TI LP38798SDX-ADJ/NOPB Lp38798-adj high psrr, ultra low noise, 800 ma linear voltage regulator for rf/analog circuit Datasheet

Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
LP38798-ADJ High PSRR, Ultra Low Noise, 800 mA Linear Voltage Regulator for
RF/Analog Circuits
FEATURES
DESCRIPTION
•
The LP38798-ADJ is a high performance linear
regulator capable of supplying 800 mA output current.
Designed to meet the requirements of sensitive
RF/Analog circuitry, the LP38798-ADJ implements a
novel linear topology on an advanced CMOS process
to deliver ultra-low output noise and high PSRR at
switching
power
supply
frequencies.
The
LP38798SD-ADJ is stable with both ceramic and
tantalum output capacitors and requires a minimum
output capacitance of only 1 µF for stability.
1
•
•
•
•
•
•
•
Ultra-Low Output Noise: 5 µVRMS (10Hz to 100
kHz)
High PSRR: 90 dB at 10 kHz, 60 dB at 100 kHz
Wide Operating Input Voltage Range: 3.0V to
20V
±1.0% Output Voltage Initial Accuracy (TJ =
25°C)
Very Low Dropout : 200 mV (Typical) at 800mA
Stable with Ceramic or Tantalum Output
Capacitors
Excellent Line and Load Transient Response
Current Limit and Over-Temperature
Protection
The LP38798-ADJ can operate over a wide input
voltage range (3.0V to 20V) making it well suited for
many post-regulation applications.
The LP38798-ADJ is available in a 12-Lead WSON
package (4.0 x 4.0 x 0.8 mm) with Thermal Pad.
APPLICATIONS
•
•
•
•
RF and VCO Power
Wireless LAN Devices
Wireless Cable Modems
Low Noise Post-Regulation
Typical Application Circuit
1
VIN
2
3
+
VEN
IN
OUT
IN
OUT
IN(CP)
OUT(FB)
12
VOUT
11
10
COUT
LP38798-ADJ
CIN
4
CP
SET
EN
FB
9
CCP
R1
5
8
ON
OFF
6
7
GND(CP)
R2
GND
DAP
GND
GND
*.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
Connection Diagram
Top View
IN
1
2
3
CP
4
EN
5
GND(CP)
6
Exposed Pad
on Bottom
(DAP)
LP38798SD
IN
IN(CP)
12 OUT
11 OUT
10 OUT(FB)
9
SET
8
FB
7
GND
Connect WSON DAP to GND at Pins 6 and 7
Figure 1. LP38798SD-ADJ
12-Lead WSON Package (Top View)
PIN DESCRIPTIONS
Pin
Name
Function
1, 2
IN
3
IN(CP)
Device unregulated input voltage pins. Connect pins together at the package.
Charge pump input voltage pin. Connect directly to pins 1 and 2 at the package.
4
CP
Charge pump output. See Charge Pump section in the Applications Information
for more information.
5
EN
Enable pin. A Logic high level is required on this pin to enable the LDO output.
A Logic low level will turn the output off and reduce the operating current of the
device. See Enable Input Operation section in the Applications Information for
more information.
6
GND
Device charge pump ground pin.
7
GND
Device analog ground pin.
8
FB
9
SET
10
OUT(FB)
OUT buffer feedback pin. Connect directly to pins 11 and 12 at the package.
11, 12
OUT
Device regulated output voltage pins. Connect pins together at the package.
Exposed Pad
DAP
The exposed die attach pad on the bottom of the package should be connected
to a thermal pad at ground potential. See 12-Lead WSON Package Thermal
Considerations section in the APPLICATIONS INFORMATION for more
information.
Feedback pin for programming the output voltage.
Internally filtered pre-buffered output. A feedback resistor divider network from
this pin to FB and GND will set the output voltage of the device.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
2
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
ABSOLUTE MAXIMUM RATINGS (1)
IN
–0.3V to 22V
OUT
–0.3V to VIN +0.3V
FB, EN
–0.3V to 6.0V
Storage Temperature Range
–65°C to +150°C
Soldering (2)
260°C, 10 sec
ESD Rating (HBM) (3)
2 kV
Power Dissipation (4)
Internally Limited
IOUT (Survival)
Internally Limited
(1)
(2)
(3)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate
the conditions at which the device is functional and the device should not be operated beyond such conditions.
Peak Reflow Temperatures for Surface Mount devices are defined in “Absolute Maximum Ratings for Soldering,” Literature Number:
SNOA549C
The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5 kΩ; resistor into each pin. Applicable test standard is
JESD-22-A114-C.
The value of θJ−A for the WSON package is dependent on PCB copper area, copper thickness, the number of copper layers in the PCB,
and the number of thermal vias under the exposed thermal pad (DAP). Exceeding the maximum allowable power dissipation will cause
excessive die temperature, and the regulator may go into thermal shutdown. See 12-Lead WSON Package Thermal Considerations in
the Applications Information.
