TI LP3965ESX-ADJ 1.5a fast ultra low dropout linear regulator Datasheet

LP3962, LP3965
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SNVS066H – MAY 2000 – REVISED APRIL 2013
LP3962/LP3965 1.5A Fast Ultra Low Dropout Linear Regulators
Check for Samples: LP3962, LP3965
FEATURES
DESCRIPTION
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The LP3962/LP3965 series of fast ultra low-dropout
linear regulators operate from a +2.5V to +7.0V input
supply. Wide range of preset output voltage options
are available. These ultra low dropout linear
regulators respond very fast to step changes in load
which makes them suitable for low voltage
microprocessor applications. The LP3962/LP3965 are
developed on a CMOS process which allows low
quiescent current operation independent of output
load current. This CMOS process also allows the
LP3962/LP3965 to operate under extremely low
dropout conditions.
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Ultra Low Dropout Voltage
Low Ground Pin Current
Load Regulation of 0.04%
15µA Quiescent Current in Shutdown Mode
Specified Output Current of 1.5A DC
Available in SOT-223,SFM/TO-263 and TO-220
Packages
Output Voltage Accuracy ± 1.5%
Error Flag Indicates Output Status (LP3962)
Sense Option Improves Better Load
Regulation (LP3965)
Extremely Low Output Capacitor
Requirements
Overtemperature/Overcurrent Protection
−40°C to +125°C Junction Temperature Range
APPLICATIONS
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Microprocessor Power Supplies
GTL, GTL+, BTL, and SSTL Bus Terminators
Power Supplies for DSPs
SCSI Terminator
Post Regulators
High Efficiency Linear Regulators
Battery Chargers
Other Battery Powered Applications
Dropout Voltage: Ultra low dropout voltage; typically
38mV at 150mA load current and 380mV at 1.5A load
current.
Ground Pin Current: Typically 5mA at 1.5A load
current.
Shutdown Mode: Typically 15µA quiescent current
when the shutdown pin is pulled low.
Error Flag: Error flag goes low when the output
voltage drops 10% below nominal value (for LP3962).
SENSE: Sense pin improves regulation at remote
loads. (For LP3965)
Precision Output Voltage: Multiple output voltage
options are available ranging from 1.2V to 5.0V and
adjustable (LP3965), with a specified accuracy of
±1.5% at room temperature, and ±3.0% over all
conditions (varying line, load, and temperature).
Typical Application Circuits
*SD and ERROR pins must be pulled high through a 10kΩ pull-up resistor. Connect the ERROR pin to ground if this
function is not used. See Application Hints section for more information.
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2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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*SD and ERROR pins must be pulled high through a 10kΩ pull-up resistor. Connect the ERROR pin to ground if this
function is not used. See Application Hints section for more information.
Block Diagram LP3962
2
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Block Diagram LP3965
Block Diagram LP3965-ADJ
Connection Diagram
Figure 1. Top View
SOT-223-5 Package
Figure 2. Top View
TO-220-5 Package
Bent, Staggered Leads
Figure 3. Top View
SFM/TO-263-5 Package
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Pin Descriptions for SOT-223-5 Package
LP3962
Pin #
Name
LP3965
Function
Name
Function
1
SD
Shutdown
SD
Shutdown
2
VIN
Input Supply
VIN
Input Supply
3
VOUT
4
ERROR
5
GND
Output Voltage
ERROR Flag
VOUT
SENSE/ADJ
Ground
GND
Output Voltage
Remote Sense Pin or Output
Adjust Pin
Ground
Pin Descriptions for TO-220-5 and SFM/TO-263-5 Packages
LP3962
Pin #
Name
LP3965
Function
Name
Function
1
SD
Shutdown
SD
Shutdown
2
VIN
Input Supply
VIN
Input Supply
3
GND
Ground
4
VOUT
Output Voltage
5
ERROR
ERROR Flag
GND
Ground
VOUT
Output Voltage
SENSE/ADJ
Remote Sense Pin or Output
Adjust Pin
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
−65°C to +150°C
Storage Temperature Range
Lead Temperature (Soldering, 5 sec.)
