AMIC LP62S1024BU-55LLT 128k x 8 bit low voltage cmos sram Datasheet

LP62S1024B-T Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Document Title
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No.
History
Issue Date
Remark
0.0
Initial issue
February 19, 2002
Preliminary
0.1
Add 32L Pb-Free TSSOP package type
October 2, 2002
PRELIMINARY
(October, 2002, Version 0.1)
AMIC Technology, Corp.
LP62S1024B-T Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Features
General Description
n Power supply range: 2.7V to 3.6V
n Access times: 55/70 ns (max.)
n Current:
Very low power version: Operating: 30mA(max.)
Standby: 5uA (max.)
n Full static operation, no clock or refreshing required
n All inputs and outputs are directly TTL-compatible
n Common I/O using three-state output
n Output enable and two chip enable inputs for easy
application
n Data retention voltage: 2V (min.)
n Available in 32-pin SOP, TSOP, TSSOP (8 X 13.4mm)
forward type and 36-pin CSP packages
The LP62S1024B-T is a low operating current 1,048,576bit static random access memory organized as 131,072
words by 8 bits and operates on a low power voltage: 2.7V
to 3.6V. It is built using AMIC's high performance CMOS
process.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for POWER-DOWN
and device enable and an output enable input is included
for easy interfacing.
Data retention is guaranteed at a power supply voltage as
low as 2V.
Product Family
Product Family
Operating
Temperature
VCC
Range
Power Dissipation
Speed
Data Retention
(ICCDR, Typ.)
Standby
(ISB1, Typ.)
Operating
(ICC2, Typ.)
Package
Type
32L SOP
LP62S1024B
-25°C ~ +85°C
2.7V~3.6V
55ns / 70ns
0.05µA
0.08µA
1.5mA
32L TSOP
32L TSSOP
36B µBGA
1. Typical values are measured at VCC = 3.0V, TA = 25°C and not 100% tested.
2. Data retention current VCC = 2.0V.
PRELIMINARY
(October, 2002, Version 0.1)
1
AMIC Technology, Corp.
LP62S1024B-T Series
Pin Configurations
n SOP
n TSOP/TSSOP
n CSP (Chip Size Package)
36-pin Top View
32
VCC
2
31
A15
A14
3
30
CE2
A12
4
29
WE
A7
5
28
A13
A6
6
27
A8
A5
7
26
A9
A4
8
A3
9
A2
10
A1
11
25
A11
24
OE
23
A10
22
CE1
A0
12
21
I/O8
I/O1
13
20
I/O7
I/O2
14
19
I/O6
I/O3
15
18
I/O5
GND
16
17
I/O4
16
1
LP62S1024BV-T
(LP62S1024BX-T)
1
LP62S1024BM-T
NC
A16
1
2
3
4
5
6
A
A0
A1
CE2
A3
A6
A8
B
I/O5
A2
WE
A4
A7
I/O1
C
I/O6
NC
A5
D
GND
VCC
E
VCC
GND
I/O2
F
I/O7
NC
NC
G
I/O8
OE
CE1
A16
A15
I/O3
I/O4
H
A9
A10
A11
A12
A13
A14
32
17
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pin
Name
A11
A9
A8
A13
WE
CE2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
Pin No.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Pin
Name
A3
A2
A1
A0
I/O 1
I/O 2
I/O 3
GND
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
CE1
A10
OE
Block Diagram
A0
VCC
GND
ROW
512 X 2048
DECODER
MEMORY ARRAY
INPUT DATA
CIRCUIT
COLUMN I/O
A14
A15
A16
I/O1
I/O8
CE2
CE1
OE
WE
PRELIMINARY
CONTROL
CIRCUIT
(October, 2002, Version 0.1)
2
AMIC Technology, Corp.
LP62S1024B-T Series
Pin Descriptions - SOP
Pin No.
Symbol
1
NC
2 - 12, 23,
25 - 28, 31
Pin Description – TSOP/TSSOP
Description
Pin No.
