LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 LMH6645/46/47 2.7V, 650μA, 55MHz, Rail-to-Rail Input and Output Amplifiers with Shutdown Option Check for Samples: LMH6645, LMH6646, LMH6647 FEATURES DESCRIPTION 1 (VS = 2.7V, TA = 25°C, RL = 1kΩ to V+/2, AV = +1. Typical values unless specified). The LMH™6645 (single) and LMH6646 (dual), rail-torail input and output voltage feedback amplifiers, offer high speed (55MHz), and low voltage operation (2.7V) in addition to micro-power shutdown capability (LMH6647, single). 23 • • • • • • • • • • −3dB BW 55MHz Supply Voltage Range 2.5V to 12V Slew Rate 22V/μs Supply Current 650μA/channel Output Short Circuit Current 42mA Linear Output Current ±20mA Input Common Mode Voltage 0.3V Beyond Rails Output Voltage Swing 20mV from Rails Input Voltage Noise 17nV/√Hz Input Current Noise 0.75pA/√Hz Input common mode voltage range exceeds either supply by 0.3V, enhancing ease of use in multitude of applications where previously only inferior devices could be used. Output voltage range extends to within 20mV of either supply rails, allowing wide dynamic range especially in low voltage applications. Even with low supply current of 650μA/amplifier, output current capability is kept at a respectable ±20mA for driving heavier loads. Important device parameters such as BW, Slew Rate and output current are kept relatively independent of the operating supply voltage by a combination of process enhancements and design architecture. APPLICATIONS • • • • • In portable applications, the LMH6647 provides shutdown capability while keeping the turn-off current to less than 50μA. Both turn-on and turn-off characteristics are well behaved with minimal output fluctuations during transitions. This allows the part to be used in power saving mode, as well as multiplexing applications. Miniature packages (SOT23, VSSOP-8, and SOIC-8) are further means to ease the adoption of these low power high speed devices in applications where board area is at a premium. Active filters High speed portable devices Multiplexing applications (LMH6647) Current sense buffer High speed transducer amp Connection Diagram 5 1 OUTPUT V + 6 1 OUTPUT 5 V - 2 V - 2 + + +IN 3 V + SD - +IN -IN Figure 1. SOT-23-5 (LMH6645) Package Number DBV0005A Top View 3 -IN +IN 4 1 4 -IN Figure 2. SOT-23-6 (LMH6647) Package Number DBV0006A Top View 8 N/C - 2 3 - + 4 V 7 6 N/C + V OUTPUT 5 N/C Figure 3. SOIC-8 (LMH6645) Package Number D0008A Top View 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LMH is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2013, Texas Instruments Incorporated LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 N/C 1 www.ti.com 8 1 SD 8 + V OUT A A -IN 2 7 - + V 2 - + 7 -IN A +IN 3 6 + OUT B OUTPUT 3 6 +IN A - 4 5 V N/C + V Figure 4. SOIC-8 (LMH6647) Package Number D0008A Top View - -IN B B 4 5 +IN B Figure 5. SOIC-8 and VSSOP-8 (LMH6646) Package Numbers D0008A and DGK0008A Top View These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings ESD Tolerance (1) (2) Human Body Machine Model 2KV (3) 200V (4) VIN Differential ±2.5V See (5), (6) Output Short Circuit Duration Supply Voltage (V+ - V−) 12.6V + V +0.8V, V −0.8V Voltage at Input/Output pins −65°C to +150°C Storage Temperature Range Junction Temperature (7) +150°C Soldering Information (1) (2) (3) (4) (5) (6) (7) Infrared or Convection (20 sec) 235°C Wave Soldering (10 sec) 260°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Human body model, 1.5kΩ in series with 100pF. Machine Model, 0Ω in series with 200pF. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. Operating Ratings (1) Supply Voltage (V+ – V−) Temperature Range (2) 2 2.5V to 12V (2) Package Thermal Resistance (1) − −40°C to +85°C (2) (θJA) SOT-23-5 265°C/W SOT-23-6 265°C/W SOIC-8 190°C/W VSSOP-8 235°C/W Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 2.7V Electrical Characteristics Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 2.7V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min Typ 40 55 (1) (2) BW −3dB BW AV = +1, VOUT = 200mVPP, VCM = 0.7V en Input-Referred Voltage Noise f = 100kHz 17 f = 1kHz 25 in Input-Referred Current Noise f = 100kHz 0.75 f = 1kHz 1.20 CT Rej. Cross-Talk Rejection (LMH6646 only) f = 5MHz, Receiver: Rf = Rg = 510Ω, AV = +2 SR Slew Rate AV = −1, VO = 2VPP See (3), (4) TON Max (1) Units MHz nV/√Hz pA/√Hz 47 dB 22 V/μs Turn-On Time (LMH6647 only) 250 ns TOFF Turn-Off Time (LMH6647 only) 560 ns THSD Shutdown Threshold (LMH6647 only) 15 IS ≤ 50μA 1.95 (5) 2.30 V −20 μA ISD Shutdown Pin Input Current (LMH6647 only) See VOS Input Offset Voltage 0V ≤ VCM ≤ 2.7V TC VOS Input Offset Average Drift See IB Input Bias Current VCM = 2.5V (5) 0.40 2 2.2 VCM = 0.5V (5) −0.68 −2 −2.2 1 500 −3 −4 (6) ±1 3 4 μV/°C ±5 0V ≤ VCM ≤ 2.7V mV μA IOS Input Offset Current RIN Common Mode Input Resistance 3 MΩ CIN Common Mode Input Capacitance 2 pF CMVR Input Common-Mode Voltage Range CMRR CMRR ≥ 50dB Common Mode Rejection Ratio −0.5 3.0 2.8 3.2 VCM Stepped from 0V to 2.7V 46 77 VCM Stepped from 0V to 1.55V 58 76 76 74 87 2.55 2.66 AVOL Large Signal Voltage Gain VO = 0.35V to 2.35V VO Output Swing High RL = 1k to V+/2 RL = 10k to V+/2 2.68 Output Swing Low RL = 1k to V+/2 40 RL = 10k to V+/2 20 (1) (2) (3) (4) (5) (6) nA −0.3 −0.1 V dB dB V 150 mV All limits are guaranteed by testing or statistical analysis. Typical values represent the most likely parametric norm. Slew rate is the average of the rising and falling slew rates. Guaranteed based on characterization only. Positive current corresponds to current flowing into the device. Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 3 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com 2.7V Electrical Characteristics (continued) Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 2.7V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. Boldface limits apply at the temperature extremes. Symbol ISC Parameter Conditions Output Short Circuit Current Min (1) Typ (2) Sourcing to V− VID = 200mV (7) (8) 43 Sinking to V+ VID = −200mV 42 (7) (8) Max (1) mA IOUT Output Current VOUT = 0.5V from rails PSRR Power Supply Rejection Ratio V+ = 2.7V to 3.7V or V− = 0V to −1V IS Supply Current (per channel) Normal Operation 650 1250 Shutdown Mode (LMH6647 only) 15 50 (7) (8) 75 Units ±20 mA 83 dB μA Short circuit test is a momentary test. Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. 5V Electrical Characteristics Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 5V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min Typ 40 55 (1) (2) BW −3dB BW AV = +1, VOUT = 200mVPP en Input-Referred Voltage Noise f = 100kHz 17 f = 1kHz 25 in Input-Referred Current Noise f = 100kHz 0.75 f = 1kHz 1.20 CT Rej. Cross-Talk Rejection (LMH6646 only) f = 5MHz, Receiver: Rf = Rg = 510Ω, AV = +2 SR Slew Rate AV = −1, VO = 2VPP See (3), (4) TON Turn-On Time (LMH6647 only) 210 TOFF Turn-Off Time (LMH6647 only) 500 THSD Shutdown Threshold (LMH6647 only) IS ≤ 50μA ISD Shutdown Pin Input Current (LMH6647 only) See VOS Input Offset Voltage 0V ≤ VCM ≤ 5V Max (1) MHz nV/√Hz pA/√Hz 47 15 dB V/μs 22 4.25 Units ns ns 4.60 V (5) −20 −3 −4 (6) TC VOS Input Offset Average Drift See IB Input Bias Current VCM = 4.8V (5) VCM = 0.5V (5) ±1 μA 3 4 μV/C ±5 0V ≤ VCM ≤ 5V mV +0.36 +2 −2.2 −0.68 −2 −2.2 1 500 μA IOS Input Offset Current RIN Common Mode Input Resistance 3 MΩ CIN Common Mode Input Capacitance 2 pF (1) (2) (3) (4) (5) (6) 4 nA All limits are guaranteed by testing or statistical analysis. Typical values represent the most likely parametric norm. Slew rate is the average of the rising and falling slew rates. Guaranteed based on characterization only. Positive current corresponds to current flowing into the device. Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 5V Electrical Characteristics (continued) Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 5V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. Boldface limits apply at the temperature extremes. Symbol CMVR CMRR Parameter Conditions Min (1) CMRR ≥ 50dB Input Common-Mode Voltage Range Common Mode Rejection Ratio Typ Max −0.5 −0.3 −0.1 (2) 5.3 5.1 5.5 VCM Stepped from 0V to 5V 56 82 VCM Stepped from 0V to 3.8V 66 85 76 74 85 4.80 4.95 AVOL Large Signal Voltage Gain VO = 1.5V to 3.5V VO Output Swing High RL = 1k to V+/2 RL = 10k to V+/2 4.98 Output Swing Low RL = 1k to V+/2 50 RL = 10k to V /2 20 Output Short Circuit Current Sourcing to V− VID = 200mV (7) (8) 55 Sinking to V+ VID = −200mV 53 ISC + (1) V dB dB V 200 mV mA (7) (8) IOUT Output Current VOUT = 0.5V From rails PSRR Power Supply Rejection Ratio V+ = 5V to 6V or V− = 0V to −1V IS Supply Current (per channel) Normal Operation 700 1400 Shutdown Mode (LMH6647 only) 10 50 (7) (8) Units 75 ±20 mA 95 dB μA Short circuit test is a momentary test. Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. ±5V Electrical Characteristics Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 5V, V− = −5V, VCM = VO = 0V, Rf = 2kΩ, and RL = 1kΩ to GND. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min Typ 40 55 (1) (2) BW −3dB BW AV = +1, VOUT = 200mVPP en Input-Referred Voltage Noise f = 100kHz 17 f = 1kHz 25 in Input-Referred Current Noise f = 100kHz 0.75 f = 1kHz 1.20 CT Rej. Cross-Talk Rejection (LMH6646 only) f = 5MHz, Receiver: Rf = Rg = 510Ω, AV = +2 SR Slew Rate AV = −1, VO = 2VPP (3) TON TOFF THSD Shutdown Threshold (LMH6647 only) IS ≤ 50μA ISD Shutdown Pin Input Current (LMH6647 only) See VOS Input Offset Voltage −5V ≤ VCM ≤ 5V TC VOS (1) (2) (3) (4) (5) Max (1) Units MHz nV/√Hz pA/√Hz 47 dB 22 V/μs Turn-On Time (LMH6647 only) 200 ns Turn-Off Time (LMH6647 only) 700 ns Input Offset Average Drift See 15 4.25 (4) V 4.60 −20 −3 −4 (5) ±1 ±5 μA 3 4 mV μV/°C All limits are guaranteed by testing or statistical analysis. Typical values represent the most likely parametric norm. Slew rate is the average of the rising and falling slew rates. Positive current corresponds to current flowing into the device. Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 5 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com ±5V Electrical Characteristics (continued) Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 5V, V− = −5V, VCM = VO = 0V, Rf = 2kΩ, and RL = 1kΩ to GND. Boldface limits apply at the temperature extremes. Symbol IB Parameter Conditions Input Bias Current VCM = 4.8V Min (1) Typ Max +0.40 +2 +2.2 −0.65 −2 −2.2 3 500 (2) (4) VCM = −4.5V (4) −5V ≤ VCM ≤ 5V (1) Units μA IOS Input Offset Current RIN Common Mode Input Resistance 3 MΩ CIN Common Mode Input Capacitance 2 pF CMVR Input Common-Mode Voltage Range CMRR ≥ 50dB −5.5 5.3 5.1 CMRR Common Mode Rejection Ratio 5.5 VCM Stepped from −5V to 5V 60 84 VCM Stepped from −5V to 3.5V 66 104 76 74 85 4.70 4.92 AVOL Large Signal Voltage Gain VO = −2V to 2V VO Output Swing High RL = 1kΩ RL = 10kΩ 4.97 Output Swing Low RL = 1kΩ −4.93 RL = 10kΩ −4.98 Output Short Circuit Current Sourcing to V− VID = 200mV (6) (7) 66 Sinking to V+ VID = −200mV 61 ISC IOUT Output Current dB dB V −4.70 VOUT = 0.5V from rails − ±20 Power Supply Rejection Ratio V = 5V to 6V or V = −5V to −6V IS Supply Current (per channel) Normal Operation 725 1600 Shutdown Mode (LMH6647 only) 10 50 6 V mA PSRR (6) (7) V mA (6) (7) + −5.3 −5.1 nA 76 95 dB μA Short circuit test is a momentary test. Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 Typical Performance Characteristics At TJ = 25°C. Unless otherwise specified. Closed Loop Frequency Response for Various Temperature GAIN Frequency Response for Various AV AV = +1 0 25°C 50 AV = +1 GAIN (dB) 0 PHASE PHASE (°) -4 0 PHASE 50 100 100 -40°C VS = ±2.5V AV = +5 VS = ±5V RL = 1K RL = 1k: VOUT = 200mVPP 100k AV = +10 -4 1M 1M 10M FREQUENCY (Hz) 100k 100M 200M 10M FREQUENCY (Hz) Figure 6. 200M Figure 7. Open Loop Gain/Phase vs. Frequency for Various Temperature THD vs. Output Swing 70 -50 RL = 500: f = 100KHz 60 PHASE 50 -55 100 40 80 GAIN 20 60 40 -40°C 20 10 0 AV = +2 -60 THD (dBc) 85°C 85°C 30 PHASE (°) GAIN (dB) PHASE (°) -2 -2 GAIN (dB) AV = +2 GAIN 85°C 0 -65 VS = ±2.5V VS = ±5V -70 0 -40°C -20 VS = ±2.5V -75 RL = 2k 100k 1M 10M -80 100M 1 3 2 FREQUENCY (Hz) Figure 8. 6 7 8 Figure 9. THD vs. Output Swing Output Swing vs. Frequency -30 10 RL = 500: f = 1MHz -35 4 5 VOUT (VPP) AV = +2 -45 VOUT (VPP) THD (dBc) -40 -50 -55 VS = ±5V VS = ±2.5V 1 RL = 500: -60 AV = +2 65 Rf = Rg = 2K VS = ±5V -70 1 2 3 4 VOUT (VPP) 5 6 0.1 100k Figure 10. 1M 10M FREQUENCY (Hz) Figure 11. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 7 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. Settling Time vs. Step Size Noise vs. Frequency 250 10.00 1000 ±0.1% 100 VS = ±2.5V Hz) CURRENT 1.00 100 in (pA/ 150 en (nV/ Hz) SETTLING TIME (ns) 200 RL = 500: 50 VOLTAGE CL = 13pF ±1% AV = -1 0 0 1 2 3 10 10 4 100 STEP AMPLITUDE (VPP) 10 FREQUENCY (Hz) Figure 12. Figure 13. VOUT from V+ vs. ISOURCE VOUT from V− vs. ISINK 40°C VS = 10V 10 VS = 10V 85°C 40°C 85°C VOUT FROM V (V) + 1.0 - VOUT FROM V (V) 0.10 100k 10k 1k 0.1 85°C 1.0 0.1 85°C 25°C 40°C 0.01 .01 .1 -40°C 1 10 ISOURCE (mA) 0.01 .01 100 Figure 15. Output Swing from V+ vs. RL (tied to VS/2) Output Swing from V+ vs. RL (tied to VS/2) 10k 10k T = -40°C AV = +1 AV = +1 VOUT FROM V (mV) T = 25°C 1k 1k + + VOUT FROM V (mV) 100 ISINK (mA) Figure 14. 10V 5V 100 1 0 0 10V 5V 100 2.7V 2.7V 10 500 1k 1.5k RL (:) 2k 2.5k 0 500 Submit Documentation Feedback 1k 1.5k 2k 2.5 k RL (:) Figure 16. 8 10 1 .1 Figure 17. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. Output Swing from V− vs. RL (tied to VS/2) Output Swing from V+ vs. RL (tied to VS/2) 10k T = 25°C AV = +1 AV = +1 VOUT FROM V (mV) T = 85°C 1k 1k - + VOUT FROM V (mV) 10k 10V 5V 100 10V 5V 100 2.7V 2.7V 10 10 0 1.5k 1k 500 2k 500 0 2.5k 1k Figure 18. Output Swing from V− vs. RL (tied to VS/2) 2.5k Output Swing from V− vs. RL (tied to VS/2) 10k T = 85°C AV = +1 AV = +1 VOUT FROM V (mV) T = -40°C 1k - 1k - VOUT FROM V (mV) 2k Figure 19. 10k 10V 5V 100 2.7V 10 0 500 1k 1.5k RL (:) 2k 10V 5V 100 1 00 25k 2.7V 500 1k Figure 20. 10k 2.5k ZOUT vs. Frequency 100 100 CL 10 10 1 4 3 2 CLOSED LOOP GAIN 1 5 VS = ±2.5V 100 AV = +1 ZOUT (:) 1k ts ts (± 1% SETTLING WITH CL) (ns) 200mVPP STEP 30% OVERSHOOT 1 2k 500 10k VS = +5V 1k 1.5k RL (:) Figure 21. Cap Load Tolerance and Setting Time vs. Closed Loop Gain CL (pF) 1.5k RL (:) RL (:) 10 1.0 0.1 0.02 10k 1M 10M 100k FREQUENCY (Hz) Figure 22. 200M Figure 23. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 9 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. PSRR vs. Frequency CMRR vs. Frequency 110 90 +PSRR 100 VS = ±2.5V 90 VS = 5V RF = 10k: 80 RG = 1k: 70 CMRR (dB) PSRR (dB) 80 70 -PSRR 60 50 60 50 40 40 30 30 20 20 10 100 10k 1M 100k FREQUENCY (Hz) 1k 10 1k 10M 100k 10k Figure 24. Figure 25. Crosstalk Rejection vs. Frequency (Output to Output) (LMH6646) VOS Distribution 100 RELATIVE FREQUENCY (%) 90 CT (rej) (dB) 80 70 60 50 40 Receive CH.: AV = +2, Rf = Rg = 510 30 1k 10k 10M 1M FREQUENCY (Hz) 100k 1M 14 13 VS = ±5V 12 11 10 9 8 7 6 5 4 3 2 1 0 -3.5 -2.5 -1.5 x x xxxx x 10M N = 19k UNITS V = 0.46mV x x -0.5 0.5 x 1.5 2.5 3.5 VOS (mV) FREQUENCY (Hz) Figure 26. Figure 27. VOSvs. VS (A Typical Unit) VOS vs. VOUT (A Typical Unit) 0.25 0.2 -40°C 0.15 0.1 -40°C 0.05 25°C 25°C VOS (mV) VOS (mV) 0.05 0.2 0.1 5 0.1 0 -0.05 -0.1 -0.15 85°C -0.2 -0.25 VCM = 0.5V -0.3 1 2 3 4 5 6 7 VS (V) 8 9 10 11 12 0 85° C -0.05 0.1 -0.15 VS = 10V 0.2 RL = 10k: to VS/2 -0.25 0 -2 6 2 4 VOUT (V) Figure 28. 10 Submit Documentation Feedback 8 10 12 Figure 29. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. VOS vs. VOUT (A Typical Unit) VOS vs. VCM (A Typical Unit) 0.6 0.4 VS = 2.7V 0.3 40°C 0.5 -40°C 0.2 25°C 0.1 VOS (mV) VOS (mV) 0.4 25°C 0 85° C -0.1 0. 3 0.2 85°C -0.2 -0.3 0.4 2 0.1 VS = 10V RL = 1k: to VS/2 0 4 2 6 8 10 0 -0.5 12 0.5 1.5 1 VCM (V) Figure 30. Figure 31. VOS vs. VCM (A Typical Unit) 2 2.5 0.6 VS = 10V VS = 5V 0.5 0.4 0.4 VOS (mV) 0.5 -40°C 0.3 0.2 0. 3 -40°C 0.2 25°C 0.1 0.1 0 25°C 0 85°C -0.1 -1 2 1 0 3 4 0.1 -2 6 5 85°C 0 4 2 VCM (V) 6 8 10 12 VCM (V) Figure 32. Figure 33. IB vs. VCM IB vs. VCM 0.6 0.6 85°C VS = 2.7V 85°C VS = ±5V 0.4 0.4 25°C 25°C 0.2 0.2 -40°C -40°C 0 -0.2 IB (µA) 0 IB (µA) 3 VOS vs. VCM (A Typical Unit) 0.6 VOS (mV) 0 VOUT (V) -40°C 25°C -0.2 -0.4 -0.4 -0.6 -0.6 40°C 25°C 85°C -0.8 -0.8 85°C -1 -0.5 -1 0 0.5 1 1.5 2 2.5 3 5 VCM (V) Figure 34. 3 1 -1 VCM (V) 3 5 Figure 35. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 11 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. IB vs. VS -0.50 -0.52 VCM = 0.2V 85°C 0.9 -0.54 IS (mA) (per channel) IB (µA) VS = ±5V 85°C 0.85 -0.56 -0.58 25°C -0.60 -0.62 -0.64 -0.66 0.8 0.75 25°C 0.7 0.65 0.6 0.55 -40°C -0.68 -0.7 IS vs. VCM 0.95 -40°C 0.5 1 3 2 4 6 5 7 0.45 9 10 11 12 8 -7 -5 VS (V) IS (mA) IS (mA) (per channel) 0.7 0.45 0. 41 25°C -40°C 3 4 5 6 7 8 0.9 0. 8 0. 7 0.6 0. 5 0. 4 0. 3 0.2 25°C -40°C 0 0.1 -0.15 0.35 9 10 11 12 VS (V) Figure 38. IS vs. VSHUTDOWN (LMH6647) 85°C 0. 9 0. 8 0. 7 0.6 VS = 5V 0.8 25°C IS (mA) IS (mA) 0.7 -40°C 0.3 0.2 0.1 0 -0.1 -0.5 0.5 3.5 1.5 2.5 VSHUTDOWN (V) Submit Documentation Feedback 2.35 2.85 4.5 5.5 IS vs. VSHUTDOWN (LMH6647) 85°C 25°C 0.5 0.4 -40°C 0.3 0.2 0. 1 0 VS = ±5V 0.1 -6 4 Figure 40. 12 0.85 1.35 1.85 VSHUTDOWN (V) Figure 39. 0.9 0.6 0. 5 0.4 VS = 2.7V 85°C 0.1 VS = ±5V VCM = 0.2V 2 7 5 3 IS vs. VSHUTDOWN (LMH6647) 85°C 0.5 1 Figure 37. IS (mA) vs. Vs(V) 0.65 0. 6 0.55 -1 VCM (V) Figure 36. 0. 9 0.85 0. 8 0.75 -3 2 0 2 VSHUTDOWN (V) 4 6 Figure 41. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. Shutdown Pin and Supply Current vs. Shutdown Voltage 1000 Small Signal Step Response -100 85°C -40°C IVCC (µA) 100 -10 IVCC 1 0 SHUTDOWN PIN CURRENT -1 85°C ISHUTDOWN PIN (P$) 25°C VS = ±5V RL = 1k: AV = +1 -40°C VS = ±2.5V 1 1.5 -3.5 -2.5 -1.5 -0.5 0.5 VSHUTDOWN (V) VOUT = 0.2VPP 25°C 2.5 -0.1 3.5 40 mV/ DIV 20 ns/DIV Figure 42. Figure 43. Large Signal Step Response Large Signal Step Response VS = 2.7V, RL = 1k: VS = 5V VOUT = 1VPP, AV = +1 RL = 1k: VOUT = 1VPP AV = -1 0.2 V/DIV Figure 44. 40 ns/ DIV 40 ns/DIV 0.2 V/DIV Figure 45. Output Overload Recovery INPUT OUTPUT VS = ±2.5V, AV = +2 RL = 1k: RF = RG = 2k: 1 V/DIV 400 ns/DIV Figure 46. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 13 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com APPLICATION NOTES CIRCUIT DESCRIPTION The LMH6645/6646/6647 family is based on proprietary VIP10 dielectrically isolated bipolar process. This device family architecture features the following: • Complimentary bipolar devices with exceptionally high ft (∼8GHz) even under low supply voltage (2.7V) and low Collector bias current. • Rail-to-Rail input which allows the input common mode voltage to go beyond either rail by about 0.5V typically. • A class A-B “turn-around” stage with improved noise, offset, and reduced power dissipation compared to similar speed devices (patent pending). • Common Emitter push-pull output stage capable of 20mA output current (at 0.5V from the supply rails) while consuming only ∼700μA of total supply current per channel. This architecture allows output to reach within milli-volts of either supply rail at light loads. • Consistent performance from any supply voltage (2.7V-10V) with little variation with supply voltage for the most important specifications (e.g. BW, SR, IOUT, etc.) APPLICATION HINTS The total input common mode voltage range, which extends from below V− to beyond V+, is covered by both a PNP and a NPN stage. The NPN stage is switched on whenever the input is less than 1.2V from V+ and the PNP stage covers the rest of the range. In terms of the input voltage, there is an overlapping region where both stages are processing the input signal. This region is about 0.5V from beginning to the end. As far as the device application is concerned, this transition is a transparent operation. However, keep in mind that the input bias current value and direction will depend on which input stage is operating (see Figure 34, 35, and 36 for plots). For low distortion applications, it is best to keep the input common mode voltage from transversing this transition point. Low gain settling applications, which generally encounter larger peak-to-peak input voltages, could be configured as inverting stages to eliminate common mode voltage fluctuations. In terms of the output, when the output swing approaches either supply rail, the output transistor will enter a Quasi-saturated state. A subtle effect of this operational region is that there is an increase in supply current in this state (up to 1mA). The onset of Quasi-saturation region is a function of output loading (current) and varies from 100mV at no load to about 1V when output is delivering 20mA, as measured from supplies. Both input common mode voltage and output voltage level effect the supply current (see Figure 37 and 38. for plot). With 2.7V supplies and a common mode input voltage range that extends beyond either supply rail, the LMH6645/6646/6647 family is well suited to many low voltage/low power applications. Even with 2.7V supplies, the −3dB BW (@ AV = +1) is typically 55MHz with a tested limit of 45MHz. Production testing guarantees that process variations will not compromise speed. This device family is designed to avoid output phase reversal. With input over-drive, the output is kept near the supply rail (or as close to it as mandated by the closed loop gain setting and the input voltage). Figure 47, below, shows the input and output voltage when the input voltage significantly exceeds the supply voltages: INPUT OUTPUT VS = ±2.5V, RL = 10k: AV = +1 2 V/DIV 10.0 µs/DIV Figure 47. Input/Output Shown with Exceeded Input CMVR 14 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 As can be seen, the output does not exhibit any phase reversal