OPERATING RATINGS (1)
Input Voltage, VIN
3.0V to 20.0V
Output Voltage, VOUT
1.2V to (VIN – VDO)
Enable Voltage, VEN
0.0V to 5.0V
Junction Temperature, TJ
(1)
–40°C to +125°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate
the conditions at which the device is functional and the device should not be operated beyond such conditions.
3
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating junction temperature (TJ)
range of –40°C to +125°C. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for
reference purposes only. Minimum and Maximum limits are specified through test, design, or statistical correlation. Unless
otherwise stated the following conditions apply: VIN = 5.5 V, VSET = 5.0 V, CCP= 10 nF X7R, CIN = 10 μF 50 mΩ Tantalum,
COUT = 10 μF X7R MLCC, IOUT = 10 mA, and TJ = 25°C.
Symbol
Parameter
VFB
Feedback Voltage
VOS
VOUT – VSET
IFB
Feedback Pin Current
ISET
SET Pin Internal Current
Sink
ΔVOUT / ΔVIN Line Regulation (1)
1.212
1.224
16.0
mV
1
µA
VIN = 3.0 V, VSET = 2.5 V
-
46
-
VIN = 5.5 V, VSET = 5.0 V
25.2
52
67.8
VIN = 12.5 V, VSET = 12.0 V
-
71
-
5.5 V ≤ VIN ≤ 20.0 V
IOUT = 10 mA
-
0.005
-
%/V
-
-0.2
-
%/A
IOUT = 800 mA
Undervoltage Lock-Out
VIN Rising until output is on
UVLO Hysteresis
-
200
420
mV
2.65
2.83
V
VIN Falling from > UVLO threshold until
output is off
-
180
-
mV
IOUT = 800 mA
-
1.4
2.25
VIN = 20.0 V, IOUT = 800 mA
-
1.6
2.51
Ground Pin Current,
Quiescent (4)
IOUT = 0 mA
-
1.4
2.1
VIN = 20.0 V, IOUT = 0 mA
-
1.5
2.2
ISD
Ground Pin Current,
Shutdown (4)
VEN = 0.0 V
-
9
20
VIN = 20.0 V, VEN = 0.0 V
-
12
40
ISC
Short Circuit Current
RLOAD = 0Ω
850
1200
1600
-
2.8
-
VIN = 20.0V
-
2.3
-
From VEN > VEN(ON) to VOUT ≥ 98% of
VOUT(NOM)
-
155
300
VOUT = 1.2 V, f = 10 kHz
-
110
-
VOUT = 5.0 V, f = 10 kHz
-
90
-
VOUT = 1.2 V, f = 100 kHz
-
90
-
VOUT = 5.0 V, f = 100 kHz
-
60
-
VOUT = 1.2 V, f = 1 MHz
-
70
-
VOUT = 5.0 V, f = 1 MHz
-
60
-
VCP – VIN
tSTART
Start-up Time
Power Supply Rejection
Ratio
μA
2.47
IQ
ΔVCP
V
0
Dropout Voltage (3)
PSRR
(4)
1.2
Units
3.5
VDO
Ground Pin Current (4)
1.176
Max
-
VIN = 5.5 V
10 mA ≤ IOUT ≤ 800 mA
IGND
Typical
0
VFB = 1.2 V
Load Regulation (2)
ΔUVLO
Min
1.188
5.5 V ≤ VIN ≤ 20.0 V
ΔVOUT /
ΔIOUT
UVLO
(1)
(2)
(3)
Conditions
mA
mA
µA
mA
V
µs
dB
Line Regulation: % change in VOUT(NOM) for every 1V change in VIN= (( ΔVOUT / VOUT(NOM)) / ΔVIN ) x 100%
Load Regulation: % change in VOUT(NOM) for every 1A change in IOUT = (( ΔVOUT / VOUT(NOM) ) / ΔIOUT ) x 100%
Dropout voltage (VDO) is defined as the differential voltage measured between VOUT and VIN when VIN, falling from VIN = VOUT + 1V,
causes VOUT to drop 2% below the value measured with VIN = VOUT + 1V. Dropout voltage specification does not apply when the
programmed output voltage is below the Minimum Operating Input Voltage.
Ground pin current is the sum of the current in both GND pins (Pin 4 + Pin 5) only, and does not include current from the SET pin.
4
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS (continued)
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating junction temperature (TJ)
range of –40°C to +125°C. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for
reference purposes only. Minimum and Maximum limits are specified through test, design, or statistical correlation. Unless
otherwise stated the following conditions apply: VIN = 5.5 V, VSET = 5.0 V, CCP= 10 nF X7R, CIN = 10 μF 50 mΩ Tantalum,
COUT = 10 μF X7R MLCC, IOUT = 10 mA, and TJ = 25°C.