Symbol
Description
No Connection
1 - 4, 7,
10 - 20, 31
A0 - A16
A0 - A16
Address Inputs
5
WE
Write Enable
13 - 15,
17 - 21
I/O1 - I/O8
Data Input/Outputs
6
CE2
Chip Enable
16
GND
Ground
8
VCC
Power Supply
22
Chip Enable
9
NC
No Connection
CE1
24
OE
Output Enable
21 - 23,
25 - 29
I/O1 - I/O8
29
WE
Write Enable
24
GND
Ground
30
CE2
Chip Enable
30
CE1
Chip Enable
32
VCC
Power Supply
32
OE
Output Enable
Address Inputs
Data Input/Outputs
Pin Description - CSP
Symbol
A0 - A16
Description
Address Inputs
Symbol
Description
NC
No Connection
WE
Write Enable
OE
Output Enable
VCC
Power Supply
CE1
Chip Enable
GND
Ground
CE2
Chip Enable
--
PRELIMINARY
(October, 2002, Version 0.1)
I/O1 - I/O8
Data Input/Output
--
3
AMIC Technology, Corp.
LP62S1024B-T Series
Recommended DC Operating Conditions
(TA = -25°C to +85°C)
Symbol
Parameter
VCC
Supply Voltage
GND
Ground
Min.
Typ.
Max.
Unit
2.7
3.0
3.6
V
0
0
0
V
VIH
Input High Voltage
2.2
-
VCC + 0.3
V
VIL
Input Low Voltage
-0.3
-
+0.6
V
CL
Output Load
-
-
30
pF
TTL
Output Load
-
-
1
-
Absolute Maximum Ratings*
*Comments
VCC to GND .............................................. -0.5V to +4.6V
IN, IN/OUT Volt to GND .....................-0.5V to VCC +0.5V
Operating Temperature, Topr ................... -25°C to +85°C
Storage Temperature, Tstg..................... -55°C to +125°C
Temperature Under Bias, Tbias................ -10°C to +85°C
Power Dissipation, PT ...............................................0.7W
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
Symbol
(TA = -25°C to +85°C, VCC = 2.7V to 3.6V, GND = 0V)
Parameter
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC
Active Power Supply
Current
ICC1
LP62S1024B-55LLT/70LLT
Unit
Min.
Max.
-
1
µA
VIN = GND to VCC
-
1
µA
CE1 = VIH or CE2 = VIL
or OE = VIH or WE = VIL
VI/O = GND to VCC
-
3
mA
CE1 = VIL, CE2 = VIH
II/O = 0mA
-
30
mA
Min. Cycle, Duty = 100%
CE1 = VIL, CE2 = VIH
II/O = 0mA
-
3
mA
CE1 = VIL, CE2 = VIH
VIH = VCC, VIL = 0V
f = 1 MHZ, II/O = 0mA
Dynamic Operating
Current
ICC2
PRELIMINARY
(October, 2002, Version 0.1)
Conditions
4
AMIC Technology, Corp.
LP62S1024B-T Series
DC Electrical Characteristics (continued)
Symbol
LP62S1024B-55LLT/70LLT
Parameter
Min.
Max.
-
0.5
ISB
Unit
Conditions
mA
VCC ≤ 3.3V
CE1 = VIH or CE2 =VIL
-
5
µA
VCC ≤ 3.3V
CE1 ≥ VCC - 0.2V or
CE2 ≤ 0.2V
VIN ≥ 0V
Standby Power Supply Current
ISB1
VOL
Output Low Voltage
-
0.4
V
IOL = 2.1mA
VOH
Output High Voltage
2.2
-
V
IOH = -1.0mA
Truth Table
CE1
CE2
OE
WE
I/O Operation
H
X
X
X
High Z
ISB, ISB1
X
L
X
X
High Z
ISB, ISB2
Output Disable
L
H
H
H
High Z
ICC, ICC1, ICC2
Read
L
H
L
H
DOUT
ICC, ICC1, ICC2
Write
L
H
X
L
DIN
ICC, ICC1, ICC2
Min.