ESD Rating
260°C
(3)
Power Dissipation
2 kV
(4)
Internally Limited
−0.3V to +7.5V
Input Supply Voltage (Survival)
−0.3V to VIN+0.3V
Shutdown Input Voltage (Survival)
Output Voltage (Survival),
(5) (6)
−0.3V to +7.5V
,
IOUT (Survival)
Short Circuit Protected
Maximum Voltage for ERROR Pin
VIN+0.3V
Maximum Voltage for SENSE Pin
VOUT+0.3V
(1)
(2)
(3)
(4)
(5)
(6)
4
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which
the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and test conditions,
see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
At elevated temperatures, devices must be derated based on package thermal resistance. The devices in TO-220 package must be
derated at θjA = 50°C/W (with 0.5in2, 1oz. copper area), junction-to-ambient (with no heat sink). The devices in the SFM/TO-263
surface-mount package must be derated at θjA = 60°C/W (with 0.5in2, 1oz. copper area), junction-to-ambient. The devices in SOT-223
package must be derated at θjA = 90°C/W (with 0.5in2, 1oz. copper area), junction-to-ambient.
If used in a dual-supply system where the regulator load is returned to a negative supply, the LP396X output must be diode-clamped to
ground.
The output PMOS structure contains a diode between the VIN and VOUT terminals. This diode is normally reverse biased. This diode will
get forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can
typically withstand 200mA of DC current and 1Amp of peak current.
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Operating Ratings
(1)
2.5V to 7.0V
Shutdown Input Voltage (Operating)
−0.3V to VIN+0.3V
Input Supply Voltage (Operating),
Maximum Operating Current (DC)
1.5A
Operating Junction Temp. Range
−40°C to +125°C
(1)
The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5V, whichever is greater.
Electrical Characteristics
LP3962/LP3965
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = VO(NOM) + 1V, IL = 10 mA, COUT = 33µF, VSD = VIN-0.3V.
Symbol
Parameter
Conditions
Typ
(1)
LP3962/5
(2)
Units
Min
Max
0
-1.5
-3.0
+1.5
+3.0
%
1.198
1.180
1.234
1.253
V
Output Voltage Tolerance (3)
10 mA ≤ IL ≤ 1.5A
VOUT +1 ≤ VIN≤ 7.0V
VADJ
Adjust Pin Voltage (ADJ version)
10 mA ≤ IL ≤ 1.5A
VOUT +1.5V ≤ VIN≤ 7.0V
1.216
ΔV OL
Output Voltage Line Regulation
VOUT+1V<VIN<7.0V,
0.02
0.06
%
Output Voltage Load
Regulation (3)
10 mA < IL < 1.5 A
0.04
0.09
%
VO
ΔVO/ ΔIOUT
(3)
VIN - VOUT
Dropout Voltage
IL = 150 mA
38
45
55
IL = 1.5 A
380
450
550
IL = 150 mA
4
9
10
IL = 1.5 A
5
14
15
25
75
(4)
IGND
Ground Pin Current In Normal
Operation Mode
IGND
Ground Pin Current In Shutdown
Mode (5)
VSD ≤ 0.2V
15
IO(PK)
Peak Output Current
See
(6)
2.5
mV
mA
µA
2.0
1.7
A
SHORT CIRCUIT PROTECTION
ISC
Short Circuit Current
4.5
A
OVER TEMPERATURE PROTECTION
Tsh(t)
Shutdown Threshold
165
°C
Tsh(h)
Thermal Shutdown Hysteresis
10
°C
SHUTDOWN INPUT
(1)
(2)
(3)
(4)
(5)
(6)
VSDT
Shutdown Threshold
TdOFF
Turn-off delay
Output = High
VIN
Output = Low
0
IL = 1.5 A
20
VIN–0.3
0.2
V
µs
Typical numbers are at 25°C and represent the most likely parametric norm.
Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using
Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the input line voltage.
Output voltage load regulation is defined as the change in output voltage from the nominal value due to change in load current. The line
and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the
output voltage tolerance specification.
Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value.
Dropout voltage specification applies only to output voltages of 2.5V and above. For output voltages below 2.5V, the drop-out voltage is
nothing but the input to output differential, since the minimum input voltage is 2.5V.
This specification has been tested for −40°C ≤ TJ ≤ 85°C since the temperature rise of the device is negligible under shutdown
conditions.