Symbol
eN
Parameter
Output Noise Voltage
(RMS)
Conditions
Min
Typical
Max
Units
VIN = 3.0 V, VOUT = 1.2 V
COUT = 1 µF X7R
BW = 10 Hz to 100 kHz
-
4.96
-
VIN = 3.0 V, VOUT = 1.2 V
BW = 10 Hz to 100 kHz
-
5.21
-
VIN = 3.0 V, VOUT = 1.2 V
BW = 10 Hz to 10 MHz
-
11.53
-
VIN = 6.0 V, VOUT = 5.0 V
COUT = 1 µF X7R
BW = 10 Hz to 100 kHz
-
5.38
-
VIN = 6.0 V, VOUT = 5.0 V
BW = 10 Hz to 100 kHz
-
5.43
-
VIN = 6.0 V, VOUT = 5.0 V
BW = 10 Hz to 10 MHz
-
11.58
-
1.14
1.24
1.34
V
µV(RMS)
ENABLE INPUT
VEN(ON)
Enable ON Threshold
Voltage
VEN rising from 500 mV until Output is
ON
ΔVEN
Enable Threshold Voltage
VEN Falling from VEN(ON)
Hysteresis
-
110
-
mV
IEN(IL)
EN Pin Pull-up Current
VEN = 500 mV
-
2
3.0
µA
IEN(IH)
EN Pin Pull-up Current
VEN = 2.0 V
-
2
3.0
µA
Enable Pin Clamp
Voltage
EN pin = Open
-
5.0
-
V
VEN(CLAMP)
Thermal Shutdown
TSD
Thermal Shutdown
Junction Temperature (TJ) Rising
-
170
-
ΔTSD
Thermal Shutdown
Hysteresis
Junction Temperature (TJ) Falling from
TSD
-
12
-
°C
5
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
120
120
110
110
100
100
90
90
80
80
PSRR (dB)
PSRR (dB)
Unless otherwise specified: VIN = 5.5V, VOUT = 5.0 V, IOUT = 10 mA, COUT = 10 µF MLCC 16V X7R, TJ = 25°C.
70
60
10 mA
50
100 mA
40
20
VIN = 5.5 V
VOUT = 5.0 V
COUT = 10 µF MLCC
400 mA
10
60
10 mA
50
100 mA
40
200 mA
30
70
800 mA
30
200 mA
20
400 mA
10
0
800 mA
0
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
10
100
10k
100k
1M
FREQUENCY (Hz)
10M
C008
Figure 3. PSRR, VIN = 6.0 V, VOUT = 5.0 V
1
1
Cout = 1 µF
Cout = 1 µF
Cout = 10 µF
Cout = 10 µF
OUTPUT NOISE (µV¥Hz)
OUTPUT NOISE (µV¥Hz)
1k
C007
Figure 2. PSRR, VIN = 5.5V, VOUT = 5.0V
0.1
0.01
VIN = 3.0 V
VOUT = 1.2 V
IOUT = 500 mA
0.001
0.1
0.01
VIN = 6.0 V
VOUT = 5.0 V
IOUT = 500 mA
0.001
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
10
100
110
100
100
90
90
80
80
PSRR (dB)
120
70
VOUT = 5.0 V
COUT = 10 µF MLCC
IOUT = 10 mA
40
100k
1M
10M
C010
Figure 5. Noise Density, VOUT = 5.0 V
110
50
10k
FREQUENCY (Hz)
120
60
1k
C009
Figure 4. Noise Density, VOUT = 1.2 V
PSRR (dB)
VIN = 6.0 V
VOUT = 5.0 V
COUT = 10 µF MLCC
70
VOUT = 5.0 V
COUT = 10 µF MLCC
IOUT = 100 mA
60
50
40
30
30
20
Vin = 5.5V
20
10
Vin = 6.0V
10
0
Vin = 5.5V
Vin = 6.0V
0
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
10
100
Figure 6. PSRR, VOUT = 5.0 V, IOUT = 10 mA
1k
10k
100k
1M
FREQUENCY (Hz)
C001
10M
C002
Figure 7. PSRR, VOUT = 5.0 V, IOUT = 100 mA
6
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
120
120
110
110
100
100
90
90
80
80
PSRR (dB)
PSRR (dB)
Unless otherwise specified: VIN = 5.5V, VOUT = 5.0 V, IOUT = 10 mA, COUT = 10 µF MLCC 16V X7R, TJ = 25°C.
70
VOUT = 5.0 V
COUT = 10 µF MLCC
IOUT = 200 mA
60
50
40
70
VOUT = 5.0 V
COUT = 10 µF MLCC
IOUT = 400 mA
60
50
40
30
30
20
Vin = 5.5V
20
Vin = 5.5V
10
Vin = 6.0V
10
Vin = 6.0V
0
0
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
10
110
100
100
90
90
80
80
PSRR (dB)
PSRR (dB)
120
110
70
VOUT = 5.0 V
COUT = 10 µF MLCC
IOUT = 800 mA
40
100k
1M
10M
C004
70
VIN = 5.5 V
VOUT = 5.0 V
IOUT = 800 mA
60
50
40
30
30
20
20
Vin = 5.5V
10
Cout = 10 µF
10
Vin = 6.0V
0
Cout = 50 µF
0
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
C005
Figure 10. PSRR, VOUT = 5.0 V, IOUT = 800 mA
10M
C006
Figure 11. PSRR, VOUT = 5.0 V, IOUT= 800mA
3.0
1.40
2.9
Rising VIN (ON)
2.8
ENABLE THRESHOLDS (V)
UVLO THRESHOLDS (V)
10k
Figure 9. PSRR, VOUT = 5.0 V, IOUT = 400 mA
120
50
1k
FREQUENCY (Hz)
Figure 8. PSRR, VOUT = 5.0 V, IOUT = 200 mA
60
100
C003
2.7
2.6
2.5
2.4
2.3
Falling VIN (OFF)
2.2
1.35
Rising VEN (ON)
1.30
1.25
1.20
1.15
1.10
Falling VEN (OFF)
1.05
2.1
2.0
1.00
-50
-25
0
25
50
75
100
TEMPERATURE, TJ (ƒC)
125
-50
C023
Figure 12. UVLO Thresholds vs. TJ
-25
0
25
50
75
100
TEMPERATURE, TJ (ƒC)
125
C024
Figure 13. Enable Thresholds vs. TJ
7
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: VIN = 5.5V, VOUT = 5.0 V, IOUT = 10 mA, COUT = 10 µF MLCC 16V X7R, TJ = 25°C.