Max.
Unit
Mode
Standby
Supply Current
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
Parameter
Conditions
CIN*
Input Capacitance
6
pF
VIN = 0V
CI/O*
Input/Output Capacitance
8
pF
VI/O = 0V
* These parameters are sampled and not 100% tested.
PRELIMINARY
(October, 2002, Version 0.1)
5
AMIC Technology, Corp.
LP62S1024B-T Series
AC Characteristics
Symbol
(TA = -25°C to +85°C, VCC = 2.7V to 3.6V)
LP62S1024B-55LLT
Parameter
LP62S1024B-70LLT
Unit
Min.
Max.
Min.
Max.
55
-
70
-
ns
-
55
-
70
ns
CE1
-
55
-
70
ns
CE2
-
55
-
70
ns
-
30
-
35
ns
CE1
10
-
10
-
ns
CE2
10
-
10
-
ns
5
-
5
-
ns
CE1
0
20
0
25
ns
CE2
0
20
0
25
ns
Read Cycle
tRC
Read Cycle Time
tAA
Address Access Time
tACE1
Chip Enable Access Time
tACE2
tOE
tCLZ1
Output Enable to Output Valid
Chip Enable to Output in Low Z
tCLZ2
tOLZ
Output Enable to Output in Low Z
tCHZ1
Chip Disable to Output in High Z
tCHZ2
tOHZ
Output Disable to Output in High Z
0
20
0
25
ns
tOH
Output Hold from Address Change
5
-
10
-
ns
tWC
Write Cycle Time
55
-
70
-
ns
tCW
Chip Enable to End of Write
50
-
60
-
ns
tAS
Address Setup Time
0
-
0
-
ns
tAW
Address Valid to End of Write
50
-
60
-
ns
tWP
Write Pulse Width
40
-
50
-
ns
tWR
Write Recovery Time
0
-
0
-
ns
tWHZ
Write to Output in High Z
0
25
0
25
ns
tDW
Data to Write Time Overlap
25
-
30
-
ns
tDH
Data Hold from Write Time
0
-
0
-
ns
tOW
Output Active from End of Write
5
-
5
-
ns
Write Cycle
Notes: tCHZ1, tCHZ2, tOHZ, and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
PRELIMINARY
(October, 2002, Version 0.1)
6
AMIC Technology, Corp.
LP62S1024B-T Series
Timing Waveforms
(1, 2, 4)
Read Cycle 1
tRC
Address
tAA
tOH
tOH
DOUT
Read Cycle 2
(1, 3, 4, 6)
CE1
tACE1
tCLZ15
tCHZ15
DOUT
Read Cycle 3
(1, 4, 7, 8)
CE2
tACE2
tCHZ25
tCLZ25
DOUT
PRELIMINARY
(October, 2002, Version 0.1)
7
AMIC Technology, Corp.
LP62S1024B-T Series
Timing Waveforms (continued)
Read Cycle 4
(1)
tRC
Address
tAA
OE
tOE
tOH
tOLZ5
CE1
tACE1
tCHZ15
tCLZ15
CE2
tACE2
tOHZ 5
tCHZ25
tCLZ25
DOUT
Notes: 1.
2.
3.
4.
5.
6.
7.
8.
WE is high for Read Cycle.
Device is continuously enabled CE1 = VIL and CE2 = VIH.
Address valid prior to or coincident with CE1 transition low.
OE = VIL.
Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
CE2 is high.
CE1 is low.
Address valid prior to or coincident with CE2 transition high.
PRELIMINARY
(October, 2002, Version 0.1)
8
AMIC Technology, Corp.
LP62S1024B-T Series
Timing Waveforms (continued)
(6)
Write Cycle 1
(Write Enable Controlled)
tWC
Address
tAW
tWR3
tCW
CE1
(4)
CE2
(4)
5
tAS1
tWP2
WE
tDW
tDH
DIN
tWHZ
tOW
DOUT
PRELIMINARY
(October, 2002, Version 0.1)
9
AMIC Technology, Corp.
LP62S1024B-T Series
Timing Waveforms (continued)
Write Cycle 2
(Chip Enable Controlled)
tWC
Address
tWR3
tAW
tCW5
CE1
CE2
tAS1
(4)
(4)
tCW5
tWP2
WE
tDW
tDH
DIN
tWHZ7
DOUT
Notes: 1.
2.
3.
4.
tAS is measured from the address valid to the beginning of Write.
A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE .
tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = VIL)
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
PRELIMINARY
(October, 2002, Version 0.1)
10
AMIC Technology, Corp.
LP62S1024B-T Series
AC Test Conditions
Input Pulse Levels
0.4V to 2.4V
Input Rise and Fall Time
5 ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Figures 1 and 2
TTL
TTL
CL
CL
5pF
30pF
* Including scope and jig.
* Including scope and jig.
Figure 1. Output Load
Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW
Data Retention Characteristics (TA = -25°C to 85°C)
Symbol
Parameter
Min.
Max.
Unit
2.0
3.6
V
CE1 ≥ VCC - 0.2V
VDR2
2.0
3.6
V
CE2 ≤ 0.2V,
ICCDR1
-
3*
µA
VCC = 2V,
CE1 ≥ VCC - 0.2V,
VIN ≥ 0V
-
3*
µA
VCC = 2V,
CE2 ≤ 0.2V,
VIN ≥ 0V
Chip Disable to Data Retention Time
0
-
ns
See Retention Waveform
Operation Recovery Time
5
-
ms
VDR1
Conditions
VCC for Data Retention
Data Retention Current
ICCDR2
tCDR
tR
*
LP62S1024B-55LLT/70LLT
PRELIMINARY
ICCDR: max.
(October, 2002, Version 0.1)
3µA at TA = 0°C to + 40°C
11
AMIC Technology, Corp.
LP62S1024B-T Series
Low VCC Data Retention Waveform (1) ( CE1 Controlled)
DATA RETENTION MODE
VCC
3.0V
3.0V
tCDR
CE1
tR
VDR ≥ 2V
VIH
VIH
CE1 ≥ VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
DATA RETENTION MODE
VCC
3.0V
tCDR
CE2
3.0V
tR
VDR ≥ 2V
VIL
VIL
CE2 ≤ 0.2V
PRELIMINARY
(October, 2002, Version 0.1)
12
AMIC Technology, Corp.
LP62S1024B-T Series
Ordering Information
Part No.
Access Time (ns)
Operating Current
Max. (mA)
Standby Current
Max. (µ
µA)
LP62S1024BM-55LLT
Package
32L SOP
LP62S1024BV-55LLT
32L TSOP
55
30
5
LP62S1024BX-55LLT
32L TSSOP
LP62S1024BX-55LLTF
32L Pb-Free TSSOP
LP62S1024BU-55LLT
36L CSP
LP62S1024BM-70LLT
32L SOP
LP62S1024BV-70LLT
32L TSOP
70
30
5
LP62S1024BX-70LLT
32L TSSOP
LP62S1024BX-70LLTF
32L Pb-Free TSSOP
LP62S1024BU-70LLT
36L CSP
PRELIMINARY
(October, 2002, Version 0.1)
13
AMIC Technology, Corp.
LP62S1024B-T Series
Package Information
SOP (W.B.) 32L Outline Dimensions
32
unit: inches/mm
17
e1
E
HE
~
L
1
b
16
Detail F
e1
D
Seating Plane
LE
A1
e
s
A
A2
c
D
y
See Detail F
Symbol
Dimensions in inches
Dimensions in mm
A
0.118 Max.
3.00 Max.
A1
0.004 Min.
0.10 Min.
A2
0.106±0.005
2.69±0.13
b
0.016 +0.004
0.41 +0.10
-0.002
-0.05
0.008 +0.004
0.20 +0.10
c
-0.002
D
-0.05
0.805 Typ. (0.820 Max.)
20.45 Typ. (20.83 Max.)
E
e
0.445±0.010
11.30±0.25
0.050 ±0.006
1.27±0.15
e1
0.525 NOM.
13.34 NOM.
HE
0.556±0.010
14.12±0.25
L
0.031±0.008
0.79±0.20
LE
0.055±0.008
1.40±0.20
S
0.044 Max.
1.12 Max.
y
0.004 Max.
0.10 Max.
θ
0° ~ 10°
0° ~ 10°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.
4. Dimension S includes end flash.
PRELIMINARY
(October, 2002, Version 0.1)
14
AMIC Technology, Corp.
LP62S1024B-T Series
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
e
D
A
c
E
A2
12.0°
A1
GAUGE PLANE
0.25
BSC
θ
L
LE
HD
Detail "A"
D
Detail "A"
y
S
b
Symbol
Dimensions in inches
Dimensions in mm
A
0.047 Max.
1.20 Max.
A1
0.004±0.002
0.10±0.05
A2
0.039±0.002
1.00±0.05
b
0.008±0.001
0.20±0.03
c
0.006±0.001
0.15±0.02
D
0.724±0.004
18.40±0.10
E
0.315±0.004
8.00±0.10
e
0.020 TYP.
0.50 TYP.
HD
0.787±0.007
20.00±0.20
L
0.020±0.004
0.50±0.10
LE
0.031 TYP.
0.80 TYP.
S
0.0167 TYP.
0.425 TYP.
Y
0.004 Max.
0.10 Max.
θ
0° ~ 6°
0° ~ 6°
0.10(0.004)
M
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.
4. Dimension S includes end flash.
PRELIMINARY
(October, 2002, Version 0.1)
15
AMIC Technology, Corp.
LP62S1024B-T Series
Package Information
TSSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
e
unit: inches/mm
A
c
E
A2
12.0°
A1
GAUGE PLANE
0.25
BSC
θ
L
LE
D1
D
Detail "A"
D
Detail "A"
0.10MM
S
b
SEATING PLANE
Symbol
Dimensions in inches
Dimensions in mm
A
0.049 Max.
1.25 Max.
A1
0.002 Min.
0.05 Min.
A2
0.039±0.002
1.00±0.05
b
0.008±0.001
0.20±0.03
c
0.006±0.0003
0.15±0.008
E
0.315±0.004
8.00±0.10
e
0.020 TYP.
0.50 TYP.
D
0.528±0.008
13.40±0.20
D1
0.465±0.004
11.80±0.10
L
0.02±0.008
0.50±0.20
LE
0.0266 Min.
0.675 Min.
S
0.0109 TYP.
0.278 TYP.
y
0.004 Max.
0.10 Max.
θ
0° ~ 6°
0° ~ 6°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.
4. Dimension S includes end flash.
PRELIMINARY
(October, 2002, Version 0.1)
16
AMIC Technology, Corp.
LP62S1024B-T Series
Package Information
36LD CSP (6 x 8 mm) Outline Dimensions
unit: mm
BOTTOM VIEW
TOP VIEW
Ball#A1 CORNER
0.10 S C
0.25 S C A B
Ball*A1 CORNER
b (36X)
6 5 4 3 2 1
1 2 3 4 5 6
A
B
A
C
D
E
F
G
H
C
D
E
F
G
H
E
E1
e
B
B
A
0.10 C
SIDE VIEW
D
0.20(4X)
A2
SEATING PLANE
A1
(0.36)
C
Symbol
A
A1
A2
D
E
D1
E1
e
b
A
// 0.25 C
e
D1
Dimensions in mm
MIN.
NOM.
MAX.
1.00
0.16
0.48
5.80
7.80
------0.25
1.10
0.21
0.53
6.00
8.00
3.75
5.25
0.75
0.30
1.20
0.26
0.58
6.20
8.20
------0.35
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
4. THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF
THE SOLDER BALL AND THE BODY EDGE.
PRELIMINARY
(October, 2002, Version 0.1)
17
AMIC Technology, Corp.
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