At elevated temperatures, devices must be derated based on package thermal resistance. The devices in TO-220 package must be
derated at θjA = 50°C/W (with 0.5in2, 1oz. copper area), junction-to-ambient (with no heat sink). The devices in the SFM/TO-263
surface-mount package must be derated at θjA = 60°C/W (with 0.5in2, 1oz. copper area), junction-to-ambient. The devices in SOT-223
package must be derated at θjA = 90°C/W (with 0.5in2, 1oz. copper area), junction-to-ambient.
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Electrical Characteristics
LP3962/LP3965 (continued)
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = VO(NOM) + 1V, IL = 10 mA, COUT = 33µF, VSD = VIN-0.3V.
Symbol
Parameter
Conditions
Typ
(1)
LP3962/5
Min
TdON
ISD
(2)
Units
Max
Turn-on delay
IL = 1.5 A
25
µs
SD Input Current
VSD = VIN
1
nA
ERROR FLAG COMPARATOR
VT
Threshold
See
(7)
(7)
VTH
Threshold Hysteresis
See
VEF(Sat)
Error Flag Saturation
Isink = 100µA
10
5
5
2
0.02
16
%
8
%
0.1
V
Td
Flag Reset Delay
1
µs
Ilk
Error Flag Pin Leakage Current
1
nA
VError = 0.5V (over temp.)
1
mA
VIN = VOUT + 1.5V
COUT = 100uF
VOUT = 3.3V
60
VIN = VOUT + 0.3V
COUT = 100uF
VOUT = 3.3V
40
Imax
Error Flag Pin Sink Current
AC PARAMETERS
PSRR
ρn(l/f
en
(7)
6
Ripple Rejection
Output Noise Density
Output Noise Voltage (rms)
f = 120Hz
0.8
BW = 10Hz – 100kHz
150
BW = 300Hz – 300kHz
100
dB
µV
µV (rms)
Error Flag threshold and hysteresis are specified as percentage of regulated output voltage.
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Typical Performance Characteristics
Unless otherwise specified, VIN =VO(NOM) + 1V, VOUT= 2.5V, COUT = 33µF, IOUT = 10mA, CIN = 68µF, VSD = VIN, and TA = 25°C.
Drop-Out Voltage
vs
Temperature for Different Load Currents
Drop-Out Voltage
vs
Temperature for Different Output Voltages (IOUT = 800mA
Figure 4.
Figure 5.
Ground Pin Current
vs
Input Voltage (VSD=VIN)
Ground Pin Current
vs
Input Voltage (VSD=100mV)
Figure 6.
Figure 7.
Ground Current
vs
Temperature (VSD=VIN)
Ground Current
vs
Temperature (VSD=0V
Figure 8.
Figure 9.
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Typical Performance Characteristics (continued)
Unless otherwise specified, VIN =VO(NOM) + 1V, VOUT= 2.5V, COUT = 33µF, IOUT = 10mA, CIN = 68µF, VSD = VIN, and TA = 25°C.
8
Ground Pin Current
vs
Shutdown Pin Voltage
Input Voltage
vs
Output Voltage
Figure 10.
Figure 11.
Output Noise Density, VOUT= 2.5V
Output Noise Density, VOUT= 5V
Figure 12.
Figure 13.
Load Transient Response
Ripple Rejection
vs
Frequency
Figure 14.
Figure 15.
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Typical Performance Characteristics (continued)
Unless otherwise specified, VIN =VO(NOM) + 1V, VOUT= 2.5V, COUT = 33µF, IOUT = 10mA, CIN = 68µF, VSD = VIN, and TA = 25°C.
δVOUT
vs
Temperature
Noise Density VIN = 3.5V, VOUT = 2.5V, IL = 10 mA
Figure 16.
Figure 17.
Line Transient Response
Line Transient Response
Figure 18.
Figure 19.
Line Transient Response (IOUT = 1.5A)
Line Transient Response (IOUT = 1.5A)
Figure 20.
Figure 21.
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APPLICATIONS INFORMATION
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are required to assure stability. these capacitors must be
correctly selected for proper performance.
INPUT CAPACITOR: The LP3962/5 requires a low source impedance to maintain regulator stability because the
internal bias circuitry is connected directly to VIN. The input capacitor must be located less than 1 cm from the
LP3962/5 device and connected directly to the input and ground pins using traces which have no other currents
flowing through them (see PCB LAYOUT).
The minimum allowable input capacitance for a given application depends on the type of the capacitor and ESR
(equivalent series resistance). A lower ESR capacitor allows the use of less capacitance, while higher ESR types
(like aluminum electrolytics) require more capacitance.
The lowest value of input capacitance that can be used for stable full-load operation is 68 µF (assuming it is a
ceramic or low-ESR Tantalum with ESR less than 100 mΩ).
To determine the minimum input capacitance amount and ESR value, an approximation which should be used is:
CIN ESR (mΩ) / CIN (µF) ≤ 1.5
This shows that input capacitors with higher ESR values can be used if sufficient total capacitance is provided.
Capacitor types (aluminum, ceramic, and tantalum) can be mixed in parallel, but the total equivalent input
capacitance/ESR must be defined as above to assure stable operation.
IMPORTANT: The input capacitor must maintain its ESR and capacitance in the "stable range" over the entire
temperature range of the application to assure stability (see CAPACITOR CHARACTERISTICS).
OUTPUT CAPACITOR: An output capacitor is also required for loop stability. It must be located less than 1 cm
from the LP3962/5 device and connected directly to the output and ground pins using traces which have no other
currents flowing through them (see PCB LAYOUT).
The minimum value of the output capacitance that can be used for stable full-load operation is 33 µF, but it may
be increased without limit. The output capacitor's ESR is critical because it forms a zero to provide phase lead
which is required for loop stability. The ESR must fall within the specified range:
0.2Ω ≤ COUT ESR ≤ 5Ω
The lower limit of 200 mΩ means that ceramic capacitors are not suitable for use as LP3962/5 output capacitors
(but can be used on the input). Some ceramic capacitance can be used on the output if the total equivalent ESR
is in the stable range: when using a 100 µF Tantalum as the output capacitor, approximately 3 µF of ceramic
capacitance can be applied before stability becomes marginal.
IMPORTANT: The output capacitor must meet the requirements for minimum amount of capacitance and also
have an appropriate ESR value over the full temperature range of the application to assure stability (see
CAPACITOR CHARACTERISTICS).
SELECTING A CAPACITOR
It is important to note that capacitance tolerance and variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required amount of capacitance is provided over the full
operating temperature range. In general, a good Tantalum capacitor will show very little capacitance variation
with temperature, but a ceramic may not be as good (depending on dielectric type). Aluminum electrolytics also
typically have large temperature variation of capacitance value.
Equally important to consider is a capacitor's ESR change with temperature: this is not an issue with ceramics,
as their ESR is extremely low. However, it is very important in Tantalum and aluminum electrolytic capacitors.
Both show increasing ESR at colder temperatures, but the increase in aluminum electrolytic capacitors is so
severe they may not be feasible for some applications (see CAPACITOR CHARACTERISTICS).
10
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CAPACITOR CHARACTERISTICS
CERAMIC: For values of capacitance in the 10 to 100 µF range, ceramics are usually larger and more costly
than tantalums but give superior AC performance for bypassing high frequency noise because of very low ESR
(typically less than 10 mΩ). However, some dielectric types do not have good capacitance characteristics as a
function of voltage and temperature.
Z5U and Y5V dielectric ceramics have capacitance that drops severely with applied voltage. A typical Z5U or
Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. The Z5U and Y5V
also exhibit a severe temperature effect, losing more than 50% of nominal capacitance at high and low limits of
the temperature range.
X7R and X5R dielectric ceramic capacitors are strongly recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over full operating ratings of temperature and voltage. Of
course, they are typically larger and more costly than Z5U/Y5U types for a given voltage and capacitance.
TANTALUM: Solid Tantalum capacitors are recommended for use on the output because their typical ESR is
very close to the ideal value required for loop compensation. They also work well as input capacitors if selected
to meet the ESR requirements previously listed.
Tantalums also have good temperature stability: a good quality Tantalum will typically show a capacitance value
that varies less than 10-15% across the full temperature range of 125°C to −40°C. ESR will vary only about 2X
going from the high to low temperature limits.
The increasing ESR at lower temperatures can cause oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the stability range at room temperature).
ALUMINUM: This capacitor type offers the most capacitance for the money. The disadvantages are that they are
larger in physical size, not widely available in surface mount, and have poor AC performance (especially at
higher frequencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is higher than either Tantalum or ceramic, and it also
varies greatly with temperature. A typical aluminum electrolytic can exhibit an ESR increase of as much as 50X
when going from 25°C down to −40°C.