2.5
1.35
2.0
Rising VEN (ON)
1.30
VIN = 5.5 V
VOUT = 1.2 V
1.5
1.25
VOLTS (V)
ENABLE THRESHOLDS (V)
1.40
1.20
1.15
1.0
Ven
0.5
Vout 125ƒC
1.10
0.0
1.05
Vout 25ƒC
Falling VEN (OFF)
Vout -40ƒC
1.00
-0.5
0
2
4
6
8
10
12
14
16
18
TIME (50µs/DIV)
20
INPUT VOLTAGE, VIN (V)
C025
C026
Figure 14. Enable Thresholds vs VIN
Figure 15. Start-up Time, VOUT = 1.2 V
2.5
5.5
5.0
2.0
4.0
VIN = 5.5 V
VOUT = 1.5 V
3.5
VOLTS (V)
1.5
VOLTS (V)
VIN = 5.5 V
VOUT = 5.0 V
4.5
1.0
Ven
0.5
0.0
2.5
2.0
Ven
1.5
Vout 125ƒC
1.0
Vout -40ƒC
Vout 25ƒC
0.5
Vout 25ƒC
0.0
Vout -40ƒC
-0.5
3.0
Vout 125ƒC
-0.5
TIME (50µs/DIV)
TIME (50µs/DIV)
C027
C028
Figure 16. Start-up Time, VOUT = 1.5V
Figure 17. Start-up Time, VOUT = 5.0 V
6.0
0.5
Vout = 5.0V
0.4
Vout = 3.3V
Vout = 1.2V
4.0
VOUT (V)
VIN = 5.5 V
Normalized to TJ = 25ƒC
0.3
VFB VARIATION (%)
5.0
3.0
2.0
UVLO
0.2
0.1
0.0
-0.1
-0.2
-0.3
1.0
-0.4
0.0
-0.5
0.0
1.0
2.0
3.0
4.0
VIN (V)
5.0
6.0
-50
C038
Figure 18. VOUT vs. Rising VIN
-25
0
25
50
75
TEMPERATURE, TJ (ƒC )
100
125
C029
Figure 19. VFB Variation vs. TJ
8
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: VIN = 5.5V, VOUT = 5.0 V, IOUT = 10 mA, COUT = 10 µF MLCC 16V X7R, TJ = 25°C.
20
5.5
5.0
VEN = 0.0V
16
4.5
14
4.0
VEN(CLAMP) (V)
INPUT CURRENT, IIN (µA)
18
12
10
8
6
4
2
3.5
3.0
2.5
2.0
125ƒC
1.5
125ƒC
25ƒC
1.0
25ƒC
0.5
-40ƒC
0
-40ƒC
0.0
0
2
4
6
8
10
12
14
16
18
INPUT VOLTAGE, VIN (V)
20
0
2
4
6
8
10
12
14
16
18
INPUT VOLTAGE, VIN (V)
C030
Figure 20. IN pin Current vs. VIN
20
C031
Figure 21. VEN(CLAMP) vs. VIN
3.0
350
DROPOUT VOLTAGE, VDO (mV)
IEN(IL) PULL-UP CURRENT (µA)
125ƒC
2.5
2.0
1.5
1.0
125ƒC
0.5
25ƒC
300
25ƒC
250
-40ƒC
200
VOUT = 3.0V
150
100
50
-40ƒC
0.0
0
2
4
6
8
10
12
14
16
18
INPUT VOLTAGE, VIN (V)
0
0.01
20
Figure 22. Enable pin Pull-up Current vs VIN
1
C033
Figure 23. Dropout Voltage vs. Output Current
350
2.0
125ƒC
300
25ƒC
250
-40ƒC
200
VOUT = 5.0V
VIN = 5.5 V
VOUT = 5.0 V
IOUT = 800 mA
Normalized to 25ƒC
1.5
VOUT VARIATION (%)
DROPOUT VOLTAGE, VDO (mV)
0.1
OUTPUT CURRENT (A)
C032
150
100
50
1.0
0.5
0.0
-0.5
-1.0
-1.5
0
0.01
-2.0
0.1
1
OUTPUT CURRENT (A)
-50
C034
Figure 24. Dropout Voltage vs. Output Current
-25
0
25
50
75
TEMPERATURE, TJ (ƒC)
100
125
C035
Figure 25. VOUT Variation vs. TJ
9
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
2.0
0.05
1.8
0.04
LINE REGULATION (%/V)
LOAD REGULATION (%/A)
Unless otherwise specified: VIN = 5.5V, VOUT = 5.0 V, IOUT = 10 mA, COUT = 10 µF MLCC 16V X7R, TJ = 25°C.
