5A for the TO-3, SOT-223 and TO-220 packages. Although power
dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the TO and SOT-223 (see
APPLICATION HINTS), and 20W for the TO-3, and TO-220. IMAX is 1.5A for the TO-3, SOT-223 and TO-220 packages, and 0.2A for the
TO package.
ELECTRICAL CHARACTERISTICS (1)
Parameter
Conditions
LM137
Min
Line Regulation
Tj = 25°C, 3V ≤ |VIN − VOUT| ≤ 40V
LM337
Typ
Max
0.01
0.02
Min
Units
Typ
Max
0.01
0.04
%/V
(2)
IL = 10 mA
Load Regulation
Tj = 25°C, 10 mA ≤ IOUT ≤ IMAX
Thermal Regulation
Tj = 25°C, 10 ms Pulse
Adjustment Pin Current
Adjustment Pin Current Charge
10 mA ≤ IL ≤ IMAX
0.3
0.5
0.3
1.0
%
0.002
0.02
0.003
0.04
%/W
65
100
65
100
μA
2
5
2
5
μA
3.0V ≤ |VIN − VOUT| ≤ 40V,
TA = 25°C
Reference Voltage
Tj = 25°C
(3)
3V ≤ |VIN − VOUT| ≤ 40V,
(3)
−1.225 −1.250 −1.275 −1.213 −1.250 −1.287
V
−1.200 −1.250 −1.300 −1.200 −1.250 −1.300
V
10 mA ≤ IOUT ≤ IMAX, P ≤ PMAX
Line Regulation
3V ≤ |VIN − VOUT| ≤ 40V,
(2)
(2)
0.02
0.05
0.02
0.07
%/V
0.3
1
0.3
1.5
%
Load Regulation
10 mA ≤ IOUT ≤ IMAX,
Temperature Stability
TMIN ≤ Tj ≤ TMAX
0.6
Minimum Load Current
|VIN − VOUT| ≤ 40V
2.5
5
2.5
10
mA
|VIN − VOUT| ≤ 10V
1.2
3
1.5
6
mA
(1)
(2)
(3)
0.6
%
Unless otherwise specified, these specifications apply −55°C ≤ Tj ≤ +150°C for the LM137, 0°C ≤ Tj ≤ +125°C for the LM337-N; VIN −
VOUT = 5V; and IOUT = 0.1A for the TO package and IOUT = 0.5A for the TO-3, SOT-223 and TO-220 packages. Although power
dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the TO and SOT-223 (see
APPLICATION HINTS), and 20W for the TO-3, and TO-220. IMAX is 1.5A for the TO-3, SOT-223 and TO-220 packages, and 0.2A for the
TO package.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation. Load regulation is measured on the output pin at a point ⅛ in.
below the base of the TO-3 and TO packages.
Selected devices with tightened tolerance reference voltage available.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
3
LM137, LM337-N
SNVS778D – MAY 1999 – REVISED APRIL 2013
www.ti.com
ELECTRICAL CHARACTERISTICS(1) (continued)
Parameter
Current Limit
Conditions
LM137
LM337
Units
Min
Typ
Max
Min
Typ
Max
K, DCY and NDE Package
1.5
2.2
3.5
1.5
2.2
3.7
A
NDT Package
0.5
0.8
1.8
0.5
0.8
1.9
A
K, DCY and NDE Package
0.24
0.4
0.15
0.4
NDT Package
0.15
0.17
0.10
|VIN − VOUT| ≤ 15V
|VIN − VOUT| = 40V, Tj = 25°C
RMS Output Noise, % of VOUT
Tj = 25°C, 10 Hz ≤ f ≤ 10 kHz
Ripple Rejection Ratio
VOUT = −10V, f = 120 Hz
CADJ = 10 μF
66
A
0.17
A
0.003
0.003
%
60
60
dB
77
66
77
dB
Long-Term Stability
Tj = 125°C, 1000 Hours
0.3
1
0.3
1
%
Thermal Resistance, Junction to
Case
NDT Package
12
15
12
15
°C/W
K Package
2.3
3
2.3
3
°C/W
NDE Package
Thermal Resistance, Junction to
Ambient (No Heat Sink)
4
4
°C/W
NDT Package
140
140
°C/W
K Package
35
35
°C/W
NDE Package
50
°C/W
DCY Package
170
°C/W
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
LM137, LM337-N
www.ti.com
SNVS778D – MAY 1999 – REVISED APRIL 2013
SCHEMATIC DIAGRAM
Thermal Regulation
When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC
circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large.
Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change)
per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or
temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation
depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the
percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137's
specification is 0.02%/W, max.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
5
LM137, LM337-N
SNVS778D – MAY 1999 – REVISED APRIL 2013
www.ti.com
LM137, VOUT = −10V
VIN − VOUT = −40V
IIL = 0A → 0.25A → 0A
Vertical sensitivity, 5 mV/div
Figure 3.
