LM837 www.ti.com SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 LM837 Low Noise Quad Operational Amplifier Check for Samples: LM837 FEATURES DESCRIPTION • • The LM837 is a quad operational amplifier designed for low noise, high speed and wide bandwidth performance. It has a new type of output stage which can drive a 600Ω load, making it ideal for almost all digital audio, graphic equalizer, preamplifiers, and professional audio applications. Its high performance characteristics also make it suitable for instrumentation applications where low noise is the key consideration. 1 2 • • • • • • High Slew Rate 10 V/μs (typ); 8 V/μs (min) Wide Gain Bandwidth Product 25 MHz (typ); 15 MHz (min) Power Bandwidth 200 kHz (typ) High Output Current ±40 mA Excellent Output Drive Performance >600Ω Low Input Noise Voltage 4.5 nV/√Hz Low Total Harmonic Distortion 0.0015% Low Offset Voltage 0.3 mV The LM837 is internally compensated for unity gain operation. It is pin compatible with most other standard quad op amps and can therefore be used to upgrade existing systems with little or no change. Schematic and Connection Diagrams Figure 1. PDIP Package Top View See Package Number D0014A or NFF0014A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM837 SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Supply Voltage, VCC/VEE ±18V Differential Input Voltage, VID (3) ±30V Common Mode Input Voltage, VIC (3) ±15V Power Dissipation, PD (4) 1.2W (N) 830 mW (M) −40°C to +85°C Operating Temperature Range, TOPR −60°C to +150°C Storage Temperature Range, TSTG Soldering Information PDIP Package Soldering (10 seconds) 260°C SOIC Package Vapor Phase (60 seconds) 215°C Infrared (15 seconds) 220°C ESD rating to be determined. See http://www.ti.com for other methods of soldering surface mount devices. (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication of device performance. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Unless otherwise specified the absolute maximum input voltage is equal to the power supply voltage. For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a thermal resistance, junction to ambient, as follows: LM837N, 90°C/W; LM837M, 150°C/W. (2) (3) (4) DC ELECTRICAL CHARACTERISTICS TA = 25°C, VS = ±15V Symbol Parameter Condition Min RS = 50Ω Typ Max Units 0.3 5 mV 10 200 nA 500 1000 nA VOS Input Offset Voltage IOS Input Offset Current IB Input Bias Current AV Large Signal Voltage Gain RL = 2 kΩ, VOUT = ±10V 90 110 dB VOM Output Voltage Swing RL = 2 kΩ ±12 ±13.5 V RL = 600Ω ±10 ±12.5 V VCM Common Mode Input Voltage ±12 ±14.0 V CMRR Common Mode Rejection Ratio VIN = ±12V 80 100 dB PSRR Power Supply Rejection Ratio VS = 15 ∼ 5, −15 ∼ −5 80 100 IS Power Supply Current RL = ∞, Four Amps 10 dB 15 mA AC ELECTRICAL CHARACTERISTICS TA = 25°C, VS = ±15V Min Typ SR Symbol Slew Rate RL = 600Ω 8 10 V/μs GBW Gain Bandwidth Product f = 100 kHz, RL = 600Ω 15 25 MHz 2 Parameter Condition Submit Documentation Feedback Max Units Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 LM837 www.ti.com SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 DESIGN ELECTRICAL CHARACTERISTICS TA= 25°C, VS=±15V (1) Symbol Parameter Condition Min Typ Max Units PBW Power Bandwidth VO = 25 VP-P, RL = 600Ω, THD < 1% 200 kHz en1 Equivalent Input Noise Voltage JIS A, RS = 100Ω 0.5 μV en2 Equivalent Input Noise Voltage f = 1 kHz 4.5 nV/ √Hz in Equivalent Input Noise Current f = 1 kHz 0.7 pA/ √Hz THD Total Harmonic Distortion AV = 1, VOUT = 3 Vrms, f = 20 ∼ 20 kHz, RL = 600Ω 0.0015 % fU Zero Cross Frequency Open Loop 12 MHz φm Phase Margin Open Loop 45 deg Input-Referred Crosstalk f = 20 ∼ 20 kHz −120 dB 2 μV/°C ΔVOS/Δ T (1) Average TC of Input Offset Voltage The following parameters are not tested or ensured. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 3 LM837 SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 www.ti.com DETAILED SCHEMATIC 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 LM837 www.ti.com SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Maximum Power Dissipation vs Ambient Temperature Normalized Input Bias Current vs Supply Voltage Figure 2. Figure 3. Normalized Input Bias Current vs Ambient Temperature Supply Current vs Supply Voltage Figure 4. Figure 5. Supply Current vs Ambient Temperature Positive Current Limit Figure 6. Figure 7. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 5 LM837 SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) 6 Negative Current Limit Maximum Output Voltage vs Supply Voltage Figure 8. Figure 9. Maximum Output Voltage vs Supply Voltage Maximum Output Voltage vs Ambient Temperature Figure 10. Figure 11. Maximum Output Voltage vs Ambient Temperature Power Bandwidth Figure 12. Figure 13. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 LM837 www.ti.com SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Normalized Slew Rate & Gain Bandwidth vs Supply Voltage (f = 100 kHz) Normalized Slew Rate & Gain Bandwidth (f = 100 kHz) vs Ambient Temperature Figure 14. Figure 15. Voltage Gain vs Supply Voltage Voltage Gain vs Ambient Temperature Figure 16. Figure 17. Power Supply Rejection vs Frequency CMRR vs Frequency Figure 18. Figure 19. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 7 LM837 SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) 8 Open Loop Gain & Phase vs Frequency Total Harmonic Distortion vs Frequency Figure 20. Figure 21. Equivalent Input Noise Voltage vs Frequency Equivalent Input Noise Current vs Frequency Figure 22. Figure 23. Small Signal, Non-Inverting TA = 25°C, AV = 1, RL = 600Ω, VS = ±15V Current Limit TA = 25°C, VS = ±15V, RL = 100Ω, AV = 1 Figure 24. Figure 25. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 LM837 www.ti.com SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Large Signal Non-Inverting TA = 25°C, RL = 600Ω, VS = ±15V Large Signal Inverting TA = 25°C, RL = 600Ω, VS = ±15V Figure 26. Figure 27. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 9 LM837 SNOSBZ6C – MAY 1999 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision B (March 2013) to Revision C • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM837 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM837M ACTIVE SOIC D 14 55 TBD Call TI Call TI -40 to 85 LM837M LM837M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM837M LM837MX ACTIVE SOIC D 14 2500 TBD Call TI Call TI -40 to 85 LM837M LM837MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM837M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM837MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LM837MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM837MX SOIC D 14 2500 367.0 367.0 35.0 LM837MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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