LRC LMBR160FT1G Schottky barrier rectifiers reverse voltage 20 to 200v forward current 1.0a Datasheet

LMBR120FT1G thru LMBR1200FT1G
Schottky Barrier Rectifiers
Reverse Voltage 20 to 200V Forward Current 1.0A
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* Low power loss,high efficiency
* For use in low voltage high frequency inverters,
free wheeling,and polarity protection applications
* Guardring for over voltage protection
* High temperature soldering guaranteed:
260°C/10 seconds at terminals
Mechanical Data
Case: SOD123-FL/MINI SMA
molded plastic over sky die
Terminals: Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0155 g
Handling precautin:None
We declare that the material of product is
Haloggen free (green epoxy compound)
1.Electrical Characteristic
Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
symbol
device marking code
LMBR
LMBR
LMBR
LMBR
120FT1G 130FT1G 140FT1G 150FT1G
LMBR
160FT1G
LMBR
180FT1G
LMBR
LMBR
LMBR
1100FT1G 1150FT1G 1200FT1G
Unit
12
13
14
15
16
18
110
115
120
100
150
200
V
Maximum repetitive peak reverse
voltage
VRRM
20
30
40
50
60
80
Maximum RMS voltage
VRMS
14
21
28
35
42
56
70
105
140
V
Maximum DC blocking voltage
VDC
20
30
40
50
60
80
100
150
200
V
Maximum average forward rectified
current at TA = 75°C
IF(AV)
1.0
A
Peak forward surge current 8.3ms
single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM
30
A
RθJA
RθJC
110
40
°C/W
TJ
–55 to +150
°C
TSTG
–65 to +175
°C
Typical thermal resistance (Note 1)
Operating junction temperature range
storage temperature range
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
symbol
LMBR
LMBR
LMBR
LMBR
120FT1G 130FT1G 140FT1G 150FT1G
LMBR
160FT1G
LMBR
180FT1G
LMBR
LMBR
LMBR
1100FT1G 1150FT1G 1200FT1G
Unit
Maximum instantaneous forward
voltage at(IF = 0.1 A, TJ = 25°C)
(IF = 0.7 A, TJ = 25°C)
(IF = 1.0 A, TJ = 25°C)
VF
Maximum DC reverse current at rated
DC blocking voltage TA = 25°C
Tj = 125°C
IR
0.5
10
mA
Typical junction capacitance at
4.0V, 1MHz
CJ
160
PF
NOTES:
1. 8.0mm2 (.013mm thick) land areas
0.5
0.35
0.45
0.50
0.55
0.7
0.85
0.9
0.92
V
LMBR120FT1G thru LMBR1200FT1G
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Forward Surge Current
60 Hz
Resistive or
Inductive Load
Peak forward surge current (A)
Average Forward Rectified Current (A)
Fig. 1 – Forward Current Derating Curve
1.0
0.5
30
15
0
0
10
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
10
1.0
1.0
0.1
0.1
0.01
0.01
0.2
Fig 5. –typical transient thermal
impedance
Tj=125
Tj=75
Tj=25
0.001
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig 6. – Typical Junction Capacitance
1000
Junction Capacitance (pF)
100
0.4
0.6
0.8
1.0
1.2
Instantaneous Forward Voltage (V)
10
100
Number of Cycles at 60Hz
Fig 4. – Typical Reverse Characteristics
Instantaneous Reverse Current (mA)
Instantaneous Forward Current (A)
100
25 50 75 100 125 150 175
Ambient Temperature, °C
Fig 3. – Typical Instantaneous Forward
Characteristics
1
0
Transient thermal impedance(°C/W)
TJ = TJ max
8.3ms Single Half
Sine-wave
10
1.0
0.1
TJ = 25°C
f = 1.0 MHz
Vsig =
100
10
0.01
0.1
1.0
10
t,Pulse duration,sec
100
0.1
1
Reverse Voltage (V)
10
100
LMBR120FT1G thru LMBR1200FT1G
3. dimension:
SOD123-FL
MILLIMETERS
MIN
MAX
3.5
3.9
0.75
0.95
2.6
3.0
1.6
2.0
0.45Typ
0.9
1.2
0.12
0.22
0.8Typ
DIM
A
B
C
D
E
H
J
K
INCHES
MIN
MAX
0.138
0.159
0.029
0.037
0.103
0.119
0.063
0.079
0.018Typ
0.036
0.047
0.005
0.009
0.032Typ
Suggested solder pad layout
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD123-FL
0.044(1.10
0.040(1.00)
0.079(2.00)
LMBR120FT1G thru LMBR1200FT1G
4.Packing information
Unit:mm
Symbol
tolerance
SOD123-FL
Carrier width
A
0.1
2.00
Carrier length
B
0.1
3.85
Carrier depth
C
0.1
1.10
Sprocket hole
d
0.1
1.50
13" Reel outside diameter
D
2.0
-
13" Reel inner diameter
D1
min
-
Item
7" Reel outside diameter
D
2.0
178.00
7" Reel inner diameter
D1
min
62.00
Feed hole diameter
D2
0.5
13.00
Sprocket hole position
E
0.1
1.75
Punch hole position
F
0.1
3.50
Punch hole pitch
P
0.1
4.00
Spocket hole pitch
P0
0.1
4.00
Embossment center
P1
0.1
2.00
Overall tape thickness
T
0.1
0.23
Tape width
W
0.3
8.00
Reel width
W1
1.0
11.40
LMBR120FT1G thru LMBR1200FT1G
Reel packing
PACKAGE
SOD123-FL
REEL SIZE
7"
REEL
(PCS)
COMPONENT
BOX
INNER BOX
REEL DIA.
CARTON SIZE
CARTON
(pcs)
(mm)
(mm)
(mm)
(PCS)
30,000
183*183*123
178
382*262*387
240,000
SPACING
(mm)
3,000
4.0
5.Suggested thermal profile for soldering process
1. Storage environment:Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(TL to TP)
<3℃/sec
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(ts)
150℃
200℃
60~120sec
Tsmax to TL
- Ramp-up Rate
<3sec
Time maintained above:
- Temperature (TL)
217℃
- Time(tL)
60-260sec
Peak Temperature(TP)
255 -0/+5℃
Time within 5℃ of actual Peak
Temperature(TP)
Ramp-down Rate
Time 25℃ to Peak Temperature
10~30sec
<6℃/sec
<6minutes
APPOX.
GROSS WEIGHT
(kg)
8.7
LMBR120FT1G thru LMBR1200FT1G
6.High reliability test capabilities
Item Test
Condition
Reference
Solder Resistance
at 260±5℃ for 10±2sec immerse
body into solder 1/16" ± 1/32"
MIL-STD-750D METHOD-2031
Solderability
at 245±5℃ for 5 sec
MIL-STD-202F METHOD-208
High Temperature Reverse Bias
VR=80% rate at Tj=150℃ for 168hrs
MIL-STD-750D METHOD-1038
Forward Operation Life
Rated average rectifier current
TA=25℃ for 500hrs
MIL-STD-750D METHOD-1027
Intermittent Operation Life
TA=25℃,IF=IO
On state:power on for 5 min.
Off state:power off for 5 min.
on and off for 500 cycles
MIL-STD-750D METHOD-1036
Pressure Cooker
15PSIG at TA=121℃ for 4hrs
JESD22-A102
Temperature Cycling
-55℃ to +125℃ dwelled for 30 min.
and transferred for 5min. Total 10 cycles
MIL-STD-750D METHOD-1051
Thermal Shock
0℃ for 5min. Rise to 100℃ for 5min.
Total 10 cycles
MIL-STD-750D METHOD-1056
Forward Surge
8.3ms single half sine-wave
superimposed on rated load,one surge
MIL-STD-750D METHOD-4066-2
Humidity
at TA=85℃,RH=85% for 1000hrs
MIL-STD-750D METHOD-1021
High Temperature Storage Life
at 175℃ for 1000hrs
MIL-STD-750D METHOD-1031
LMBR120FT1G thru LMBR1200FT1G
7. Update Record
版次
更新记录
更新作者
更新日期
1
第一版
周杰
2013.04.03
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