1.6
1.4
1.2
1.0
0.8
0.6
VIN = 5.5 V
VOUT = 5.0 V
ûIOUT = 10 mA to 800 mA
0.4
0.2
ûVIN = 5.5 V to 15 V
VOUT = 5.0 V
IOUT = 10 mA
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
0.0
-0.05
-50
-25
0
25
50
75
100
TEMPERATURE, TJ (ƒC)
125
-50
-25
0
25
50
75
100
TEMPERATURE, TJ (ƒC)
C036
Figure 26. Load Regulation vs. TJ
125
C037
Figure 27. Line Regulation vs. TJ
1.5
CURRENT LIMIT, ISC (A)
1.4
VIN
1V
/DIV
1.3
VIN = 7.0 V
VIN = 6.0 V
VOUT = 5.0 V
COUT = 10 µF
IOUT = 800 mA
1.2
1.1
ûVOUT
1.0
ûVOUT
20 mV
/DIV
0.9
0.8
-50
-25
0
25
50
75
100
TEMPERATURE (ƒC)
C039
Figure 28. Current Limit, ISC vs. TJ
VIN
1V
/DIV
TIME (500µs/DIV)
125
C022
Figure 29. Line Transient, VOUT = 5.0 V, IOUT = 800 mA
VIN
1V
/DIV
VIN = 7.0V
VIN = 7.0 V
VIN = 6.0V
VOUT = 5.0 V
COUT = 10 µF
IOUT = 400 mA
VOUT = 5.0 V
COUT = 10 µF
IOUT = 10 mA
ûVOUT
ûVOUT
20 mV
/DIV
VIN = 6.0 V
ûVOUT
ûVOUT
20 mV
/DIV
TIME (500µs/DIV)
TIME (500µs/DIV)
C021
Figure 30. Line Transient, VOUT = 5.0 V, IOUT = 400 mA
C020
Figure 31. Line Transient, VOUT = 5.0 V, IOUT = 10 mA
10
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: VIN = 5.5V, VOUT = 5.0 V, IOUT = 10 mA, COUT = 10 µF MLCC 16V X7R, TJ = 25°C.
VOUT = 1.2 V
COUT = 10 µF
IOUT = 800 mA
VIN
1V
/DIV
VOUT = 1.2 V
COUT = 10 µF
IOUT = 400 mA
VIN = 4.3 V
VIN = 3.3 V
VIN = 4.3 V
VIN = 3.3 V
VIN
1V
/DIV
ûVOUT
ûVOUT
ûVOUT
20 mV
/DIV
ûVOUT
20 mV
/DIV
TIME (500µs/DIV)
TIME (500µs/DIV)
C019
Figure 32. Line Transient, VOUT = 1.2 V, IOUT = 800 mA
VOUT = 1.2 V
COUT = 10 µF
IOUT = 10 mA
VIN
1V
/DIV
C018
Figure 33. Line Transient, VOUT = 1.2 V, IOUT= 400 mA
IOUT
200 mA
/DIV
VIN = 4.3 V
VIN = 3.3 V
IOUT = 800 mA
IOUT = 400 mA
VIN = 5.5 V
VOUT = 5.0 V
COUT = 10 µF
ûVOUT
ûVOUT
20 mV
/DIV
ûVOUT
20 mV
/DIV
ûVOUT
TIME (500µs/DIV)
TIME (500µs/DIV)
C017
Figure 34. Line Transient, VOUT = 1.2 V, IOUT= 10 mA
IOUT
200 mA
/DIV
VIN = 5.5 V
VOUT = 5.0 V
COUT = 10 µF
C016
Figure 35. Load Transient, VOUT = 5.0 V, IOUT = 400 mA to
800 mA
IOUT
200 mA
/DIV
IOUT = 800 mA
VIN = 5.5 V
VOUT = 5.0 V
COUT = 10 µF
IOUT = 400 mA
IOUT = 10 mA
IOUT = 10 mA
ûVOUT
20 mV
/DIV
ûVOUT
20 mV
/DIV
ûVOUT
TIME (500µs/DIV)
ûVOUT
TIME (500µs/DIV)
C015
Figure 36. Load Transient, VOUT = 5.0 V, IOUT = 10 mA to 800
mA
C014
Figure 37. Load Transient, VOUT = 5.0 V, IOUT = 10 mA to 400
mA
11
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: VIN = 5.5V, VOUT = 5.0 V, IOUT = 10 mA, COUT = 10 µF MLCC 16V X7R, TJ = 25°C.