It should also be noted that many aluminum electrolytics only specify impedance at a frequency of 120 Hz, which
indicates they have poor high frequency performance. Only aluminum electrolytics that have an impedance
specified at a higher frequency (between 20 kHz and 100 kHz) should be used for the LP396X. Derating must be
applied to the manufacturer's ESR specification, since it is typically only valid at room temperature.
Any applications using aluminum electrolytics should be thoroughly tested at the lowest ambient operating
temperature where ESR is maximum.
PCB LAYOUT
Good PC layout practices must be used or instability can be induced because of ground loops and voltage drops.
The input and output capacitors must be directly connected to the input, output, and ground pins of the LP3962/5
using traces which do not have other currents flowing in them Kelvin connect).
The best way to do this is to lay out CIN and COUT near the device with short traces to the VIN, VOUT, and ground
pins. The regulator ground pin should be connected to the external circuit ground so that the regulator and its
capacitors have a "single point ground".
It should be noted that stability problems have been seen in applications where "vias" to an internal ground plane
were used at the ground points of the LP3962/5 IC and the input and output capacitors. This was caused by
varying ground potentials at these nodes resulting from current flowing through the ground plane. Using a single
point ground technique for the regulator and it's capacitors fixed the problem.
Since high current flows through the traces going into VIN and coming from VOUT, Kelvin connect the capacitor
leads to these pins so there is no voltage drop in series with the input and output capacitors.
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RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic interference) can degrade any integrated circuit's
performance because of the small dimensions of the geometries inside the device. In applications where circuit
sources are present which generate signals with significant high frequency energy content (> 1 MHz), care must
be taken to ensure that this does not affect the IC regulator.
If RFI/EMI noise is present on the input side of the LP396X regulator (such as applications where the input
source comes from the output of a switching regulator), good ceramic bypass capacitors must be used at the
input pin of the LP396X.
If a load is connected to the LP396X output which switches at high speed (such as a clock), the high-frequency
current pulses required by the load must be supplied by the capacitors on the LP396X output. Since the
bandwidth of the regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above
that frequency. The means the effective output impedance of the LP396X at frequencies above 100 kHz is
determined only by the output capacitor(s).
In applications where the load is switching at high speed, the output of the LP396X may need RF isolation from
the load. It is recommended that some inductance be placed between the LP396X output capacitor and the load,
and good RF bypass capacitors be placed directly across the load.
PCB layout is also critical in high noise environments, since RFI/EMI is easily radiated directly into PC traces.
Noisy circuitry should be isolated from "clean" circuits where possible, and grounded through a separate path. At
MHz frequencies, ground planes begin to look inductive and RFI/EMI can cause ground bounce across the
ground plane.
In multi-layer PCB applications, care should be taken in layout so that noisy power and ground planes do not
radiate directly into adjacent layers which carry analog power and ground.
OUTPUT ADJUSTMENT
An adjustable output device has output voltage range of 1.216V to 5.1V. To obtain a desired output voltage, can
be used with R1 always a 10kΩ resistor.
For output stability, CF must be between 68pF and 100pF.
TURN-ON CHARACTERISTICS FOR OUTPUT VOLTAGES PROGRAMMED TO 2.0V OR BELOW
As Vin increases during start-up, the regulator output will track the input until Vin reaches the minimum operating
voltage (typically about 2.2V). For output voltages programmed to 2.0V or below, the regulator output may
momentarily exceed its programmed output voltage during start up. Outputs programmed to voltages above 2.0V
are not affected by this behavior.
OUTPUT NOISE
Noise is specified in two waysSpot Noise or Output noise density is the RMS sum of all noise sources, measured at the regulator output, at
a specific frequency (measured with a 1Hz bandwidth). This type of noise is usually plotted on a curve as a
function of frequency.
Total output Noise or Broad-band noise is the RMS sum of spot noise over a specified bandwidth, usually
several decades of frequencies.
Attention should be paid to the units of measurement. Spot noise is measured in units µV/√Hz or nV/√Hz and
total output noise is measured in µV(rms).
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The primary source of noise in low-dropout regulators is the internal reference. In CMOS regulators, noise has a
low frequency component and a high frequency component, which depend strongly on the silicon area and
quiescent current. Noise can be reduced in two ways: by increasing the transistor area or by increasing the
current drawn by the internal reference. Increasing the area will decrease the chance of fitting the die into a
smaller package. Increasing the current drawn by the internal reference increases the total supply current
(ground pin current). Using an optimized trade-off of ground pin current and die size, LP3962/LP3965 achieves
low noise performance and low quiescent current operation.
The total output noise specification for LP3962/LP3965 is presented in the Electrical Characteristics table. The
Output noise density at different frequencies is represented by a curve under typical performance characteristics.
SHORT-CIRCUIT PROTECTION
The LP3962and LP3965 is short circuit protected and in the event of a peak over-current condition, the shortcircuit control loop will rapidly drive the output PMOS pass element off. Once the power pass element shuts
down, the control loop will rapidly cycle the output on and off until the average power dissipation causes the
thermal shutdown circuit to respond to servo the on/off cycling to a lower frequency. Please refer to the section
on thermal information for power dissipation calculations.
ERROR FLAG OPERATION
The LP3962/LP3965 produces a logic low signal at the Error Flag pin when the output drops out of regulation
due to low input voltage, current limiting, or thermal limiting. This flag has a built in hysteresis. The timing
diagram in Figure 22 shows the relationship between the ERROR and the output voltage. In this example, the
input voltage is changed to demonstrate the functionality of the Error Flag.
The internal Error flag comparator has an open drain output stage. Hence, the ERROR pin should be pulled high
through a pull up resistor. Although the ERROR pin can sink current of 1mA, this current is energy drain from the
input supply. Hence, the value of the pull up resistor should be in the range of 10kΩ to 1MΩ. The ERROR pin
must be connected to ground if this function is not used. It should also be noted that when the shutdown pin
is pulled low, the ERROR pin is forced to be invalid for reasons of saving power in shutdown mode.
Figure 22. Error Flag Operation
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SENSE PIN
In applications where the regulator output is not very close to the load, LP3965 can provide better remote load
regulation using the SENSE pin. Figure 23 depicts the advantage of the SENSE option. LP3962 regulates the
voltage at the output pin. Hence, the voltage at the remote load will be the regulator output voltage minus the
drop across the trace resistance. For example, in the case of a 3.3V output, if the trace resistance is 100mΩ, the
voltage at the remote load will be 3.15V with 1.5 A of load current, ILOAD. The LP3965 regulates the voltage at the
sense pin. Connecting the sense pin to the remote load will provide regulation at the remote load, as shown in
Figure 23. If the sense option pin is not required, the sense pin must be connected to the VOUT pin.
Figure 23. Improving remote load regulation using LP3965
SHUTDOWN OPERATION
A CMOS Logic level signal at the shutdown ( SD) pin will turn-off the regulator. Pin SD must be actively
terminated through a 10kΩ pull-up resistor for a proper operation. If this pin is driven from a source that actively
pulls high and low (such as a CMOS rail to rail comparator), the pull-up resistor is not required. This pin must be
tied to Vin if not used.
DROPOUT VOLTAGE
The dropout voltage of a regulator is defined as the minimum input-to-output differential required to stay within
2% of the output voltage. The LP3962/LP3965 use an internal MOSFET with an Rds(on) of 240mΩ (typically).
For CMOS LDOs, the dropout voltage is the product of the load current and the Rds(on) of the internal MOSFET.
REVERSE CURRENT PATH
The internal MOSFET in LP3962and LP3965 has an inherent parasitic diode. During normal operation, the input
voltage is higher than the output voltage and the parasitic diode is reverse biased. However, if the output is
pulled above the input in an application, then current flows from the output to the input as the parasitic diode gets
forward biased. The output can be pulled above the input as long as the current in the parasitic diode is limited to
200mA continuous and 1A peak.
MAXIMUM OUTPUT CURRENT CAPABILITY
LP3962 and LP3965 can deliver a continuous current of 1.5 A over the full operating temperature range. A
heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. Under all possible conditions, the junction temperature must be within the range specified under
operating conditions. The total power dissipation of the device is given by:
PD = (VIN−VOUT)IOUT+ (VIN)IGND
14
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LP3962, LP3965
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SNVS066H – MAY 2000 – REVISED APRIL 2013
where IGND is the operating ground current of the device (specified under Electrical Characteristics).
The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the
application, and the maximum allowable junction temperature(TJmax):
TRmax = TJmax− TAmax
The maximum allowable value for junction to ambient Thermal Resistance, θJA, can be calculated using the
formula:
θJA = TRmax / PD
LP3962 and LP3965 are available in TO-220, SFM/TO-263, and SOT-223 packages. The thermal resistance
depends on amount of copper area or heat sink, and on air flow. If the maximum allowable value of θJA
calculated above is ≥ 60 °C/W for TO-220 package, ≥60 °C/W for SFM/TO-263 package, and ≥ 140 °C/W for
SOT-223 package, no heatsink is needed since the package can dissipate enough heat to satisfy these
requirements. If the value for allowable θJA falls below these limits, a heat sink is required.
HEATSINKING TO-220 PACKAGES
The thermal resistance of a TO-220 package can be reduced by attaching it to a heat sink or a copper plane on
a PC board. If a copper plane is to be used, the values of θJA will be same as shown in next section for SFM/TO263 package.
The heatsink to be used in the application should have a heatsink to ambient thermal resistance,
θHA≤ θJA − θCH − θJC.
In this equation, θCH is the thermal resistance from the junction to the surface of the heat sink and θJC is the
thermal resistance from the junction to the surface of the case. θJC is about 3°C/W for a TO-220 package. The
value for θCH depends on method of attachment, insulator, etc. θCH varies between 1.5°C/W to 2.5°C/W. If the
exact value is unknown, 2°C/W can be assumed.
HEATSINKING SFM/TO-263 AND SOT-223 PACKAGES
The SFM/TO-263 and SOT-223 packages use the copper plane on the PCB as a heatsink. The tab of these
packages are soldered to the copper plane for heat sinking. Figure 24 shows a curve for the θJA of SFM/TO-263
package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the
copper area for heat sinking.
Figure 24. θJA vs Copper(1 Ounce) Area for SFM/TO-263 package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The
minimum value for θJA for the SFM/TO-263 packag mounted to a PCB is 32°C/W.
Figure 25 shows the maximum allowable power dissipation for SFM/TO-263 packages for different ambient
temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C.
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LP3962, LP3965
SNVS066H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 25. Maximum power dissipation vs ambient temperature for SFM/TO-263 package
Figure 26 shows a curve for the θJA of SOT-223 package for different copper area sizes, using a typical PCB with
1 ounce copper and no solder mask over the copper area for heat sinking.
Figure 26. θJA vs Copper(1 Ounce) Area for SOT-223 package
Figure 27 through Figure 35 show different layout scenarios for SOT-223 package.
Figure 27. SCENARIO A, θJA = 148°C/W
Figure 28. SCENARIO B, θJA = 125°C/W
16
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SNVS066H – MAY 2000 – REVISED APRIL 2013
Figure 29. SCENARIO C, θJA = 92°C/W
Figure 30. SCENARIO D, θJA = 83°C/W
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LP3962, LP3965
SNVS066H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 31. SCENARIO E, θJA = 77°C/W
Figure 32. SCENARIO F, θJA = 75°C/W
18
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SNVS066H – MAY 2000 – REVISED APRIL 2013
Figure 33. SCENARIO G, θJA = 113°C/W
Figure 34. SCENARIO H, θJA = 79°C/W
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LP3962, LP3965
SNVS066H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 35. SCENARIO I, θJA = 78.5°C/W
20
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LP3962, LP3965
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SNVS066H – MAY 2000 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision G (April 2013) to Revision H
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 20
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21
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP3962EMP-1.8
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBCB
LP3962EMP-1.8/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBCB
LP3962EMP-2.5
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBDB
LP3962EMP-2.5/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBDB
LP3962EMP-3.3
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBEB
LP3962EMP-3.3/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBEB
LP3962EMPX-2.5/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBDB
LP3962ES-1.8
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3962ES
-1.8
LP3962ES-1.8/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3962ES
-1.8
LP3962ES-2.5
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3962ES
-2.5
LP3962ES-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3962ES
-2.5
LP3962ES-3.3
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3962ES
-3.3
LP3962ES-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3962ES
-3.3
LP3962ESX-1.8/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3962ES
-1.8
LP3962ESX-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3962ES
-2.5
LP3962ESX-3.3
NRND
DDPAK/
TO-263
KTT
5
500
TBD
Call TI
Call TI
-40 to 125
LP3962ES
-3.3
LP3962ESX-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3962ES
-3.3
LP3962ESX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3962ES
-5.0
LP3962ET-3.3/LB05
NRND
TO-220
NEB
5
45
TBD
Call TI
Call TI
Addendum-Page 1
LP3962ET
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
8-Oct-2015
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
-3.3
LP3962ET-3.3/NOPB
ACTIVE
TO-220
NDH
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LP3962ET
-3.3
LP3965EMP-1.8/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBKB
LP3965EMP-2.5
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBLB
LP3965EMP-2.5/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBLB
LP3965EMP-3.3
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBNB
LP3965EMP-3.3/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBNB
LP3965EMP-ADJ
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBRB
LP3965EMP-ADJ/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBRB
LP3965EMPX-ADJ/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBRB
LP3965ES-1.8
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3965ES
-1.8
LP3965ES-1.8/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-1.8
LP3965ES-2.5
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3965ES
-2.5
LP3965ES-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-2.5
LP3965ES-3.3
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3965ES
-3.3
LP3965ES-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-3.3
LP3965ES-ADJ
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3965ES
-ADJ
LP3965ES-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-ADJ
LP3965ESX-1.8/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-1.8
LP3965ESX-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-2.5
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
8-Oct-2015
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP3965ESX-3.3
NRND
DDPAK/
TO-263
KTT
5
500
TBD
Call TI
Call TI
-40 to 125
LP3965ES
-3.3
LP3965ESX-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-3.3
LP3965ESX-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3965ES
-ADJ
LP3965ET-1.8/NOPB
ACTIVE
TO-220
NDH
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LP3965ET
-1.8
LP3965ET-3.3/LB04
NRND
TO-220
NEB
5
45
TBD
Call TI
Call TI
LP3965ET-3.3/NOPB
ACTIVE
TO-220
NDH
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LP3965ET
-3.3
LP3965ET-ADJ
NRND
TO-220
NDH
5
45
TBD
Call TI
Call TI
-40 to 125
LP3965ET
-ADJ
LP3965ET-ADJ/NOPB
ACTIVE
TO-220
NDH
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LP3965ET
-ADJ
LP3965ET
-3.3
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP3962EMP-1.8
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3962EMP-1.8/NOPB
SOT-223
NDC
5
1000
330.0
LP3962EMP-2.5
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
16.4
7.0
7.5
2.2
12.0
16.0
LP3962EMP-2.5/NOPB
SOT-223
NDC
5
1000
Q3
330.0
16.4
7.0
7.5
2.2
12.0
16.0
LP3962EMP-3.3
SOT-223
NDC
5
Q3
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3962EMP-3.3/NOPB
SOT-223
NDC
LP3962EMPX-2.5/NOPB SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3962ESX-1.8/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3962ESX-2.5/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3962ESX-3.3
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3962ESX-3.3/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3962ESX-5.0/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3965EMP-1.8/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3965EMP-2.5
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP3965EMP-2.5/NOPB
SOT-223
NDC
5
1000
330.0
16.4
LP3965EMP-3.3
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
7.0
7.5
2.2
12.0
16.0
Q3
LP3965EMP-3.3/NOPB
SOT-223
NDC
5
1000
330.0
LP3965EMP-ADJ
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
16.4
7.0
7.5
2.2
12.0
16.0
LP3965EMP-ADJ/NOPB SOT-223
NDC
5
1000
Q3
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3965EMPX-ADJ/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3965ESX-1.8/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3965ESX-2.5/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3965ESX-3.3
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3965ESX-3.3/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3965ESX-ADJ/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3962EMP-1.8
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3962EMP-1.8/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3962EMP-2.5
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3962EMP-2.5/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3962EMP-3.3
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3962EMP-3.3/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3962EMPX-2.5/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP3962ESX-1.8/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3962ESX-2.5/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3962ESX-3.3
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3962ESX-3.3/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3962ESX-5.0/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3965EMP-1.8/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3965EMP-2.5
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3965EMP-2.5/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3965EMP-3.3
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3965EMP-3.3/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3965EMP-ADJ
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3965EMP-ADJ/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3965EMPX-ADJ/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP3965ESX-1.8/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3965ESX-2.5/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3965ESX-3.3
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3965ESX-3.3/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3965ESX-ADJ/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
Pack Materials-Page 3
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
NDC0005A
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
MECHANICAL DATA
NEB0005B
www.ti.com
MECHANICAL DATA
NEB0005F
www.ti.com
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