TI1 LM385BMX-1.2/NOPB Lm185-1.2-n/lm285-1.2-n/lm385-1.2-n micropower voltage reference diode Datasheet

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode
Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
FEATURES
1
•
•
•
•
•
•
2
•
±1% and 2% Initial Tolerance
Operating Current of 10μA to 20mA
1Ω Dynamic Impedance
Low Temperature Coefficient
Low Voltage Reference—1.235V
2.5V Device and Adjustable Device Also
Available
LM185-2.5 Series and LM185 Series,
respectively
DESCRIPTION
The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are
micropower 2-terminal band-gap voltage regulator
diodes. Operating over a 10μA to 20mA current
range, they feature exceptionally low dynamic
impedance and good temperature stability. On-chip
trimming is used to provide tight voltage tolerance.
Since the LM185-1.2-N band-gap reference uses only
transistors and resistors, low noise and good long
term stability result.
Careful design of the LM185-1.2-N has made the
device exceptionally tolerant of capacitive loading,
making it easy to use in almost any reference
application. The wide dynamic operating range allows
its use with widely varying supplies with excellent
regulation.
The extremely low power drain of the LM185-1.2-N
makes it useful for micropower circuitry. This voltage
reference can be used to make portable meters,
regulators or general purpose analog circuitry with
battery life approaching shelf life.
Further, the wide operating current allows it to
replace older references with a tighter tolerance part.
The LM185-1.2-N is rated for operation over a −55°C
to 125°C temperature range while the LM285-1.2-N is
rated −40°C to 85°C and the LM385-1.2-N 0°C to
70°C. The LM185-1.2-N/LM285-1.2-N are available in
a hermetic TO package and the LM285-1.2-N/LM3851.2-N are also available in a low-cost TO-92 molded
package, as well as SOIC and SOT-23.
CONNECTION DIAGRAM
Figure 1. T0-92 Package (LP)
(Bottom View)
Figure 3. SOIC Package
* Pin 3 is attached to the Die Attach Pad
(DAP) and should be connected to Pin 2 or
left floating.
Figure 2. SOT-23
Figure 4. TO Package (NDV)
(Bottom View)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2) (3)
Reverse Current
30mA
Forward Current
10mA
Operating Temperature Range
(4)
LM185-1.2-N
−55°C to +125°C
LM285-1.2-N
−40°C to +85°C
LM385-1.2-N
ESD Susceptibility
0°C to 70°C
(5)
2kV
−55°C to +150°C
Storage Temperature
Soldering Information
TO-92 package: 10 sec.
260°C
TO package:10 sec.
300°C
SOIC and SOT-23 Pkg.
Vapor phase (60 sec.)
215°C
Infrared (15 sec.)
220°C
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1)
(2)
(3)
(4)
(5)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications
apply only for the test conditions listed.
Refer to RETS185H-1.2 for military specifications.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
For elevated temperature operation, see Table 1.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Table 1. TJ(max) for Elevated Temperature Operation
2
Submit Documentation Feedback
DEVICE
TJ(max) (°C)
LM185-1.2-N
150
LM285-1.2-N
125
LM385-1.2-N
100
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS (1)
LM185-1.2-N
Parameter
Conditions
Typ
LM185BX-1.2-N
LM385B-1.2-N
LM185BY-1.2-N
LM385BX-1.2-N
LM285-1.2-N
LM385BY-1.2-N
LM385-1.2-N
Units
(Limit)
LM285BX-1.2-N
LM285BY-1.2-N
Tested
Limit (2)
(3)
Reverse Breakdown
TA = 25°C,
Voltage
10μA ≤ IR ≤ 20mA
Minimum Operating
Current
Reverse Breakdown
Voltage Change with
Current
1.23
5
Design
Limit (4)
1.223
10
Design
Limit (4)
1.223
1.247
8
Tested
Limit (2)
1
1.5
V(Min)
1.260
15
20
LM385M3-1.2-N
10μA ≤ IR ≤ 1mA
Design
Limit (4)
1.205
1.247
20
Tested
Limit (2)
1
1.5
V(Max)
15
20
μA
10
15
(Max)
1
1.5
mV
(Max)
1mA ≤ IR ≤ 20mA
10
20
20
25
20
25
mV
(Max)
IR = 100μA, f = 20Hz
1
Ω
Wideband Noise
IR = 100μA,
60
μV
(rms)
10Hz ≤ f ≤ 10kHz
Long Term Stability
IR = 100μA, T = 1000 Hr,
20
ppm
Reverse Dynamic
Impedance
TA = 25°C ±0.1°C
Average Temperature
Coefficient
(5)
IR = 100μA
X Suffix
30
30
ppm/°C
Y Suffix
50
50
ppm/°C
All Others
150
150
150
ppm/°C
(Max)
(1)
(2)
(3)
(4)
(5)
Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C.