IOUT
200 mA
/DIV
IOUT
200 mA
/DIV
IOUT = 800 mA
VIN = 3.3 V
VOUT = 1.2 V
COUT = 10 µF
VIN = 3.3 V
VOUT = 1.2 V
COUT = 10 µF
IOUT = 800 mA
IOUT = 400 mA
IOUT = 10 mA
ûVOUT
20 mV
/DIV
ûVOUT
20 mV
/DIV
ûVOUT
ûVOUT
TIME (500µs/DIV)
TIME (500µs/DIV)
C013
Figure 38. Load Transient, VOUT = 1.2 V, IOUT = 400 mA to
800 mA
IOUT
200 mA
/DIV
C012
Figure 39. Load Transient, VOUT = 1.2 V, IOUT = 10 mA to 800
mA
VIN = 3.3 V
VOUT = 1.2 V
COUT = 10 µF
IOUT = 400 mA
IOUT = 10 mA
ûVOUT
20 mV
/DIV
ûVOUT
TIME (500µs/DIV)
C011
Figure 40. Load Transient, VOUT = 1.2 V, IOUT= 10 mA to 400 mA
12
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
APPLICATIONS INFORMATION
Functional Block Diagram
LP38798SD-ADJ
IN
Active Ripple
Rejection
IN
Current
Limit
OUT(FB)
+
-
UVLO
OUT
PMOS
200 mV
IN(CP)
OUT
Thermal
Shutdown
98%
Charge Pump
3.5 MHz
tau= 2s
CP
SET
IEN
2 PA
99.5%
+
-
ISET
52 PA
EN
FB
5V
1.24V
VREF
1.200V
GND(CP)
GND
Package Information
The LP38798-ADJ is available in the 12-Lead WSON surface mount package that allows for increased power
dissipation compared to the standard PSOP-8 and WQFN-8 packages.
External Capacitors
Like any low-dropout regulator, the LP38798-ADJ requires external capacitors for regulator stability. These
capacitors must be correctly selected for optimum performance.
INPUT CAPACITOR: The minimum recommended input capacitance is 1 µF, ceramic or tantalum. However, if
the LP38798 is operating in conditions where input ripple, fast changes in the input voltage, or large changes in
the load current demand are expected, a minimum input capacitance of 10 µF is strongly recommended.
Ceramic capacitor tolerance and variations due temperature and applied voltage must be considered when
selecting a capacitor to assure the minimum input capacitance requirement is met over the intended operating
range.
The input capacitor must be located as close as physically possible to the input pin and returned to a clean
analog ground. Any good quality tantalum capacitor may be used, while a ceramic capacitor should be X5R or
X7R rated with appropriate adjustments due to the loss of capacitance value from the applied DC voltage.
Larger input capacitance values are encouraged if fast output current steps are expected, as this will minimize
voltage drops at the input pin. However, if there is any PCB trace inductance between the bulk supply and the
input pin it is recommended that a tantalum capacitor be placed in parallel with the ceramic input capacitor. This
will help to damp out undesired ringing that may occur during input transient conditions.
13
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
OUTPUT CAPACITOR: The LP38798 requires an output capacitance of at least 1 µF, ceramic or tantalum,
however a minimum output capacitance of 10 µF is strongly recommended if fast load transient conditions are
expected. While the LP38798 is designed to work with Ceramic output capacitors, the output capacitor can be
Ceramic, Tantalum, or a combination. The total output capacitance should be sized appropriately to handle any
fast load current steps. Capacitance type, tolerance, ESR, as well as temperature and voltage characteristics,
must be considered when selecting an output capacitor for the application.
Even though the LP38798 is stable with an output capacitance of 1 µF to 10 µF, a single output capacitor will
generally not be able to provide the best PSRR performance across a wide frequency range. Multiple parallel
capacitors, each with a different self-resonance frequency will provide better performance over a wider frequency
range.
The output capacitor must be located not more than 0.5" from the output pin and returned to a clean analog
ground to the LP38798 GND pin.
Charge Pump
The charge pump is running when both the input voltage is above the UVLO threshold (2.65 V typical) and the
EN pin voltage is above the VEN(ON) threshold (1.24 V typical). The typical charge pump operating frequency is
3.5 MHz.
A low leakage 10 nF X7R storage capacitor is required between the CP pin and ground to store the energy
required for gate drive of the internal NMOS pass device.
Do not make any other connection to the CP pin. Loading this pin in any manner will degrade regulator
performance. No external biasing may be applied to, or derived from, this pin, as permanent damage to the
internal charge pump circuitry may occur.
Programming the Output Voltage
Current sourced from the SET pin, through R1 and R2, must be kept to less than 100 µA. The minimum allowed
value for R2 is 12.9 kΩ;
ISET = VFB / R2
R2MIN = VFB(MAX) / 100 μA
R2MIN = 12.9 kΩ;
(1)
(2)
(3)
The values for R1 and R2 may be adjusted as needed to achieve the desired output voltage as long as the value
for R2 is no less than 12.9 kΩ. The maximum recommended value for R2 is 100 kΩ.
