LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts LSEFG9553/TR1 DATA SHEET DOC. NO REV DATE : : QW0905-L SEFG9553/TR1 D : 21 - Dec. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSEFG9553/TR1 Page 1/8 Package Dimensions 3.5 3.2 0.7±0.05 1.95 4 3 2.6 0.7±0.05 2.8 0.7±0.05 1 2 2.2 0.7±0.05 0.6 1.95 1.05 - 4 +1 G 1.5 0.9 SEF 3 + 2 - 0.9 Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0 2.0 0.23 1.55 1.75 5.5 12.0±0.3 4.06 9.3 Polarity 4.0 Note : The tolerances unless mentioned is ±0.2mm,Unit=mm. 3.12 2.24 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LSEFG9553/TR1 Reel Dimensions 16.0±1.0 ψ178±2.0 14.2± 1.0 74.0±1.5 Part No. Description Quantity/Reel LSEFG9553/TR1 12.0mm tape,7"reel 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. : LSEFG9553/TR1 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SEF G Forward Current IF 50 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 120 mA Power Dissipation PD 120 100 mW Reverse Current @5V Ir μA 10 V Electrostatic Discharge ESD Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ 2000 ---- Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted AlGaInP Peak Dominant wave wave length length λPnm λDnm Spectral halfwidth △λ nm Lens Orange Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2θ 1/2 (deg) Min. Max. Min. Typ. ---- 605 17 1.7 2.6 200 500 120 565 ---- 30 1.7 2.6 12.5 32 120 Water Clear LSEFG9553/TR1 GaP Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSEFG9553/TR1 Page4/8 Typical Electro-Optical Characteristics Curve SEF CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 1.5 2.0 2.5 3.0 10 1.0 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 1000 Forward Current(mA) Forward Voltage(V) -40 100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Fig.6 Directivity Radiation 1.0 0° -30° 0.5 30° -60° 60° 0.0 500 550 600 Wavelength (nm) 650 100% 75% 50% 25% 0 25% 50% 75% 100% 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8 PART NO.LSEFG9553/TR1 Typical Electro-Optical Characteristics Curve G CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 3.0 2.0 4.0 1.0 5.0 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directivity Radiation Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 10 0° 1.0 -30° 30° -60° 0.5 100% 75% 50% 0.0 500 550 600 Wavelength (nm) 650 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSEFG9553/TR1 Page 6/8 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245± 5℃ within 5 sec Preheat 120 ~ 150 ℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (℃) 240 Rising +5 ℃/sec Cooling -5℃/sec Preheat 150 120 60 ~ 120 sec 3-2 PB-Free Reflow Solder Time 5sec 1~5°C/sec Preheat 180~200 ° C 1~5° C/sec 260°C MaX. 10sec.Max Above 220 °C 60 sec.Max. 120 sec.Max. Note: 1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSEFG9553/TR1 Page 7/8 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO.LSEFG9553/TR1 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta=65 ℃±5℃ 3.RH=90 %~95% 4.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 Endurance Test 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃±5 ℃& -40 ℃±5 ℃ (10min) (10min) 3.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell Time= 10 ±1sec. MIL-STD-202F: 210A MIL-STD-750D: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Immersion rate 25 ±2.5mm/sec 4.Immersion rate 25 ±2.5mm/sec 5.Coverage ≧95% of the dipped surface MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 1.105 ℃ ~ 25℃ ~ 55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Ramp-up rate(183 ℃ to Peak) +3 ℃ second max Temp. maintain at 125( ±25) ℃ 120 seconds max Temp. maintain above 183 ℃ 60-150 seconds Peak temperature range 235 ℃+5-0 ℃ Time within 5 ℃ of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate +6 ℃/second max MIL-STD-750D:2031.2 J-STD-020 Thermal Shock Test Environmental Test Temperature Cycling Solderability Test