LP6836 MEDIUM POWER PHEMT • DRAIN BOND PAD FEATURES ♦ 25 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency SOURCE BOND PAD (2x) GATE BOND PAD • DIE SIZE: 14.2X13.0 mils (360x330 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 1.9X1.9 mils (50x50 µm) DESCRIPTION AND APPLICATIONS The LP6836 is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs) Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an Electron-Beam directwrite 0.25 µm by 360 µm Schottky barrier gate. The recessed “mushroom” gate structure minimizes parasitic gate-source and gate resistances. The epitaxial structure and processing have been optimized for high dynamic range. The LP6836 also features Si3 N4 passivation and is available in P70 and SOT343 package types. Typical applications include high dynamic range driver stages for commercial applications including wireless infrastructure systems and broad bandwidth amplifiers. • ELECTRICAL SPECIFICATIONS @ TAmbient = 25°°C Parameter Symbol Test Conditions Min Typ Max Units Saturated Drain-Source Current IDSS VDS = 2 V; VGS = 0 V 80 115 125 mA Power at 1-dB Compression P-1dB VDS = 8 V; IDS = 50% IDSS 24 25 dBm Power Gain at 1-dB Compression G-1dB VDS = 8 V; IDS = 50% IDSS 8.5 9.5 dB Power-Added Efficiency PAE VDS = 8 V; IDS = 50% IDSS 55 % Maximum Drain-Source Current IMAX VDS = 2 V; VGS = 1 V 190 mA Transconductance GM VDS = 2 V; VGS = 0 V 100 mS Gate-Source Leakage Current IGSO VGS = -5 V Pinch-Off Voltage VP VDS = 2 V; IDS = 2 mA Gate-Source Breakdown Voltage Magnitude |VBDGS| Gate-Drain Breakdown Voltage Magnitude |VBDGD| Thermal Resistivity ΘJC 75 1 10 µA -0.25 -1.2 -2.0 V IGS = 2 mA -11 -15 V IGD = 2 mA -12 -16 V 100 °C/W frequency=18 GHz Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 1/18/01 Email: [email protected] LP6836 MEDIUM POWER PHEMT • ABSOLUTE MAXIMUM RATINGS Notes: • • • Parameter Symbol Test Conditions Drain-Source Voltage VDS Gate-Source Voltage Min Max Units TAmbient = 22 ± 3 °C 10 V VGS TAmbient = 22 ± 3 °C -4 V Drain-Source Current IDS TAmbient = 22 ± 3 °C 2xIDSS mA Gate Current IG TAmbient = 22 ± 3 °C 18 mA RF Input Power PIN TAmbient = 22 ± 3 °C 180 mW Channel Operating Temperature TCH TAmbient = 22 ± 3 °C 175 ºC Storage Temperature TSTG — 175 ºC Total Power Dissipation PTOT TAmbient = 22 ± 3 °C 1.4 W -65 Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power Absolute Maximum Power Dissipation to be de-rated as follows above 25°C: PTOT= 1.4W – (0.0093W/°C) x THS where THS = heatsink or ambient temperature. • HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. • ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290°C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260°C. • APPLICATIONS NOTES & DESIGN DATA Applications Notes are available from your local Filtronic Sales Representative or directly from the factory. Complete design data, including S-parameters, noise data, and large-signal models are available on the Filtronic web site. All information and specifications are subject to change without notice. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 1/18/01 Email: [email protected]