MICROCIRCUIT DATA SHEET Original Creation Date: 04/30/96 Last Update Date: 09/17/99 Last Major Revision Date: 04/30/96 MNLM2990-15-X REV 0B0 NEGATIVE LOW DROPOUT REGULATOR General Description The LM2990 is a low dropout, 1 ampere negative voltage regulator available with fixed output voltages of -5, -12, and -15V. The LM2990 uses new circuit design techniques to provide low dropout and low quiescent current. The dropout voltage at 1A load current is typically 0.6V and a guaranteed worst-case maximum of 1V over the entire operating temperature range. The quiescent current is typically 1mA with 1A load current and an input-output voltage differential greater than 3V. A unique circuit design of the internal bias supply limits the quiescent current to only 9mA (typical) when the regulator is in the dropout mode (Vout - Vin < 3V). Output voltage accuracy is guaranteed to +5% over load, and temperature extremes. The LM2990 is short-circuit proof, and thermal shutdown includes hysteresis to enhance the reliability of the device when overloaded for an extended period of time. Industry Part Number NS Part Numbers LM2990 LM2990J-15-QML LM2990WG-15-QML Prime Die LM2990 Controlling Document SEE FEATURES SECTION Processing Subgrp Description MIL-STD-883, Method 5004 1 2 3 4 5 6 7 8A 8B 9 10 11 Quality Conformance Inspection MIL-STD-883, Method 5005 1 Static tests at Static tests at Static tests at Dynamic tests at Dynamic tests at Dynamic tests at Functional tests at Functional tests at Functional tests at Switching tests at Switching tests at Switching tests at Temp ( oC) +25 +125 -55 +25 +125 -55 +25 +125 -55 +25 +125 -55 MICROCIRCUIT DATA SHEET MNLM2990-15-X REV 0B0 Features - 5% output accuracy over entire operating range Output current in excess of 1A Dropout voltage typically 0.6V at 1A load Low quiescent current Internal short circuit current limit Internal thermal shutdown with hysteresis Functional complement to the LM2940 series CONTROLLING DOCUMENT: LM2990J-15-QML 5962-9570901QEA LM2990WG-15-QML 5962-9570901QXA Applications - Post switcher regulator - Local, on-card, regulation - Battery operated equipment 2 MICROCIRCUIT DATA SHEET MNLM2990-15-X REV 0B0 (Absolute Maximum Ratings) (Note 1) Input Voltage -26V to +0.3V Power Dissipation (Note 2, 3) Internally Limited Operating Temperature Range (Tj) -55 C to +125 C Maximum Junction Temperature (Tjmax) 150 C Storage Temperature Range -65 C to +150 C Thermal Resistance ThetaJA CERDIP CERAMIC SOIC (Still Air (500LF/Min (Still Air (500LF/Min @ 0.5 C/W) Air flow @ 0.5 C/W) @ 0.5 C/W) Air flow @ 0.5 C/W) ThetaJC (Note 3) CERDIP CERAMIC SOIC Lead Temperature (Soldering, 10 seconds) Package Weight (Typical) CERDIP CERAMIC SOIC ESD Susceptibility (Note 4) 75 C/W 35 C/W 119 C/W TBD 5 C/W 3 C/W 260 C TBD TBD 2kV Note 1: Note 2: Note 3: Note 4: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax -TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. If this dissipation is exceeded, the die temperature will rise above 125 C, and the LM2990 will eventually go into thermal shutdown at a Tj of approximately 160 C. The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. Human body model, 100pF discharged through a 1.5K Ohms resistor. 3 MICROCIRCUIT DATA SHEET MNLM2990-15-X REV 0B0 Recommended Operating Conditions (Note 1) Maximum Input Voltage (Operational) -26V Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. 4 MICROCIRCUIT DATA SHEET MNLM2990-15-X REV 0B0 Electrical Characteristics DC PARAMETERS (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin = -5V + Vo(NOM), Io = 1A, Co = 47uF. SYMBOL Vo PARAMETER Output Voltage CONDITIONS NOTES 5mA < Io < 1A PINNAME MIN MAX UNIT SUBGROUPS 1 -15.30 -14.70 V 1 1 -15.75 -14.25 V 2, 3 Vrln Line Regulation Io = 5mA, Vo(NOM) -1V > Vin > -26V 1 60 mV 1, 2, 3 Vrld Load Regulation 50mA < Io < 1A 1 70 mV 1 1 100 mV 2, 3 Io = 0.1A, Delta Vo < 100mV 1 0.3 V 1, 2, 3 Io = 1A, Delta Vo < 100mV 1 1 V 1, 2, 3 Io < 1A 1 5 mA 1 1 10 mA 2, 3 Io = 1A, Vin = Vo(NOM) 1 50 mA 1, 2, 3 Rl = 1 Ohm 1, 2 0.75 A 1 1, 2 0.60 A 2, 3 1, 2 1.4 A 1 42 dB 1 uV 1, 2, 3 Vdo Iq Ios Dropout Voltage Quiescent Current Short Circuit Current Imax Maximum Output Current Rr Ripple Rejection Vripple = 1Vrms, Fripple = 1KHz, Io = 5mA 1 Von Output Noise Voltage 10Hz-100Khz, Io = 5mA 1 Note 1: Note 2: 1800 Vo(NOM) is the nominal (typical) regulator output voltage, -5V, -12V or -15V. The short circuit current is less than the maximum output current with the -12V and -15V versions due to internal foldback current limiting. The -5V version, tested with a lower input voltage, does not reach the foldback current limit and therefore conducts a higher short circuit current level. If the LM2990 output is pulled above ground, the maximum allowed current sunk back into the LM2990 is 1.5A. 5 MICROCIRCUIT DATA SHEET MNLM2990-15-X REV 0B0 Graphics and Diagrams GRAPHICS# DESCRIPTION 06324HRB3 CERDIP (J), 16 LEAD (B/I CKT) 06350HRA1 CERAMIC SOIC (WG), 16 LEAD (B/I CKT) J16ARL CERDIP (J), 16 LEAD (P/P DWG) P000100B CERDIP (J), 16 LEAD (PIN OUT) P000383A CERAMIC SOIC (WG), 16 LEAD (PINOUT) WG16ARC CERAMIC SOIC (WG), 16 LEAD (P/P DWG) See attached graphics following this page. 6 N/C 1 16 N/C N/C 2 15 N/C INPUT 3 14 N/C N/C 4 13 N/C GROUND 5 12 N/C OUTPUT 6 11 N/C N/C 7 10 N/C N/C 8 9 N/C LM2990J-XX 16 - LEAD DIP CONNECTION DIAGRAM ( TOP VIEW ) P000100B N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 N/C 1 16 INPUT N/C 2 15 N/C N/C 3 14 N/C GROUND 4 13 N/C N/C 5 12 N/C N/C 6 11 N/C OUTPUT 7 10 N/C N/C 8 9 N/C LM2990WG 16 - LEAD CERAMIC SOIC CONNECTION DIAGRAM TOP VIEW P000383A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 MICROCIRCUIT DATA SHEET MNLM2990-15-X REV 0B0 Revision History Rev ECN # Originator Changes 0A0 M0000594 09/17/99 Rel Date Barbara Lopez Initial Release of: MNLM2990-15-X Rev. 0A0. Added note for power dissipation and reference to thermal resistance for Aluminum Nitride package. 0B0 M0003562 09/17/99 Rose Malone Update MDS: MNLM2990-15-X, Rev. 0A0 to MNLM2990-15-X, Rev. 0B0. Moved reference to Controlling Document to Features Section. Added graphic's reference to WG Pkg to Main Table and Absolute Section and Package Weight heading. 7