Production tested.
A military RETS electrical specification is available on request.
Specified by design. Not production tested. These limits are not used to calculate average outgoing quality levels.
The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between
the operating TMAX and TMIN, divided by TMAX − TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.
THERMAL CHARACTERISTICS
Thermal Resistance
θJA (junction to ambient)
θJC (junction to case)
Copyright © 2000–2013, Texas Instruments Incorporated
TO-92
TO
SOIC
SOT-23
180°C/W (0.4″ leads)
170°C/W (0.125″ leads)
440°C/W
165°C/W
283°C/W
N/A
80°C/W
N/A
N/A
Submit Documentation Feedback
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
3
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
4
Reverse Characteristics
Reverse Characteristics
Figure 5.
Figure 6.
Forward Characteristics
Temperature Drift of 3
Representative Units
Figure 7.
Figure 8.
Reverse Dynamic Impedance
Reverse Dynamic Impedance
Figure 9.
Figure 10.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Noise Voltage
Filtered Output Noise
Figure 11.
Figure 12.
Response Time
Figure 13.
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
5
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
www.ti.com
TYPICAL APPLICATIONS
Figure 14. Wide Input Range Reference
Figure 15. Micropower Reference from 9V Battery
Figure 16. Reference from 1.5V Battery
*IQ ≃ 30μA
Figure 17. Micropower* 5V Regulator
6
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
*IQ ≃20μA standby current
Figure 18. Micropower* 10V Reference
Figure 19.
Copyright © 2000–2013, Texas Instruments Incorporated
Figure 20. Precision 1μA to 1mA Current Sources
Submit Documentation Feedback
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
7
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
www.ti.com
METER THERMOMETERS
Calibration
1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1μA/°K
2. Remove short, adjust R2 for correct reading in centigrade
†IQ at 1.3V≃500μA
IQ at 1.6V≃2.4mA
Figure 21. 0°C−100°C Thermometer
Figure 22.
*2N3638 or 2N2907 select for inverse HFE ≃ 5
†Select for operation at 1.3V
‡IQ ≃ 600μA to 900μA
Figure 23. Lower Power Thermometer
8
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
Calibration
1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1.8μA/°K
2. Remove short, adjust R2 for correct reading in °F
Figure 24. 0°F−50°F Thermometer
Adjustment Procedure
1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck
coefficient.
2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.
Figure 25. Micropower Thermocouple Cold Junction Compensator
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
9
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
www.ti.com
Thermocouple
Seebeck
R1
R2
Voltage
Voltage
Type
Coefficient
(Ω)
(Ω)
Across R1
Across R2
@ 25°C
(mV)
(μV/°C)
(mV)
J
52.3
523
1.24k
15.60
14.32
T
42.8
432
1k
12.77
11.78
K
40.8
412
953Ω
12.17
11.17
S
6.4
63.4
150Ω
1.908
1.766
Typical supply current 50μA
Calibration
1. Adjust R1 so that V1 = temp at 1mV/°K
2. Adjust V2 to 273.2mV
†IQ for 1.3V to 1.6V battery voltage = 50μA to 150μA
Figure 26. Centigrade Thermometer
10
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
SCHEMATIC DIAGRAM
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
11
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
12
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM185BYH-1.2
ACTIVE
TO
NDU
2
1000
TBD
Call TI
Call TI
-55 to 125
LM185BYH1.2
LM185BYH-1.2/NOPB
ACTIVE
TO
NDU
2
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 125
LM185BYH1.2
LM185H-1.2
ACTIVE
TO
NDU
2
1000
TBD
Call TI
Call TI
-55 to 125
LM185H1.2
LM185H-1.2/NOPB
ACTIVE
TO
NDU
2
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 125
LM185H1.2
LM285BXM-1.2/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BX
M1.2
LM285BXMX-1.2/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BX
M1.2
LM285BXZ-1.2/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM285BXZ-1.2/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 85
285BX
Z-1.2
LM285BYM-1.2/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BY
M1.2
LM285BYMX-1.2/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BY
M1.2
LM285H-1.2
ACTIVE
TO
NDU
2
1000
TBD
Call TI
Call TI
-40 to 85
LM285H1.2
LM285H-1.2/NOPB
ACTIVE
TO
NDU
2
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-40 to 85
LM285H1.2
LM285M-1.2/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM285
M1.2
LM285MX-1.2/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM285
M1.2
LM285Z-1.2/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 85
LM28
5Z-1.2
LM385BM-1.2
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM385
BM1.2
LM385BM-1.2/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
BM1.2
LM385BMX-1.2
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM385
Addendum-Page 1
285BX
Z-1.2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
BM1.2
LM385BMX-1.2/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
BM1.2
LM385BXM-1.2/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BX
M1.2
LM385BXMX-1.2/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BX
M1.2
LM385BXZ-1.2/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
0 to 70
385BX
Z-1.2
LM385BYM-1.2/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BY
M1.2
LM385BYMX-1.2
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
385BY
M1.2
LM385BYMX-1.2/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BY
M1.2
LM385BYZ-1.2/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
0 to 70
385BY
Z-1.2
LM385BZ-1.2/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
0 to 70
LM385
BZ1.2
LM385M-1.2
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM385
M1.2
LM385M-1.2/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
M1.2
LM385M3-1.2
ACTIVE
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
0 to 70
R11
LM385M3-1.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
R11
LM385M3X-1.2
ACTIVE
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
0 to 70
R11
LM385M3X-1.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
R11
LM385MX-1.2
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM385
M1.2
LM385MX-1.2/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
M1.2
LM385Z-1.2/LFT3
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
Addendum-Page 2
LM385
Z-1.2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
LM385Z-1.2/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM385Z-1.2/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
(4)
LM385
Z-1.2
0 to 70
LM385
Z-1.2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM285BXMX-1.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM285BYMX-1.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM285MX-1.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM385BMX-1.2
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM385BMX-1.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM385BXMX-1.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM385BYMX-1.2
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM385BYMX-1.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM385M3-1.2
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM385M3-1.2/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM385M3X-1.2
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM385M3X-1.2/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM385MX-1.2
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM385MX-1.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM285BXMX-1.2/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM285BYMX-1.2/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM285MX-1.2/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM385BMX-1.2
SOIC
D
8
2500
367.0
367.0
35.0
LM385BMX-1.2/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM385BXMX-1.2/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM385BYMX-1.2
SOIC
D
8
2500
367.0
367.0
35.0
LM385BYMX-1.2/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM385M3-1.2
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM385M3-1.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM385M3X-1.2
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM385M3X-1.2/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM385MX-1.2
SOIC
D
8
2500
367.0
367.0
35.0
LM385MX-1.2/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NDU0002A
H02A (Rev F)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages