NSC LM4872IBP

LM4872
1 Watt Audio Power Amplifier in micro SMD package
General Description
Key Specifications
The LM4872 is a bridge-connected audio power amplifier capable of delivering 1 W of continuous average power to an
8Ω load with less than .2% (THD) from a 5V power supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. Since the LM4872 does not require
output coupling capacitors or bootstrap capacitors. It is optimally suited for low-power portable applications.
The LM4872 features an externally controlled, low-power
consumption shutdown mode, as well as an internal thermal
shutdown protection mechanism.
The unity-gain stable LM4872 can be configured by external
gain-setting resistors.
Typical Application
n Power Output at 0.2% THD
1 W (typ)
n Shutdown Current
0.01 µA (typ)
Features
n
n
n
n
n
micro SMD package (see App. note AN-1112)
5V - 2V operation
No output coupling capacitors or bootstrap capacitors.
Unity-gain stable
External gain configuration capability
Applications
n Cellular Phones
n Portable Computers
n Low Voltage Audio Systems
Connection Diagram
8 Bump micro SMD
DS101230-23
Top View
Order Number LM4872IBP, LM4872IBPX
See NS Package Number BPA08B6B
DS101230-1
FIGURE 1. Typical Audio Amplifier Application Circuit
Boomer ® is a registered trademark of National Semiconductor Corporation.
© 2000 National Semiconductor Corporation
DS101230
www.national.com
LM4872 1 Watt Audio Power Amplifier micro SMD package
February 2000
LM4872
Absolute Maximum Ratings (Note 2)
Soldering Information
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
See AN-1112 ″Micro-SMD Wafers Level Chip Scale
Package″.
Supply Voltage
6.0V
Storage Temperature
Input Voltage
Operating Ratings
−65˚C to +150˚C
−0.3V to VDD +0.3V
Power Dissipation (Note 3)
Internally Limited
ESD Susceptibility (Note 4)
2500V
ESD Susceptibility (Note 5)
Junction Temperature
Temperature Range
TMIN ≤ TA ≤ TMAX
−40˚C ≤ TA ≤ 85˚C
2.0V ≤ VDD ≤ 5.5V
Supply Voltage
250V
150˚C
Electrical Characteristics VDD = 5V
(Notes 1, 2, 9)
The following specifications apply for VDD = 5V and 8Ω Load unless otherwise specified. Limits apply for TA = 25˚C.
LM4872
Symbol
VDD
Parameter
Conditions
Typical
Limit
(Note 6)
(Note 7)
Supply Voltage
Units
(Limits)
2.0
V (min)
5.5
V (max)
IDD
Quiescent Power Supply Current
VIN = 0V, Io = 0A
5.3
7
mA (max)
ISD
Shutdown Current
VPIN1 = VDD
0.01
2
µA (max)
50
mV (max)
VOS
Output Offset Voltage
VIN = 0V
5
Po
Output Power
THD = 0.2% (max); f = 1 kHz
1
W
THD+N
Total Harmonic Distortion+Noise
Po = 0.25 Wrms; AVD = 2; 20 Hz ≤
f ≤ 20 kHz
0.1
%
PSRR
Power Supply Rejection Ratio
VDD = 4.9V to 5.1V
65
dB
Electrical Characteristics VDD = 3.3V
(Notes 1, 2, 9)
The following specifications apply for VDD = 3.3V and 8Ω Load unless otherwise specified. Limits apply for TA = 25˚C.
LM4872
Symbol
Parameter
Conditions
VDD
Supply Voltage
IDD
Quiescent Power Supply Current
ISD
Shutdown Current
VPIN1 = VDD
VOS
Output Offset Voltage
VIN = 0V
Typical
Limit
(Note 6)
(Note 7)
Units
(Limits)
2.0
V (min)
5.5
VIN = 0V, Io = 0A
Po
Output Power
THD = 1% (max); f = 1 kHz
THD+N
Total Harmonic Distortion+Noise
Po = 0.25 Wrms; AVD = 2; 20 Hz ≤
f ≤ 20 kHz
PSRR
Power Supply Rejection Ratio
VDD = 3.2V to 3.4V
4
V (max)
mA (max)
0.01
µA (max)
5
mV (max)
.5
.45
W
0.15
%
65
dB
Electrical Characteristics VDD = 2.6V
(Notes 1, 2, 8, 9)
The following specifications apply for VDD = 2.6V and 8Ω Load unless otherwise specified. Limits apply for TA = 25˚C.
LM4872
Symbol
VDD
IDD
Parameter
Conditions
Typical
Limit
(Note 6)
(Note 7)
Supply Voltage
Quiescent Power Supply Current
www.national.com
VIN = 0V, Io = 0A
2
3.4
Units
(Limits)
2.0
V (min)
5.5
V (max)
mA (max)
LM4872
Electrical Characteristics VDD = 2.6V
(Notes 1, 2, 8, 9)
The following specifications apply for VDD = 2.6V and 8Ω Load unless otherwise specified. Limits apply for TA =
25˚C. (Continued)
LM4872
Symbol
Parameter
Conditions
ISD
Shutdown Current
VPIN1 = VDD
VOS
Output Offset Voltage
VIN = 0V
P0
Output Power ( 8Ω )
Output Power ( 4Ω )
THD+N
PSRR
Typical
Limit
(Note 6)
(Note 7)
Units
(Limits)
0.01
µA (max)
5
mV (max)
THD = 0.3% (max); f = 1 kHz
THD = 0.5% (max); f = 1 kHz
0.25
0.5
W
W
Total Harmonic Distortion+Noise
Po = 0.25 Wrms; AVD = 2; 20 Hz ≤
f ≤ 20 kHz
0.25
%
Power Supply Rejection Ratio
VDD = 2.5V to 2.7V
65
dB
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4872, TJMAX = 150˚C. The
typical junction-to-ambient thermal resistance is 150˚C/W.
Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 5: Machine Model, 220 pF–240 pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Low Voltage Circuit - See Fig. 4
Note 9: Shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA.
External Components Description
Components
(Figure 1)
Functional Description
1.
Ri
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a
high pass filter with Ci at fC= 1/(2π RiCi).
2.
Ci
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a
highpass filter with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components,
for an explanation of how to determine the value of Ci.
3.
Rf
Feedback resistance which sets the closed-loop gain in conjunction with Ri.
4.
CS
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
5.
CB
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
3
www.national.com
LM4872
Typical Performance Characteristics
THD+N vs Frequency
at 5V and 8Ω
THD+N vs Frequency
at 3.3V and 8Ω
DS101230-3
THD+N vs Frequency
at 2.6V and 8Ω
DS101230-6
THD+N vs Frequency
at 2.6V and 4Ω
DS101230-5
THD+N vs Output Power
VDD = 5V
DS101230-4
THD+N vs Output Power
VDD = 3.3V
DS101230-7
www.national.com
DS101230-8
4
(Continued)
THD+N vs
Output Power
2.6V at 8Ω
THD+N vs
Output Power
2.6V at 4Ω
DS101230-9
Output Power vs
Supply Voltage
LM4872
Typical Performance Characteristics
DS101230-10
Output Power vs
Load Resistance
DS101230-11
DS101230-12
Power Dissipation vs
Output Power
VDD = 5V
Power Derating Curve
DS101230-14
DS101230-26
5
www.national.com
LM4872
Typical Performance Characteristics
(Continued)
Power Dissipation vs
Output Power
VDD = 3.3V
Power Dissipation vs
Output Power
VDD = 2.6V
DS101230-27
Clipping Voltage vs
Supply Voltage
DS101230-28
Supply Current vs
Shutdown Voltage
DS101230-15
Frequency Response vs
Input Capacitor Size
DS101230-20
Power Supply
Rejection Ratio
DS101230-17
www.national.com
DS101230-18
6
(Continued)
Open Loop
Frequency Response
Noise Floor
DS101230-19
LM4872
Typical Performance Characteristics
DS101230-16
7
www.national.com
LM4872
duced supply voltage, higher load impedance, or reduced
ambient temperature. The National Reference Design board
using a 5V supply and an 8 ohm load will run in a 110˚C ambient environement without exceeding TJMAX. Internal power
dissipation is a function of output power. Refer to the Typical
Performance Characteristics curves for power dissipation
information for different output powers and output loading.
Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4872 has two operational amplifiers internally, allowing for a few different amplifier configurations. The first amplifier’s gain is externally configurable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of Rf to Ri while
the second amplifier’s gain is fixed by the two internal 10 kΩ
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both amplifiers producing signals identical in magnitude, but out of
phase by 180˚. Consequently, the differential gain for the IC
is
AVD= 2 *(Rf/Ri)
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the device as possible. Typical applications employ a 5V regulator with 10 µF Tantalum or electrolytic capacitor and a 0.1 µF bypass capacitor which aid in
supply stability. This does not eliminate the need for bypassing the supply nodes of the LM4872. The selection of bypass
capacitor, especially CB, is dependent upon PSRR requirements, click and pop performance as explained in the section, Proper Selection of External Components, system
cost, and size constraints.
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configuration where one side of its load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes that
the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing excessive clipping, please refer to the Audio Power Amplifier
Design section.
A bridge configuration, such as the one used in LM4872,
also creates a second advantage over single-ended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased
at half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configuration. Without an output coupling capacitor, the half-supply
bias across the load would result in both increased internal
IC power dissipation and also possible loudspeaker damage.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4872 contains a shutdown pin to externally turn off the
amplifier’s bias circuitry. This shutdown feature turns the amplifier off when a logic high is placed on the shutdown pin.
The trigger point between a logic low and logic high level is
typically half- supply. It is best to switch between ground and
supply to provide maximum device performance. By switching the shutdown pin to VDD, the LM4872 supply current
draw will be minimized in idle mode. While the device will be
disabled with shutdown pin voltages less than VDD, the idle
current may be greater than the typical value of 0.01 µA. In
either case, the shutdown pin should be tied to a stable voltage to avoid unwanted state changes.
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry which provides a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in conjunction
with an external pull-up resistor. When the switch is closed,
the shutdown pin is connected to ground and enables the
amplifier. If the switch is open, then the external pull-up resistor will disable the LM4872. This scheme guarantees that
the shutdown pin will not float thus preventing unwanted
state changes.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or singleended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the LM4872 has two operational amplifiers in one package, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
The maximum power dissipation for a given application can
be derived from the power dissipation graphs or from Equation 1.
PDMAX = 4*(VDD)2/(2π2RL)
(1)
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize device
and system performance. While the LM4872 is tolerant of
external component combinations, consideration to component values must be used to maximize overall system quality.
The LM4872 is unity-gain stable which gives a designer
maximum system flexibility. The LM4872 should be used in
low gain configurations to minimize THD+N values, and
maximize the signal to noise ratio. Low gain configurations
require large input signals to obtain a given output power. Input signals equal to or greater than 1 Vrms are available
from sources such as audio codecs. Please refer to the section, Audio Power Amplifier Design, for a more complete
explanation of proper gain selection.
Besides gain, one of the major considerations is the closedloop bandwidth of the amplifier. To a large extent, the bandwidth is dictated by the choice of external components
It is critical that the maximum junction temperature TJMAX of
150˚C is not exceeded. TJMAX can be determined from the
power derating curves by using PDMAX and the PC board foil
area. By adding additional copper foil, the thermal resistance
of the application can be reduced from a free air value of
150˚C/W, resulting in higher PDMAX. Additional copper foil
can be added to any of the leads connected to the LM4872.
It is especially effective when connected to VDD, GND, and
the output pins. Refer to the application information on the
LM4872 reference design board for an example of good heat
sinking. If TJMAX still exceeds 150˚C, then additional
changes must be made. These changes can include rewww.national.com
8
LM4872
Application Information
AUDIO POWER AMPLIFIER DESIGN
(Continued)
A 1W/8Ω AUDIO AMPLIFIER
shown in Figure 1. The input coupling capacitor, Ci, forms a
first order high pass filter which limits low frequency response. This value should be chosen based on needed frequency response for a few distinct reasons.
Given:
Power Output
Load Impedance
Selection Of Input Capacitor Size
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenuation. But in many cases the speakers used in portable systems, whether internal or external, have little ability to reproduce signals below 100 Hz to 150 Hz. Thus, using a large
input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor,
Ci. A larger input coupling capacitor requires more charge to
reach its quiescent DC voltage (nominally 1/2 VDD). This
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value. Bypass
capacitor, CB, is the most critical component to minimize
turn-on pops since it determines how fast the LM4872 turns
on. The slower the LM4872’s outputs ramp to their quiescent
DC voltage (nominally 1/2 VDD), the smaller the turn-on pop.
Choosing CB equal to 1.0 µF along with a small value of Ci
(in the range of 0.1 µF to 0.39 µF), should produce a virtually
clickless and popless shutdown function. While the device
will function properly, (no oscillations or motorboating), with
CB equal to 0.1 µF, the device will be much more susceptible
to turn-on clicks and pops. Thus, a value of CB equal to
1.0 µF is recommended in all but the most cost sensitive designs.
Input Level
Input Impedance
1 Wrms
8Ω
1 Vrms
20 kΩ
Bandwidth
100 Hz–20 kHz ± 0.25 dB
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Performance Characteristics section, the supply rail can be
easily found. A second way to determine the minimum supply rail is to calculate the required Vopeak using Equation 2
and add the output voltage. Using this method, the minimum
supply voltage would be (Vopeak + (VODTOP + VODBOT)), where
VODBOT and VODTOP are extrapolated from the Dropout Voltage vs Supply Voltage curve in the Typical Performance
Characteristics section.
(2)
Using the Output Power vs Supply Voltage graph for an 8Ω
load, the minimum supply rail is 4.6V. But since 5V is a standard voltage in most applications, it is chosen for the supply
rail. Extra supply voltage creates headroom that allows the
LM4872 to reproduce peaks in excess of 1W without producing audible distortion. At this time, the designer must make
sure that the power supply choice along with the output impedance does not violate the conditions explained in the
Power Dissipation section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equation 3.
(3)
Rf/Ri = AVD/2
From Equation 3, the minimum AVD is 2.83; use AVD = 3.
Since the desired input impedance was 20 kΩ, and with a
AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results in an
allocation of Ri = 20 kΩ and Rf = 30 kΩ. The final design step
is to address the bandwidth requirements which must be
stated as a pair of −3 dB frequency points. Five times away
from a −3 dB point is 0.17 dB down from passband response
which is better than the required ± 0.25 dB specified.
fL = 100 Hz/5 = 20 Hz
LOW VOLTAGE APPLICATIONS ( BELOW 3.0 VDD )
The Lm4872 will function at voltages below 3 volts but this
mode of operation requires the addition of a 1kΩ resistor
from each of the differential output pins ( pins 8 and 4 ) directly to ground. The addition of the pair of 1kΩ resistors ( R4
& R5 ) assures stable operation below 3 Volt Vdd operation.
The addition of the two resistors will however increase the
idle current by as much as 5mA. This is because at 0v input
both of the outputs of the LM4872’s 2 internal opamps go to
1/2 VDD ( 2.5 volts for a 5v power supply ), causing current to
flow through the 1K resistors from output to ground. See fig
4.
Jumper options have been included on the reference design,
Fig. 4, to accommodate the low voltage application. J2 & J3
connect R4 and R5 to the outputs. J1 operates the shutdown
function. J1 must be installed to operate the part. A switch
may be installed in place of J1 for easier evaluation of the
shutdown function.
fH = 20 kHz * 5 = 100 kHz
As stated in the External Components section, Ri in conjunction with Ci create a highpass filter.
Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
The high frequency pole is determined by the product of the
desired frequency pole, fH, and the differential gain, AVD.
With a AVD = 3 and fH = 100 kHz, the resulting GBWP =
150 kHz which is much smaller than the LM4872 GBWP of
4 MHz. This figure displays that if a designer has a need to
design an amplifier with a higher differential gain, the
LM4872 can still be used without running into bandwidth limitations.
9
www.national.com
LM4872
Application Information
(Continued)
HIGHER GAIN AUDIO AMPLIFIER
DS101230-24
Figure 2
possible high frequency oscillations. Care should be taken
when calculating the -3dB frequency in that an incorrect
combination of R3 and C4 will cause rolloff before 20kHz. A
typical combination of feedback resistor and capacitor that
will not produce audio band high frequency rolloff is R3 =
20kΩ and C4 = 25pf. These components result in a -3dB
point of approximately 320 kHz. It is not recommended that
the feedback resistor and capacitor be used to implement a
band limiting filter below 100kHZ.
The LM4872 is unity-gain stable and requires no external
components besides gain-setting resistors, an input coupling
capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential gain of greater
than 10 is required, a feedback capacitor may be needed as
shown in Figure 2 to bandwidth limit the amplifier. This feedback capacitor creates a low pass filter that eliminates
www.national.com
10
DIFFERENTIAL
LM4872
AMPLIFIER
LM4872
Application Information
(Continued)
CONFIGURATION
FOR
DS101230-29
Figure 3
Mono LM4872 Reference Design Board - Assembly Part Number:
980011207-100 Revision: A Bill of Material
Item
Part Number
Part Description
Qty
1
551011208-001
LM4872 Mono Reference
Design Board PCB etch 001
1
Ref Designator
10
482911183-001
LM4872 Audio AMP micro
SMD 8 Bumps
1
U1
20
151911207-001
Cer Cap 0.1uF 50V +80/-20
1
C1
1
C2
1
C3
3
R1, R2, R3
2
R4, R5,
J1, J2, J3
1206
21
151911207-002
Cer Cap 0.39uF 50V Z5U 20
1210
25
152911207-001
Tant Cap 1uF 16V 10
Size=A 3216
30
472911207-001
Res 20K Ohm 1/10W 5
0805
31
472911207-002
Res 1K Ohm 1/10W 5
0805
35
210007039-002
Jumper Header Vertical
Mount 2X1 0.100
3
36
210007582-001
Jumper Shunt 2 position
0.100
3
11
www.national.com
LM4872
Application Information
(Continued)
Silk Screen
Top Layer
DS101230-31
DS101230-30
Bottom Layer
Inner Layer VDD
DS101230-32
DS101230-33
Inner Layer Ground
DS101230-34
www.national.com
12
LM4872
Application Information
(Continued)
REFERENCE DESIGN BOARD and PCB LAYOUT
GUIDELINES
DS101230-25
Figure 4
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A ″Pi-filter″ can be helpful
in minimizing High Frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digital and analog ground traces to minimize noise coupling.
PCB Layout Guidelines
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
″rule-of-thumb″ recommendations and the actual results will
depend heavily on the final layout.
General Mixed Signal Layout Recommendation
Placement of Digital and Analog Components
All digital components and high-speed digital signals traces
should be located as far away as possible from analog components and circuit traces.
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bringing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can have a major impact on low level signal performance. Star trace routing
refers to using individual traces to feed power and ground to
each circuit or even device. This technique will take require
a greater amount of design time but will not increase the final
price of the board. The only extra parts required will be some
jumpers.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces parallel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each
other from the top to the bottom side as much as possible will
minimize capacitive noise coupling and cross talk.
13
www.national.com
LM4872 1 Watt Audio Power Amplifier micro SMD package
Physical Dimensions
inches (millimeters) unless otherwise noted
Note: Unless otherwise specified.
1.
2.
3.
4.
5.
Epoxy coating.
63Sn/37Pb eutectic bump.
Recommend non-solder mask defined landing pad.
Pin 1 is established by lower left corner with respect to text orientation pins are numbered counterclockwise.
Reference JEDEC registration MO-211, variation BC.
8-Bump micro SMD
Order Number LM4872IBP, LM4872IBPX
NS Package Number BPA08B6B
X1 = 1.31 X2 = 1.97 X3 = 0.850
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: [email protected]
www.national.com
National Semiconductor
Europe
Fax: +49 (0) 180-530 85 86
Email: [email protected]
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: [email protected]
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.