In Figure 3, a typical LM137's output drifts only 3 mV (or 0.03% of VOUT = −10V) when a 10W pulse is applied for
10 ms. This performance is thus well inside the specification limit of 0.02%/W × 10W = 0.2% max. When the
10W pulse is ended, the thermal regulation again shows a 3 mV step at the LM137 chip cools off. Note that the
load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 4, when the
10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal
error stays well within 0.1% (10 mV).
LM137, VOUT = −10V
VIN − VOUT = −40V
IL = 0A → 0.25A → 0A
Horizontal sensitivity, 20 ms/div
Figure 4.
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
LM137, LM337-N
www.ti.com
SNVS778D – MAY 1999 – REVISED APRIL 2013
Connection Diagrams
Case Is Input
See STD Mil DWG 5962P99517 for
Radiation Tolerant Devices
Case is Input
Figure 5. TO-3
Metal Can Package
Bottom View
See Package Number K0002C
See Package Number NDS0002A
Figure 6. TO
Metal Can Package
Bottom View
See Package Number NDT0003A
Figure 7. TO-220
Plastic Package
Front View
See Package Number NDE0003B
Figure 8. 3-Lead SOT-223
Front View
Package Marked N02A
See Package Number DCY0004A
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
7
LM137, LM337-N
SNVS778D – MAY 1999 – REVISED APRIL 2013
www.ti.com
APPLICATION HINTS
When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is
less than or equal to this number.
HEATSINKING SOT-223 PACKAGE PARTS
The SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize
the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.
Figure 9 and Figure 10 show the information for the SOT-223 package. Figure 10 assumes a θ(J−A) of 75°C/W for
1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.
Figure 9. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package
Figure 10. Maximum Power Dissipation vs. TAMB for the SOT-223 Package
Please see AN-1028 (literature number SNVA036) for power enhancement techniques to be used with the SOT223 package.
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
LM137, LM337-N
www.ti.com
SNVS778D – MAY 1999 – REVISED APRIL 2013
Typical Applications
Figure 11. Adjustable Lab Voltage Regulator
Full output current not available
at high input-output voltages
*The 10 μF capacitors are optional to improve ripple rejection
Figure 12. Current Regulator
Figure 13. Negative Regulator with Protection Diodes
*When CL is larger than 20 μF, D1 protects the LM137 in case the input supply is shorted
**When C2 is larger than 10 μF and −VOUT is larger than −25V, D2 protects the LM137 in case the output is shorted
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
9
LM137, LM337-N
SNVS778D – MAY 1999 – REVISED APRIL 2013
www.ti.com
Figure 14. −5.2V Regulator with Electronic Shutdown*
*Minimum output ≃ −1.3V when control input is low
Figure 15. Adjustable Current Regulator
Figure 16. High Stability −10V Regulator
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
LM137, LM337-N
www.ti.com
SNVS778D – MAY 1999 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS
(K Steel and NDE Packages)
Load Regulation
Current Limit
Figure 17.
Figure 18.
Adjustment Current
Dropout Voltage
Figure 19.
Figure 20.
Temperature Stability
Minimum Operating Current
Figure 21.
Figure 22.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
11
LM137, LM337-N
SNVS778D – MAY 1999 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(K Steel and NDE Packages)
12
Ripple Rejection
Ripple Rejection
Figure 23.
Figure 24.
Ripple Rejection
Output Impedance
Figure 25.
Figure 26.
Line Transient Response
Load Transient Response
Figure 27.
Figure 28.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
LM137, LM337-N
www.ti.com
SNVS778D – MAY 1999 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM137 LM337-N
13
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM137H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 150
LM137HP+
LM137H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 150
LM137HP+
LM337H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-40 to 125
LM337H
LM337H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-40 to 125
LM337H
LM337IMP
ACTIVE
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
N02A
LM337IMP/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
N02A
LM337IMPX
ACTIVE
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
-40 to 125
N02A
LM337IMPX/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
N02A
LM337T
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM337T P+
LM337T/LF01
ACTIVE
TO-220
NDG
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
LM337T/NOPB
ACTIVE
TO-220
NDE
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
LM337T P+
-40 to 125
LM337T P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM337IMP
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM337IMP/NOPB
SOT-223
DCY
4
1000
330.0
LM337IMPX
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
16.4
7.0
7.5
2.2
12.0
16.0
LM337IMPX/NOPB
SOT-223
DCY
4
2000
330.0
Q3
16.4
7.0
7.5
2.2
12.0
16.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM337IMP
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM337IMP/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM337IMPX
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM337IMPX/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDG0003F
T03F (Rev B)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
1,80 (0.071) MAX
3
0°–10°
0,10 (0.004) M
0,25 (0.010)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters (inches).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages