TI LM810 Lm809/lm810 3-pin microprocessor reset circuit Datasheet

LM809, LM810
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SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013
LM809/LM810 3-Pin Microprocessor Reset Circuits
Check for Samples: LM809, LM810
FEATURES
DESCRIPTION
•
The LM809/810 microprocessor supervisory circuits
can be used to monitor the power supplies in
microprocessor and digital systems. They provide a
reset to the microprocessor during power-up, powerdown and brown-out conditions.
1
2
•
•
•
•
•
•
Precise Monitoring of 3V, 3.3V, and 5V Supply
Voltages
Superior Upgrade to MAX809/810
Fully Specified Over Temperature
140ms Min. Power-On Reset Pulse Width,
240ms Typical
–
Active-Low RESET Output (LM809)
–
Active-High RESET Output (LM810)
Ensured RESET Output Valid for VCC≥1V
Low Supply Current, 15µA Typ
Power Supply Transient Immunity
APPLICATIONS
•
•
•
•
•
•
Microprocessor Systems
Computers
Controllers
Intelligent Instruments
Portable/Battery-Powered Equipment
Automotive
Connection Diagrams
Top View
Figure 1. 3-Lead
SOT-23-3 Package
See Package Number
DBZ
( ) are for LM810
The function of the LM809/810 is to monitor the VCC
supply voltage, and assert a reset signal whenever
this voltage declines below the factory-programmed
reset threshold. The reset signal remains asserted for
240ms after VCC rises above the threshold. The
LM809 has an active-low RESET output, while the
LM810 has an active-high RESET output.
Seven standard reset voltage options are available,
suitable for monitoring 5V, 3.3V, and 3V supply
voltages.
With a low supply current of only 15µA, the
LM809/810 are ideal for use in portable equipment.
The LM809/LM810 are available in the 3-pin SOT-23
package and in the 6-Lead SON package.
Typical Application Circuit
Top View
Figure 2. 6-Lead
SON Package
See Package Number
NGB0006A
() are for LM810
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM809, LM810
SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013
www.ti.com
Pin Descriptions
PIN
SON
SOT-23
1
1
3
NAME
GND
Ground reference
RESET (LM809)
Active-low output. RESET remains low while VCC is below the reset threshold, and for
240ms after VCC rises above the reset threshold.
RESET (LM810)
Active-high output. RESET remains high while VCC is below the reset threshold, and for
240ms after VCC rises above the reset threshold.
2
5
FUNCTION
3
VCC
Supply Voltage (+5V, +3.3V, or +3.0V)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
−0.3V to 6.0V
VCC
−0.3V to (VCC+ 0.3V)
RESET, RESET
Input Current, VCC Pin
20mA
Output Current, RESET, RESET Pin
20mA
Rate of Rise, VCC
100V/µs
ESD Rating (3)
2kV
Continuous Power Dissipation (4)
Thermal Resistance, θJA
320mW
SON-6
152°C/W
SOT-23-3
326°C/W
−40°C to +105°C
Ambient Temperature Range
Maximum Junction Temperature
125°C
−65°C to +160°C
Storage Temperature Range
Lead Temperature (soldering, 10sec)
(1)
(2)
(3)
(4)
2
+300°C
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which the
device operates correctly. Operating ratings do not imply ensured performance limits. For specified performance limits and associated
test conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
At elevated temperatures, devices must be derated based on package thermal resistance. The device in the SOT-23-3 package must be
derated at 4mW/°C at ambient temperatures above 70°C. The device has internal thermal protection.
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Electrical Characteristics
VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for
4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63/2.45 version (1).
Parameter
VCC Range
Test Conditions
Supply Current
TA = −40°C to +105°C
1.2
5.5
TA = +85°C to
+105°C
LM8_ _ -4.38
LM8_ _ -4.00
Reset Threshold (2)
LM8_ _ -3.08
LM8_ _ -2.93
LM8_ _ -2.63
LM8_ _ -2.45
VCC<5.5V, LM8_ _ 4.63/4.38/4.00
18
60
VCC<3.6V, LM8_ _ 3.08/2.93/2.63/2.45
15
50
VCC<5.5V, LM8_ _ 4.63/4.38/4.00
100
VCC<3.6V, LM8_ _ 3.08/2.93/2.63/2.45
100
TA = +25°C
4.56
TA = −40°C to +85°C
4.50
TA = +85°C to +105°C
4.40
TA = +25°C
4.31
TA = −40°C to +85°C
4.25
TA = +85°C to +105°C
4.16
TA = +25°C
3.93
TA = −40°C to +85°C
3.89
4.10
TA = +85°C to +105°C
3.80
4.20
TA = +25°C
3.04
TA = −40°C to +85°C
3.00
3.15
TA = +85°C to +105°C
2.92
3.23
TA = +25°C
2.89
TA = −40°C to +85°C
2.85
3.00
TA = +85°C to +105°C
2.78
3.08
TA = +25°C
2.59
TA = −40°C to +85°C
2.55
TA = +85°C to +105°C
2.50
TA = +25°C
2.41
TA = −40°C to +85°C
2.38
2.52
TA = +85°C to +105°C
2.33
2.57
Reset Threshold Temperature
Coefficient
VCC to Reset Delay (2)
Reset Active Timeout Period
VOL
RESET Output Voltage Low
(LM809)
(1)
(2)
RESET Output Voltage High
(LM809)
4.63
VCC = VTH to (VTH − 100mV)
Units
V
µA
4.70
4.75
4.86
4.38
4.45
4.50
4.56
4.00
3.08
2.93
2.63
4.06
3.11
V
2.96
2.66
2.70
2.76
2.45
2.49
30
ppm/°C
20
TA = −40°C to +85°C
140
TA = +85°C to +105°C
100
240
µs
560
840
VCC = VTH min, ISINK = 1.2mA, LM8092.45/2.63/2.93/3.08
0.3
VCC = VTH min, ISINK = 3.2mA, LM8094.63/4.38/4.00
0.4
VCC > 1.0V, ISINK = 50µA
VOH
Max
5.5
LM8_ _ -4.63
VTH
Typ
1.0
TA = −40°C to
+85°C
ICC
Min
TA = 0°C to +70°C
ms
V
0.3
VCC > VTH max, ISOURCE = 500µA, LM8092.45/2.63/2.93/3.08
0.8VCC
VCC > VTH max, ISOURCE = 800µA, LM8094.63/4.38/4.00
VCC−1.5
V
Production testing done at TA = +25°C, over temperature limits specified by design only.
RESET Output for LM809, RESET output for LM810.
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Electrical Characteristics (continued)
VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for
4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63/2.45 version(1).
Parameter
4
VOL
RESET Output Voltage Low
(LM810)
VOH
RESET Output Voltage High
(LM810)
Test Conditions
Min
Typ
Max
VCC = VTH max, ISINK = 1.2mA, LM8102.63/2.93/3.08
0.3
VCC = VTH max, ISINK = 3.2mA, LM8104.63/4.38/4.00
0.4
1.8V < VCC < VTH min, ISOURCE = 150μA
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0.8VCC
Units
V
V
Copyright © 1999–2013, Texas Instruments Incorporated
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SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013
Typical Performance Characteristics
Supply Current vs Temperature
(No Load, LM8_ _-2.63/2.93/3.08)
Supply Current vs Temperature
(No Load, LM8_ _-4.63/4.38)
Figure 3.
Figure 4.
Power-Down Reset Delay vs Temp
(LM8_ _-2.63/2.93/3.08)
Power-Down Reset Delay vs Temperature
(LM8_ _-4.63/4.38)
Figure 5.
Figure 6.
Power-Up Reset Timeout vs Temperature
Normalized Reset Threshold vs Temperature
Figure 7.
Figure 8.
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APPLICATIONS INFORMATION
Benefits of Precision Reset Thresholds
A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage.
A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63V and 3.08V
options of the LM809/810 use highly accurate circuitry to ensure that the reset threshold occurs only within this
range (for 5V and 3.3V supplies). The other voltage options have the same tight tolerance to ensure a reset
signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds apply to
3V, 3.3V, and 5V nominal supply voltages.
Table 1. Reset Thresholds Related to Common Supply Voltages
Reset Threshold
3.0V
3.3V
5.0V
4.63 ± 3%
90 - 95%
4.38 ± 3%
85 - 90%
4.00 ± 3%
78 - 82%
3.08 ± 3%
90 - 95%
2.93 ± 3%
86 - 90%
2.63 ± 3%
85 - 90%
77 - 81%
2.45 ± 3%
79 - 84%
72 - 76%
Ensuring a Valid Reset Output Down to VCC = 0V
When VCC falls below 1V, the LM809 RESET output no longer sinks current. A high-impedance CMOS logic
input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100kΩ
resistor should be connected from the RESET output to ground, as shown in Figure 9.
A 100kΩ pull-up resistor to VCC is also recommended for the LM810, if RESET is required to remain valid for VCC
< 1V.
Figure 9. RESET Valid to VCC = Ground Circuit
Negative-Going VCC Transients
The LM809/810 are relatively immune to short negative-going transients or glitches on VCC. Figure 10 shows the
maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In general, as the
magnitude of the transient increases, going further below the threshold, the maximum allowable pulse width
decreases. Typically, for the 4.63V and 4.38V version of the LM809/810, a VCC transient that goes 100mV below
the reset threshold and lasts 20µs or less will not cause a reset pulse. A 0.1 µF bypass capacitor mounted as
close as possible to the VCC pin will provide additional transient rejection.
6
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Figure 10. Maximum Transient Duration without Causing a Reset Pulse vs. Reset Comparator Overdrive
Interfacing to µPs with Bidirectional Reset Pins
Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the
LM809 RESET output. To ensure a correct output on the LM809 even when the microprocessor reset pin is in
the opposite state, connect a 4.7kΩ resistor between the LM809 RESET output and the µP reset pin, as shown
in Figure 11. Buffer the LM809 RESET output to other system components.
Figure 11. Interfacing to Microprocessors with Bidirectional Reset I/O
SON Mounting
The SON package requires special mounting techniques which are detailed in Texas Instruments Application
Note AN-1187. Referring to the section PCB Design Recommendations, it should be noted that the pad style
which should be used with the SON package is the NSMD (non-solder mask defined) type.
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REVISION HISTORY
Changes from Revision C (May 2013) to Revision D
•
8
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM809M3-2.63
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
S3B
LM809M3-2.63/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S3B
LM809M3-2.93
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
S4B
LM809M3-2.93/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S4B
LM809M3-3.08
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
S5B
LM809M3-3.08/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S5B
LM809M3-4.38/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S7B
LM809M3-4.63
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
S8B
LM809M3-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S8B
LM809M3X-2.63/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S3B
LM809M3X-2.93/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S4B
LM809M3X-3.08/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S5B
LM809M3X-4.38/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM809M3X-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S8B
LM810M3-4.63
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
SEB
LM810M3-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
SEB
LM810M3X-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
SEB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
S7B
Samples
PACKAGE OPTION ADDENDUM
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1-Nov-2013
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM809M3-2.63
SOT-23
DBZ
3
1000
178.0
8.4
LM809M3-2.63/NOPB
SOT-23
DBZ
3
1000
178.0
LM809M3-2.93
SOT-23
DBZ
3
1000
178.0
LM809M3-2.93/NOPB
SOT-23
DBZ
3
1000
LM809M3-3.08
SOT-23
DBZ
3
LM809M3-3.08/NOPB
SOT-23
DBZ
LM809M3-4.38/NOPB
SOT-23
DBZ
LM809M3-4.63
SOT-23
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3-4.63/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-2.63/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-2.93/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-3.08/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-4.38/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-4.63/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM810M3-4.63
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM810M3-4.63/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM810M3X-4.63/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM809M3-2.63
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-2.63/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-2.93
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-2.93/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-3.08
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-3.08/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-4.38/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-4.63
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-4.63/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3X-2.63/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-2.93/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-3.08/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-4.38/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-4.63/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM810M3-4.63
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM810M3-4.63/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM810M3X-4.63/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 2
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