LT1009M www.ti.com ..................................................................................................................................................................................................... SLVS925 – APRIL 2009 2.5-V INTEGRATED REFERENCE CIRCUIT FEATURES 1 • • • • • • Excellent Temperature Stability Initial Tolerance: 0.2% Max Dynamic Impedance: 0.6 Ω Typical Wide Operating Current Range Directly Interchangeable With LM136 • (1) Needs No Adjustment for Minimum Temperature Coefficient Available in Military (–55°C/125°C) Temperature Range (1) Custom temperature ranges available DESCRIPTION/ORDERING INFORMATION The LT1009 reference circuit is a precision-trimmed 2.5-V shunt regulator featuring low dynamic impedance and a wide operating current range. The reference tolerance is achieved by on-chip trimming, which minimizes the initial voltage tolerance and the temperature coefficient, αVZ. Although the LT1009 needs no adjustments, a third terminal (ADJ) allows the reference voltage to be adjusted ±5% to eliminate system errors. In many applications, the LT1009 can be used as a terminal-for-terminal replacement for the LM136-2.5, which eliminates the external trim network. The LT1009 uses include 5-V system references, 8-bit analog-to-digital converter (ADC) and digital-to-analog converter (DAC) references, and power-supply monitors. The device also can be used in applications such as digital voltmeters and current-loop measurement and control systems. The LT1009 is characterized for operation from –55°C to 125°C. SYMBOL ANODE CATHODE ADJ ORDERING INFORMATION (1) TA PACKAGE(BARE DIE) (2) ORDERABLE PART NUMBER –55°C to 125°C CHIPTRAY LT1009MKGD1 (1) (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BOND PAD METALIZATION COMPOSITION 15 Mils Silicon with backgrind AlCu/TiW 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated LT1009M SLVS925 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com Origin a c b d Bond Pad Coordinates in Microns - Rev A DISCRIPTION PAD NUMBER a b c d ANODE 1 127.000 127.000 243.840 243.840 ANODE 2 335.280 127.000 439.420 231.140 ADJ 3 716.280 130.810 833.120 243.840 Do not connect 4 1073.150 133.350 1169.670 229.870 Do not connect 5 1217.930 133.350 1314.450 229.870 Do not connect 6 1075.690 316.230 1172.210 412.750 Do not connect 7 1197.610 420.370 1294.130 516.890 Do not connect 8 1073.150 567.690 1169.670 664.210 Do not connect 9 1200.150 890.270 1296.670 986.790 Do not connect 10 1116.330 1032.510 1212.850 1129.030 CATHODE 11 902.970 929.640 1004.570 1066.800 CATHODE 12 703.580 1115.060 820.420 1229.360 ANODE ANODE 48.819 mils CATHODE ADJ 2 - - CATHODE 52.598 mils Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): LT1009M LT1009M www.ti.com ..................................................................................................................................................................................................... SLVS925 – APRIL 2009 SCHEMATIC CATHODE Q14 Q11 24 kΩ 24 kΩ 6.6 kΩ Q8 20 pF Q7 30 pF Q10 10 kΩ 500 Ω Q2 Q9 Q4 30 kΩ ADJ Q1 6.6 kΩ Q6 Q3 Q12 Q5 720 Ω Q13 ANODE NOTE: All component values shown are nominal. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT IR Reverse current 20 mA IF Forward current 10 mA TJ Operating virtual junction temperature (2) 150 °C Tstg Storage temperature range 150 °C (1) (2) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. RECOMMENDED OPERATING CONDITIONS TA Operating free-air temperature range MIN MAX UNIT –55 125 °C Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): LT1009M 3 LT1009M SLVS925 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS at specified free-air temperature PARAMETER TEST CONDITIONS VZ Reference voltage IZ = 1 mA VF Forward voltage IF = 2 mA TYP MAX 25°C 2.49 2.5 2.51 Full range 2.46 2.535 25°C 0.4 1 Change in reference voltage with temperature αVZ Average temperature coefficient of reference voltage (1) IZ = 1 mA, VADJ = open ΔVZ Change in reference voltage with current IZ = 400 µA to 10 mA ΔVZ/Δt Long-term change in reference voltage IZ = 1 mA ZZ Reference impedance IZ = 1 mA UNIT V V 125 25°C IZ = 1 mA, VADJ = 0.6 V to VZ – 0.6 V ΔVZ(temp) LT1009M MIN IZ = 1 mA, VADJ = GND to VZ Adjustment range (1) TA mV 45 Full range 15 mV ppm/ °C Full range 20 35 25°C 6 10 Full range 12 25°C 20 25°C 0.6 Full range mV ppm/ khr 1.6 1.8 Ω The deviation parameter VZ(dev) is defined as the difference between the maximum and minimum values obtained over the recommended operating temperature range, measured at IZ = 1 mA. The average full-range temperature coefficient of the reference voltage (αVZ) is defined as: Maximum VZ VZ(dev) ppm = |aVZ| °C VZ at 25°C × 10 VZ(dev) at IZ = 1 mA 6 DTA Minimum VZ DTA αVZ can be positive or negative, depending upon whether the minimum VZ or maximum VZ, respectively, occurs at the lower temperature. 4 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): LT1009M LT1009M www.ti.com ..................................................................................................................................................................................................... SLVS925 – APRIL 2009 TYPICAL CHARACTERISTICS Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. REFERENCE VOLTAGE vs FREE-AIR TEMPERATURE CHANGE IN REFERENCE VOLTAGE vs REFERENCE CURRENT 2.53 5 ∆V Z − Change in Reference Voltage − mV Iz = 1 mA V Z − Reference Voltage − V 2.52 2.51 2.5 2.49 2.48 2.47 −50 4 3 2 1 0 −25 0 25 50 75 100 TA − Free-Air Temperature − °C 125 0 4 8 12 16 IZ − Reference Current − mA Figure 1. Figure 2. REVERSE CURRENT vs REVERSE VOLTAGE FORWARD VOLTAGE vs FORWARD CURRENT 20 1.2 10−1 TJ = 25°C 1 V F − Forward Voltage − V I R − Reverse Current − A 10−2 10−3 TJ = 125°C 10−4 TJ = −55°C 0.6 1 1.4 1.8 2.2 VR − Reverse Voltage − V 0.6 0.4 0.2 TJ = 25°C 10−5 0.8 2.6 0 0.001 Figure 3. 0.01 0.1 1 IF − Forward Current − mA 10 Figure 4. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): LT1009M 5 LT1009M SLVS925 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) REFERENCE IMPEDANCE vs FREQUENCY NOISE VOLTAGE vs FREQUENCY 100 250 Iz = 1 mA TJ = 25°C 200 V n − Noise Voltage − nV/ Hz ZZ − Reference Impedance − Ω Iz = 1 mA TJ = −55°C to 125°C 10 1 0.1 10 100 1k 10k f − Frequency − Hz 150 100 50 10 100k 100 Figure 5. 1k f − Frequency − Hz Figure 6. 10k 100k TRANSIENT RESPONSE 3.5 3 Output Input and Output Voltages − V 2.5 2 1.5 1 0.5 5 kΩ Input 0 Output 8 Input 4 0 0 1 20 t − Time − µs Figure 7. 6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): LT1009M LT1009M www.ti.com ..................................................................................................................................................................................................... SLVS925 – APRIL 2009 APPLICATION INFORMATION 5 V to 35 V 3.6 kΩ Output 10-kΩ Trim (see Note A) LT1009 A. This does not affect temperature coefficient. It provides ±5% trim range. Figure 8. 2.5-V Reference 3.6 V to 40 V V+ LM334 R V− 62 Ω Output LT1009 10 kΩ Figure 9. Adjustable Reference With Wide Supply Range LT1084 VI 10 µF IN ADJ OUT VO 10 µF 1.2 kΩ 374 Ω LT1009 2 kΩ Figure 10. Power Regulator With Low Temperature Coefficient Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): LT1009M 7 LT1009M SLVS925 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com 5V 5.1 kΩ 5V 5.1 kΩ LT1009 10 kΩ 1% −5 V Output 9.76 kΩ 1% 500 Ω 5 kΩ −5 V Figure 11. Switchable ±1.25-V Bipolar Reference 1 µF 10 kΩ VI ≥ 6 V 1 kΩ − 10 kΩ 2.5 V 1 kΩ + + 100 kΩ LT1009 + LT1001C 20 µF 20 µF Figure 12. Low-Noise 2.5-V Buffered Reference 8 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): LT1009M PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2011 PACKAGING INFORMATION Orderable Device LT1009MKGD1 Status (1) Package Type Package Drawing ACTIVE XCEPT KGD Pins Package Qty 0 100 Eco Plan TBD (2) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) N / A for Pkg Type Add to cart (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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