as some op amps do. However, if the input voltage range is exceeded by more than a diode drop beyond either rail, the internal ESD protection diodes will start to conduct. The current flow in these ESD diodes should be externally limited. LMH6647 MICRO-POWER SHUTDOWN The LMH6647 can be shutdown to save power and reduce its supply current to less than 50μA guaranteed, by applying a voltage to the SD pin. The SD pin is “active high” and needs to be tied to V− for normal operation. This input is low current (<20μA, 4pF equivalent capacitance) and a resistor to V− (≤20kΩ) will result in normal operation. Shutdown is guaranteed when SD pin is 0.4V or less from V+ at any operating supply voltage and temperature. In the shutdown mode, essentially all internal device biasing is turned off in order to minimize supply current flow and the output goes into Hi-Z (high impedance) mode. Complete device Turn-on and Turn-off times vary considerably relative to the output loading conditions, output voltage, and input impedance, but is generally limited to less than 1μs (see tables for actual data). During shutdown, the input stage has an equivalent circuit as shown below in Figure 48. INVERTING INPUT RS 200-400: D4 D1 D3 D2 NON-INVERTING INPUT Figure 48. LMH6647 Equivalent Input in Shutdown Mode As can be seen above, in shutdown, there may be current flow through the internal diodes shown, caused by input potential, if present. This current may flow through the external feedback resistor and result in an apparent output signal. In most shutdown applications the presence of this output is inconsequential. However, if the output is “forced” by another device such as in a multiplexer, the other device will need to conduct the current described in order to maintain the output potential. To keep the output at or near ground during shutdown when there is no other device to hold the output low, a switch (transistor) could be used to shunt the output to ground. Figure 49 shows a circuit where a NPN bipolar is used to keep the output near ground (∼80mV): 5V - VOUT LMH6647 VIN + SD V SHUTDOWN INPUT - Q1 RS 10k Figure 49. Active Pull-Down Schematic Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 15 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com Figure 50 shows the output waveform. VOUT VS = 5V AV = +1 VIN = 3.5VPP SD 2.00 µs/DIV 2 V/DIV Figure 50. Output Held Low by Active Pull-Down Circuit If bipolar transistor power dissipation is not tolerable, the switch could be by a N-channel enhancement mode MOSFET. 2.7V SINGLE SUPPLY RRIO 2:1 MUX The schematic show in Figure 51 will function as a 2:1 MUX operating on a single 2.7V power supply, by utilizing the shutdown feature of the LMH6647: 1/5 74HC04 1/5 74HC04 SELECT INPUT 2k 2k 2.7V - SHUTDOWN LMH6647 + INPUT A RL 2.7V SHUTDOWN + INPUT B LMH664 7 - 2k 2k Figure 51. 2:1 MUX Operating off a 2.7V Single Supply Figure 52 shows the MUX output when selecting between a 1MHz sine and a 250KHz triangular waveform. 16 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970C – JUNE 2001 – REVISED APRIL 2013 VOUT SELECT 1 V/DIV 1 µs/DIV Figure 52. 2:1 MUX Output As can be seen in Figure 52, the output is well behaved and there are no spikes or glitches due to the switching. Switching times are approximately around 500ns based on the time when the output is considered “valid”. PRINTED CIRCUIT BOARD LAYOUT, COMPONENT VALUES SELECTION, AND EVALUATION BOARDS Generally, a good high-frequency layout will keep power supply and ground traces away from the inverting input and output pins. Parasitic capacitances on these nodes to ground will cause frequency response peaking and possible circuit oscillations (see Application Note OA-15 for more information). Another important parameter in working with high speed/high performance amplifiers, is the component values selection. Choosing large valued external resistors, will effect the closed loop behavior of the stage because of the interaction of these resistors with parasitic capacitances. These capacitors could be inherent to the device or a by-product of the board layout and component placement. Either way, keeping the resistor values lower, will diminish this interaction. On the other hand, choosing very low value resistors could load down nodes and will contribute to higher overall power dissipation. National Semiconductor suggests the following evaluation boards as a guide for high frequency layout and as an aid in device testing and characterization: Device Package Evaluation Board PN LMH6645MF SOT-23-5 CLC730068 LMH6645MA 8-Pin SOIC CLC730027 LMH6646MA 8-Pin SOIC CLC730036 LMH6646MM 8-Pin VSSOP CLC730123 LMH6647MA 8-Pin SOIC CLC730027 LMH6647MF SOT-23-6 CLC730116 These free evaluation boards are shipped when a device sample request is placed with National Semiconductor. LMH6647 Evaluation For normal operation, tie the SD pin to V−. Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 17 LMH6645, LMH6646, LMH6647 SNOS970C – JUNE 2001 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 18 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 17 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMH6645MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 45MA LMH6645MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 45MA LMH6645MF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 A68A LMH6645MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A68A LMH6645MFX NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 85 A68A LMH6645MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A68A LMH6646MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 46MA LMH6646MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 46MA LMH6646MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 A70A LMH6646MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A70A LMH6646MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A70A LMH6647MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 47MA LMH6647MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 47MA LMH6647MF NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 85 A69A LMH6647MF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A69A LMH6647MFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A69A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMH6645MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6645MF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6645MFX SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6646MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6647MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6647MF SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6647MF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6647MFX/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH6645MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6645MF SOT-23 DBV 5 1000 210.0 185.0 35.0 LMH6645MFX SOT-23 DBV 5 3000 210.0 185.0 35.0 LMH6646MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6647MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6647MF SOT-23 DBV 6 1000 210.0 185.0 35.0 LMH6647MF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LMH6647MFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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