The following equation is used to determine the output voltage:
VOUT = ( VFB x ( 1 + ( R1 / R2 ) ) ) + VOS
(4)
Alternately, the following formula can be used to determine the appropriate R1 value for a given R2 value:
R1 = R2 x ( ( (VOUT) / VFB) – 1)
(5)
The following table suggests some ±1% values for R1 and R2 for a range of output voltages using the typical VFB
value of 1.200V. This is not a definitive list, as other combinations exist that will provide similar, possibly better,
performance.
Target VOUT
R1
R2
Typical VOUT
1.5 V
4.22 kΩ
16.9 kΩ
1.5 V
1.8 V
10.5 kΩ
21.0 kΩ
1.8 V
2.0 V
10.0 kΩ
15.0 kΩ
2.0 V
2.5 V
16.2 kΩ
15.0 kΩ
2.496 V
3.0 V
21.0 kΩ
14.0 kΩ
3.0 V
3.3 V
23.2 kΩ
13.3 kΩ
3.293 V
5.0 V
47.5 kΩ
15.0 kΩ
5.0 V
14
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
Noise Filter
Any noise at LP38798 SET pin is reduced by an internal passive, first order low-pass RC filter before it is passed
to the output buffer stage. The low-pass filter has a -3dB cut-off frequency of approximately 0.08Hz.
To keep the low-pass filter from interfering with the output voltage rise time at start-up, a voltage comparator
keeps the filter in a fast-charge mode while the output voltage (VOUT) is less than 99.5% of the SET pin voltage
(VSET) . When the rising VOUT is within 0.5% of VSET the fast-charge mode ends, and VOUT will rise the final 0.5%
based on the RC time constant (τ = 2s) of the filter.
Should VOUT be more than 2% above the VSET voltage, a voltage comparator will put the filter into the fast-charge
mode to allow the filter to discharge and VOUT to fall a value closer to VSET. When the falling VOUT is within 2% of
VSET the fast-charge mode ends, and VOUT will fall the final 2% based on the RC time constant (τ = 2s) of the
filter.
If the input voltage has an extended rise time, the output voltage may exhibit a stair-case waveform as the fastcharge mode is activated and de-activated as VSET rises with VIN, and VOUT follows. Once the VIN has risen
above the programmed VSET voltage, and VOUT is within 0.5% of VSET, the stair-case behavior will end.
Enable Input Operation
The Enable pin (EN) is pulled high internally by a 2 μA (typical) current source from the IN pin, and internally
clamped at 5V (typical) by a zener. Pulling the EN pin low, by sinking the IEN current to ground, will turn the
output off.
If the EN function is not needed the EN pin should be left open (floating). Do not connect the EN pin directly to
VIN if there is any possibility that VIN might exceed 5.5V (i.e. EN pin AbsMax). If external pull-up is required, the
external current into the EN pin should be limited to no more than 10 μA.
RPULL-UP > ( VPULL-UP - 5V) / 10 μA )
(6)
Thermal Shutdown
The LP38798 includes thermal protection that will shut-off the output current when activated by excessive device
dissipation. Thermal shutdown (TSD) will occur when the junction temperature has risen to 170°C. The junction
temperature must fall typically 12°C for the output current to be restored. Junction temperature is calculated from
the following formula:
TJ = (TA + ( PD x θJ-A))
(7)
Where the power being dissipated, PD, is defined as:
PD = ((VIN - VOUT) x IOUT)
(8)
Note that Thermal Shutdown is provided as a safety feature and is outside the specified Operating Ratings
temperature range. Operation with a junction temperature (TJ) above 125°C is not recommended as the device
behavior is not specified.
12-Lead WSON Package Thermal Considerations
The value of θJ−A for the 12-lead WSON package is specifically dependent on PCB copper area, copper
thickness, the number of layers, and thermal vias under the exposed thermal pad (DAP). Please refer to AN1520 (Literature Number: SNVA183A) for general guidelines for mounting packages with exposed thermal pads.
Exceeding the maximum allowable power dissipation defined by the final θJ−A will cause excessive die
temperature, and the regulator may go into thermal shutdown.
Mounting the 12-lead WSON Package
The 12-Lead WSON package requires specific mounting techniques that are detailed in Texas Instruments
Application Note # 1187 (Literature Number: SNOA401Q). Referring to the section PCB Design
Recommendations in AN-1187, it should be noted that the pad style that should be used with the WSON
DNT0012B package is the NSMD (non-solder mask defined) type. Additionally, it is recommended the PCB
terminal pads to be 0.2 mm longer than the package pads to create a solder fillet to improve reliability and
inspection.
15
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
www.ti.com
The thermal dissipation of the 12-lead WSON package is directly related to the printed circuit board construction
and the amount of additional copper area connected to the DAP.
The DAP (exposed pad) on the bottom of the 12-lead WSON DNT0012B package is connected to the die
substrate with a conductive die attach adhesive. The DAP has no direct electrical (wire) connection to any of the
twelve pins. There is a parasitic PN junction between the die substrate and the device ground. As such, it is
strongly recommend that the DAP be connected directly to the ground at device leads 6 and 7 (i.e. GND).
Alternately, but not recommended, the DAP may be left floating (i.e. no electrical connection). The DAP must not
be connected to any potential other than ground.
For the LP38798SD in the 12-Lead WSON DNT0012B package, the junction-to-case thermal resistance rating,
θJC, is 5°C/W, where the case is defined as being on the bottom of the package at the center of the DAP.
The junction-to-ambient thermal performance, θJA, for the LP38798SD in the 12-lead WSON DNT0012B
package, using the JEDEC JESD51 standards, is summarized in the following table:
LP38798SD-ADJ (12-lead WSON DNT0012B) Thermal Performance
Board
Type
Thermal
Vias
θJA
ΨJB
θJC
JEDEC
2-Layer
JESD 51-3
None
138°C/W
45.9°C/W
5°C/W
1
51°C/W
26.1°C/W
2
45°C/W
24.7°C/W
4
39°C/W
18.0°C/W
6
36°C/W
14.9°C/W
8
34°C/W
13.2°C/W
JEDEC
4-Layer
JESD 51-7
5°C/W
Estimating the Junction Temperature
The EIA/JEDEC standard (JESD51-2) provides methodologies to estimate the junction temperature from external
measurements (ΨJB references the temperature at the PCB, and ΨJT references the temperature at the top
surface of the package) when operating under steady-state power dissipation conditions. These methodologies
have been determined to be relatively independent of the copper thermal spreading area that may be attached to
the package DAP when compared to the more typical θJA. Refer to ' Application Report : Semiconductor and IC
Package Thermal Metrics' , Literature Number SPRA953B, for specifics.
Board Layout
The dynamic performance of the LP38798 is dependant on the layout of the PCB. PCB layout practices that are
adequate for typical LDO's may degrade the PSRR, noise, or transient performance of the LP38798.
Best performance is achieved by placing all of the components on the same side of the PCB as the LP38798,
and as close as is practical to the LP38798 package. All component ground connections should be back to the
LP38798 analog ground connection using as wide, and as short, of a copper trace as is practical. The connection
from the FB pin to the VSET resistors must be as short as possible as the FB pin is a high impedance input. Any
trace length on the FB pin will act as an antenna.
Connections using long trace lengths, narrow trace widths, and connections through vias should be avoided.
These will add parasitic inductances and resistance that results in inferior performance especially during transient
conditions.
A Ground Plane, either on the opposite side of a two-layer PCB, or embedded in a multi-layer PCB, is strongly
recommended. This Ground Plane serves two purposes : 1) Provide a circuit reference plane to assure accuracy,
and 2) provides a thermal plane to remove heat from the LP38798 through thermal vias under the package DAP.
16
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
LP38798
www.ti.com
SNOSCT6A – MARCH 2013 – REVISED MAY 2013
Typical Applications
1
5.50V
VIN
2
3
CIN
1 PF
MLCC
OUT
IN
OUT
IN(CP)
OUT(FB)
12
VOUT
11
5
6
CP
SET
EN
FB
+ COUT
10 PF
9 (5.00V)
8 (1.20V)
R1
47.5k
R2
15.0k
7
GND(CP)
5.00V
10
LP38798
4
CCP
10 nF
VEN
IN
GND
DAP
GND
GND
Figure 41. Typical Application, VOUT = 5.0V
1
5.50V
VIN
L1
10 PH
1 PF
MLCC
2
+
3
CIN1
33 PF
50 m:
Tant
VEN
CIN2
47 PF
MLCC
IN
OUT
IN
OUT
IN(CP)
OUT(FB)
12
VOUT
11
10
+ COUT
10 PF
LP38798
4
CCP
10 nF
5
6
CP
SET
EN
FB
9 (5.00V)
8 (1.20V)
7
GND(CP)
GND
5.00V
R1
47.5k
R2
15.0k
DAP
GND
GND
Figure 42. Improving PSRR at High Frequencies
17
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LP38798
PACKAGE OPTION ADDENDUM
www.ti.com
19-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LP38798SD-ADJ/NOPB
ACTIVE
WSON
DNT
12
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L00075B
LP38798SDE-ADJ/NOPB
ACTIVE
WSON
DNT
12
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L00075B
LP38798SDX-ADJ/NOPB
ACTIVE
WSON
DNT
12
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L00075B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
19-May-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LP38798SD-ADJ/NOPB
WSON
DNT
12
LP38798SDE-ADJ/NOPB
WSON
DNT
LP38798SDX-ADJ/NOPB
WSON
DNT
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
12
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
12
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP38798SD-ADJ/NOPB
WSON
DNT
12
1000
210.0
185.0
35.0
LP38798SDE-ADJ/NOPB
WSON
DNT
12
250
210.0
185.0
35.0
LP38798SDX-ADJ/NOPB
WSON
DNT
12
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
DNT0012B
WSON - 0.8mm max height
SON (PLASTIC SMALL OUTLINE - NO LEAD)
SDA12B (Rev A)
4214928/A 03/2013
NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is designed to be soldered to a thermal pad on the board for thermal and mechanical performance.
For more information, refer to QFN/SON PCB application note in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages